formation by plasma treatment

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CPC
H01L21/02252

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02252formation by plasma treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate processing apparatus, and me...
- Patent number 12,165,848
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Kenichi Oyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device including isolation st...
- Patent number 12,154,821
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tuning threshold voltage through meta stable plasma treatment
- Patent number 12,148,620
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron nitride layer, apparatus including the same, and method of fa...
- Patent number 12,139,814
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- C30 - CRYSTAL GROWTH
Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,131,955
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,125,783
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor including a compositionally-graded gate dielec...
- Patent number 12,113,115
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor fabrication for memory applications
- Patent number 12,108,604
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Jaesoo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucking process
- Patent number 12,100,609
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,080,597
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with modified source/drain feature and method...
- Patent number 12,080,800
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,040,161
- Issue date Jul 16, 2024
- Kokusai Electric Corporation
- Yasutoshi Tsubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing high electron mobility transistors having...
- Patent number 12,015,075
- Issue date Jun 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for gate stack formation and etching
- Patent number 12,009,430
- Issue date Jun 11, 2024
- Tokyo Electron Limited
- Sergey Voronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment for adhesion improvement
- Patent number 12,009,200
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill structures with air gaps
- Patent number 11,961,884
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Yung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and manufacturing method therefor, and display de...
- Patent number 11,961,848
- Issue date Apr 16, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing thereof
- Patent number 11,956,961
- Issue date Apr 9, 2024
- Kioxia Corporation
- Shinichi Sotome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Steam oxidation initiation for high aspect ratio conformal radical...
- Patent number 11,948,791
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Christopher S. Olsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for manufacturing the same
- Patent number 11,917,827
- Issue date Feb 27, 2024
- Kioxia Corporation
- Naoki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,908,682
- Issue date Feb 20, 2024
- Kokusai Electric Corporation
- Hiroto Igawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, and recording medium
- Patent number 11,905,596
- Issue date Feb 20, 2024
- Kokusai Electric Corporation
- Teruo Yoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,894,446
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Yen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide layer on a doped substrate using nitridatio...
- Patent number 11,862,461
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 11,854,766
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-oxidation layer to prevent dielectric loss from planarization...
- Patent number 11,854,822
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a metal silicide contact to a silicon substrate
- Patent number 11,854,881
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Biao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing semiconductor memory
- Patent number 11,854,797
- Issue date Dec 26, 2023
- Changxin Memory Technologies, Inc.
- Haodong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for near surface work function engineering
- Patent number 11,837,473
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Taichou Papo Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240395549
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNING THRESHOLD VOLTAGE THROUGH META STABLE PLASMA TREATMENT
- Publication number 20240387178
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379540
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MEOL CONTACT STRUCTURE
- Publication number 20240379768
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shumao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH MODIFIED SOURCE/DRAIN FEATURE AND METHOD...
- Publication number 20240372005
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240363408
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-GRADED GATE DIELEC...
- Publication number 20240363716
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND PLASMA PROCESSING METHOD
- Publication number 20240355616
- Publication date Oct 24, 2024
- Hitachi High-Tech Corporation
- Kiyohiko SATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structures For Semiconductor Devices
- Publication number 20240347393
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...
- Publication number 20240332071
- Publication date Oct 3, 2024
- Intel Corporation
- Alireza Narimannezhad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240282700
- Publication date Aug 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240258102
- Publication date Aug 1, 2024
- ASM IP HOLDING B.V.
- JiHye Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fill Structures With Air Gaps
- Publication number 20240250121
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Yung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
- Publication number 20240194478
- Publication date Jun 13, 2024
- TOKYO ELECTRON LIMITED
- Satohiko Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall Inorganic Passivation for Dielectric Etching Via Surface M...
- Publication number 20240162043
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
- Publication number 20240158917
- Publication date May 16, 2024
- Kokusai Electric Corporation
- Teruo YOSHINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL ETCHING OF RUTHENIUM
- Publication number 20240153781
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Hisashi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR
- Publication number 20240153765
- Publication date May 9, 2024
- SCREEN Holdings Co., Ltd.
- Masaki INABA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SIN GAP FILL VIA NUCLEATION INHIBITION
- Publication number 20240145235
- Publication date May 2, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INSULATION FILM
- Publication number 20240112906
- Publication date Apr 4, 2024
- ABIT TECHNOLOGIES CO., LTD
- Kiyokazu NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-OXIDATION LAYER TO PREVENT DIELECTRIC LOSS FROM PLANARIZATION...
- Publication number 20240087906
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATES
- Publication number 20240087889
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Xinming ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240087947
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS
- Publication number 20240071746
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Yu-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC Bias in Plasma Process
- Publication number 20240071722
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS

formation by plasma treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal oxide composite as etch stop layer

Substrate processing method, substrate processing apparatus, and me...

Method of manufacturing semiconductor device including isolation st...

Tuning threshold voltage through meta stable plasma treatment

Boron nitride layer, apparatus including the same, and method of fa...

Gate structures for semiconductor devices

Interconnect structure and method for forming the same

Thin film transistor including a compositionally-graded gate dielec...

Vertical transistor fabrication for memory applications

Electrostatic chucking process

Semiconductor devices and methods of manufacture

Semiconductor devices with modified source/drain feature and method...

Method of manufacturing semiconductor device, substrate processing...

Methods of manufacturing high electron mobility transistors having...

Method for gate stack formation and etching

Treatment for adhesion improvement

Fill structures with air gaps

Display substrate and manufacturing method therefor, and display de...

Semiconductor memory device and method of manufacturing thereof

Steam oxidation initiation for high aspect ratio conformal radical...

Semiconductor memory device and method for manufacturing the same

Method of manufacturing semiconductor device, substrate processing...

Method of manufacturing semiconductor device, and recording medium

Method of manufacturing a semiconductor device

Method of forming oxide layer on a doped substrate using nitridatio...

DC bias in plasma process

Anti-oxidation layer to prevent dielectric loss from planarization...

Method of making a metal silicide contact to a silicon substrate

Methods for manufacturing semiconductor memory

Methods for near surface work function engineering

Patents Applicationslast 30 patents

METHOD OF PATTERNING ELEMENTAL METALS

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

TUNING THRESHOLD VOLTAGE THROUGH META STABLE PLASMA TREATMENT

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

METHOD OF FORMING A MEOL CONTACT STRUCTURE

SEMICONDUCTOR DEVICES WITH MODIFIED SOURCE/DRAIN FEATURE AND METHOD...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-GRADED GATE DIELEC...

FILM FORMATION METHOD AND PLASMA PROCESSING METHOD

Gate Structures For Semiconductor Devices

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SUBSTRATE PROCESSING METHOD

Fill Structures With Air Gaps

APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS

Sidewall Inorganic Passivation for Dielectric Etching Via Surface M...

SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...

THERMAL ETCHING OF RUTHENIUM

METHOD AND APPARATUS FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR

SIN GAP FILL VIA NUCLEATION INHIBITION

MANUFACTURING METHOD OF INSULATION FILM

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

ANTI-OXIDATION LAYER TO PREVENT DIELECTRIC LOSS FROM PLANARIZATION...

SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS

DC Bias in Plasma Process