formation by plasma treatment

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H01L21/02252

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02252formation by plasma treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for forming metal-insulator-metal capacitors
- Patent number 12,369,336
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Liang Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor structure with high aspect ratio
- Patent number 12,369,390
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor including a compositionally- graded gate diele...
- Patent number 12,369,354
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,362,170
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for radical and thermal processing of substrates
- Patent number 12,347,679
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Xinming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-oxidation layer to prevent dielectric loss from planarization...
- Patent number 12,341,019
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,336,272
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill structures with air gaps
- Patent number 12,324,199
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Yung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual pressure oxidation method for forming an oxide layer in a feature
- Patent number 12,272,531
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Christopher S. Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for in-situ chamber monitoring
- Patent number 12,252,779
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Xiangjin Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal oxidation for gate all around nanosheet I/O device
- Patent number 12,243,941
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Myungsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned inner spacer on gate-all-around structure and methods...
- Patent number 12,230,692
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsungyu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with etch stop layer for reducing RC...
- Patent number 12,218,241
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 12,217,936
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of processing substrate, met...
- Patent number 12,195,854
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Teruo Yoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device and substrate process...
- Patent number 12,191,140
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Yutaka Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,191,143
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate processing apparatus, and me...
- Patent number 12,165,848
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Kenichi Oyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device including isolation st...
- Patent number 12,154,821
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tuning threshold voltage through meta stable plasma treatment
- Patent number 12,148,620
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron nitride layer, apparatus including the same, and method of fa...
- Patent number 12,139,814
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- C30 - CRYSTAL GROWTH
Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,131,955
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,125,783
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor including a compositionally-graded gate dielec...
- Patent number 12,113,115
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor fabrication for memory applications
- Patent number 12,108,604
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Jaesoo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucking process
- Patent number 12,100,609
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS...
- Publication number 20250194203
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsungyu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE OXIDATION LAYER FOR METAL VOIDING REDUCTION
- Publication number 20250167086
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Man-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PATTERNING A SEMICONDUCTOR SUBSTRATE USING METALATE SAL...
- Publication number 20250157810
- Publication date May 15, 2025
- TOKYO ELECTRON LIMITED
- Paul Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Publication number 20250132197
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR TREATMENT OF HIGH-K MATERIALS TO REDUCE LEAKAGE CURRENT...
- Publication number 20250132147
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Jae Young PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
USE OF TIN THIN FILM FOR BONDING AND AS MASKING FILM
- Publication number 20250132158
- Publication date Apr 24, 2025
- University of South-Eastern Norway
- Avisek ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUC...
- Publication number 20250120150
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Baekwon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D DRAM WITH ENLARGE-LESS TRIM
- Publication number 20250120061
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chang Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BORON NITRIDE LAYER, APPARATUS INCLUDING THE SAME, AND METHOD OF FA...
- Publication number 20250066950
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Changseok LEE
- C30 - CRYSTAL GROWTH
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...
- Publication number 20250014892
- Publication date Jan 9, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Jianmin JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240395549
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNING THRESHOLD VOLTAGE THROUGH META STABLE PLASMA TREATMENT
- Publication number 20240387178
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379540
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MEOL CONTACT STRUCTURE
- Publication number 20240379768
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shumao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH MODIFIED SOURCE/DRAIN FEATURE AND METHOD...
- Publication number 20240372005
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240363408
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-GRADED GATE DIELEC...
- Publication number 20240363716
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND PLASMA PROCESSING METHOD
- Publication number 20240355616
- Publication date Oct 24, 2024
- Hitachi High-Tech Corporation
- Kiyohiko SATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structures For Semiconductor Devices
- Publication number 20240347393
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...
- Publication number 20240332071
- Publication date Oct 3, 2024
- Intel Corporation
- Alireza Narimannezhad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240282700
- Publication date Aug 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240258102
- Publication date Aug 1, 2024
- ASM IP HOLDING B.V.
- JiHye Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fill Structures With Air Gaps
- Publication number 20240250121
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Yung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
- Publication number 20240194478
- Publication date Jun 13, 2024
- TOKYO ELECTRON LIMITED
- Satohiko Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

formation by plasma treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for forming metal-insulator-metal capacitors

Method for forming semiconductor structure with high aspect ratio

Thin film transistor including a compositionally- graded gate diele...

Semiconductor device and method for forming the same

System and method for radical and thermal processing of substrates

Bottom-up fill dielectric materials for semiconductor structure fab...

Anti-oxidation layer to prevent dielectric loss from planarization...

Semiconductor device structure and methods of forming the same

Contact with a silicide region

Fill structures with air gaps

Dual pressure oxidation method for forming an oxide layer in a feature

Methods for in-situ chamber monitoring

Conformal oxidation for gate all around nanosheet I/O device

Self-aligned inner spacer on gate-all-around structure and methods...

Forming an oxide volume within a fin

Semiconductor device structure with etch stop layer for reducing RC...

DC bias in plasma process

Substrate processing apparatus, method of processing substrate, met...

Method for manufacturing semiconductor device and substrate process...

Semiconductor device and method for forming the same

Metal oxide composite as etch stop layer

Substrate processing method, substrate processing apparatus, and me...

Method of manufacturing semiconductor device including isolation st...

Tuning threshold voltage through meta stable plasma treatment

Boron nitride layer, apparatus including the same, and method of fa...

Gate structures for semiconductor devices

Interconnect structure and method for forming the same

Thin film transistor including a compositionally-graded gate dielec...

Vertical transistor fabrication for memory applications

Electrostatic chucking process

Patents Applicationslast 30 patents

SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS...

SURFACE OXIDATION LAYER FOR METAL VOIDING REDUCTION

METHODS FOR PATTERNING A SEMICONDUCTOR SUBSTRATE USING METALATE SAL...

METAL OXIDE COMPOSITE AS ETCH STOP LAYER

METHODS FOR TREATMENT OF HIGH-K MATERIALS TO REDUCE LEAKAGE CURRENT...

USE OF TIN THIN FILM FOR BONDING AND AS MASKING FILM

THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUC...

3D DRAM WITH ENLARGE-LESS TRIM

BORON NITRIDE LAYER, APPARATUS INCLUDING THE SAME, AND METHOD OF FA...

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

METHOD OF PATTERNING ELEMENTAL METALS

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

TUNING THRESHOLD VOLTAGE THROUGH META STABLE PLASMA TREATMENT

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

METHOD OF FORMING A MEOL CONTACT STRUCTURE

SEMICONDUCTOR DEVICES WITH MODIFIED SOURCE/DRAIN FEATURE AND METHOD...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-GRADED GATE DIELEC...

FILM FORMATION METHOD AND PLASMA PROCESSING METHOD

Gate Structures For Semiconductor Devices

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SUBSTRATE PROCESSING METHOD

Fill Structures With Air Gaps

APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS