formation of intermediate layers

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H01L21/02362

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02362formation of intermediate layers

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including insulation patterns with different...
- Patent number 12,237,385
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Bongkwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including air gap
- Patent number 12,230,498
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Dain Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and methods of formation
- Patent number 12,165,875
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,142,682
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure with insulating cap
- Patent number 12,074,218
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist layer surface treatment, cap layer, and method of formi...
- Patent number 12,057,315
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-replaced spacer for self-aligned contact scheme
- Patent number 12,040,222
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative fan-out panel level package (FOPLP) warpage control
- Patent number 12,040,286
- Issue date Jul 16, 2024
- Intel Corporation
- Eunyong Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,021,144
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsien Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molecular doping
- Patent number 11,978,633
- Issue date May 7, 2024
- Consiglio Nazionale Delle Ricerche
- Rosaria Anna Puglisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 11,830,742
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of material deposition
- Patent number 11,798,804
- Issue date Oct 24, 2023
- FEI Company
- Brian Roberts Routh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion barriers for germanium
- Patent number 11,791,155
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate walls for quantum dot devices
- Patent number 11,749,721
- Issue date Sep 5, 2023
- Intel Corporation
- Hubert C. George
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Photoresist layer surface treatment, cap layer, and method of formi...
- Patent number 11,705,332
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure
- Patent number 11,665,889
- Issue date May 30, 2023
- Winbond Electronics Corp.
- Shuen-Hsiang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 11,637,010
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor device and methods of fabr...
- Patent number 11,610,841
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ta Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuits with doped gate dielectrics
- Patent number 11,605,537
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective deposition using a sacrificial capping layer
- Patent number 11,495,459
- Issue date Nov 8, 2022
- ASM IP Holding B.V.
- Lucas Petersen Barbosa Lima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor comprising an air gap positioned adjacent a gate electrode
- Patent number 11,456,382
- Issue date Sep 27, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative fan-out panel level package (FOPLP) warpage control
- Patent number 11,450,620
- Issue date Sep 20, 2022
- Intel Corporation
- Eunyong Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gates and manufacturing methods thereof
- Patent number 11,404,555
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Hsiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 11,380,542
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,361,963
- Issue date Jun 14, 2022
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming nitrogen-containing layers as oxidation blocking layers
- Patent number 11,355,339
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for conformal doping of three dimensional structures
- Patent number 11,335,555
- Issue date May 17, 2022
- Applied Materials, Inc.
- Rui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PMOS transistor including low thermal-budget gate stack
- Patent number 11,282,837
- Issue date Mar 22, 2022
- Imec VZW
- Jacopo Franco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via on subtractively etched conductive line
- Patent number 11,276,611
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect cladding
- Patent number 11,270,943
- Issue date Mar 8, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250069893
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20250029944
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL GALLIUM OXIDE TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250006838
- Publication date Jan 2, 2025
- POWER CUBESEMI INC.
- Tai Young KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240387734
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chandrashekhar Prakash SAVANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin-Like Field Effect Transistors Having High Mobility Strained Cha...
- Publication number 20240379763
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO ENHANCE MATERIAL STRUCTURES
- Publication number 20240379349
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Steven C. H. HUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS
- Publication number 20240379350
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE WITH INSULATING CAP AND METHOD FOR FORMING THE SAME
- Publication number 20240371998
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMI...
- Publication number 20240355623
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chen KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III ELEMENT NITRIDE SEMICONDUCTOR SUBSTRATE, EPITAXIAL SUBSTR...
- Publication number 20240347604
- Publication date Oct 17, 2024
- NGK INSULATORS, LTD.
- Kentaro NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER COMPONENT BASED ON III NITRIDE COMPOUND SEMICONDUCTORS,...
- Publication number 20240347629
- Publication date Oct 17, 2024
- Frauhofer-Gesellschaft zur Forderung Der angewandten Forschung e.V.
- Philipp Döring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LEAKAGE CAPACITORS, AND RELATED STRUCTURES, METHODS, AND SYSTEMS
- Publication number 20240339493
- Publication date Oct 10, 2024
- ASM IP HOLDING B.V.
- Alessandra Leonhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air-Replaced Spacer for Self-Aligned Contact Scheme
- Publication number 20240339355
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240297254
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsien TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240178279
- Publication date May 30, 2024
- SK HYNIX INC.
- Wan Sup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20240128337
- Publication date Apr 18, 2024
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Shenghou LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...
- Publication number 20240112908
- Publication date Apr 4, 2024
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CONTACT RESISTANCE
- Publication number 20240105464
- Publication date Mar 28, 2024
- Shanghai Huali Integrated Circuit Corporation
- Wensheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088041
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TSENG-CHIEH PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS
- Publication number 20240071817
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE CAPPING OF CONTACT LAYER FOR CMOS DEVICES
- Publication number 20240014076
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION
- Publication number 20230377879
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMI...
- Publication number 20230326754
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manfacturing Company, Ltd.
- Yi-Chen KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20230307241
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsu Ming HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System And Method Of Forming A Porous Low-K Structure
- Publication number 20230260781
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230223276
- Publication date Jul 13, 2023
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Comprising Bottom Isolation Structures
- Publication number 20230178593
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE DEPOSITION USING A SACRIFICIAL CAPPING LAYER
- Publication number 20230026413
- Publication date Jan 26, 2023
- ASM IP HOLDING B.V.
- Lucas Petersen Barbosa Lima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNOVATIVE FAN-OUT PANEL LEVEL PACKAGE (FOPLP) WARPAGE CONTROL
- Publication number 20220384365
- Publication date Dec 1, 2022
- Intel Corporation
- Eunyong CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Gates And Manufacturing Methods Thereof
- Publication number 20220344489
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Jen-Hsiang Lu
- H01 - BASIC ELECTRIC ELEMENTS

formation of intermediate layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices including insulation patterns with different...

Method for manufacturing semiconductor device including air gap

Semiconductor device and methods of formation

Method of manufacturing semiconductor devices and semiconductor dev...

Contact structure with insulating cap

Photoresist layer surface treatment, cap layer, and method of formi...

Air-replaced spacer for self-aligned contact scheme

Innovative fan-out panel level package (FOPLP) warpage control

Method of manufacturing a semiconductor device and a semiconductor...

Molecular doping

Selective capping processes and structures formed thereby

Method of material deposition

Diffusion barriers for germanium

Gate walls for quantum dot devices

Photoresist layer surface treatment, cap layer, and method of formi...

Semiconductor memory structure

System and method of forming a porous low-k structure

Interconnect structure for semiconductor device and methods of fabr...

Integrated circuits with doped gate dielectrics

Methods for selective deposition using a sacrificial capping layer

Transistor comprising an air gap positioned adjacent a gate electrode

Innovative fan-out panel level package (FOPLP) warpage control

Metal gates and manufacturing methods thereof

Selective capping processes and structures formed thereby

Semiconductor structure and method for manufacturing the same

Forming nitrogen-containing layers as oxidation blocking layers

Methods for conformal doping of three dimensional structures

PMOS transistor including low thermal-budget gate stack

Top via on subtractively etched conductive line

Copper interconnect cladding

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE

LATERAL GALLIUM OXIDE TRANSISTOR AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

Fin-Like Field Effect Transistors Having High Mobility Strained Cha...

TREATMENTS TO ENHANCE MATERIAL STRUCTURES

FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS

CONTACT STRUCTURE WITH INSULATING CAP AND METHOD FOR FORMING THE SAME

PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMI...

GROUP III ELEMENT NITRIDE SEMICONDUCTOR SUBSTRATE, EPITAXIAL SUBSTR...

HIGH-POWER COMPONENT BASED ON III NITRIDE COMPOUND SEMICONDUCTORS,...

LOW LEAKAGE CAPACITORS, AND RELATED STRUCTURES, METHODS, AND SYSTEMS

Air-Replaced Spacer for Self-Aligned Contact Scheme

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR TRANSISTOR AND MANUFACTURING METHOD THEREFOR

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...

METHOD FOR REDUCING CONTACT RESISTANCE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS

SELECTIVE CAPPING OF CONTACT LAYER FOR CMOS DEVICES

BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION

PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMI...

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

System And Method Of Forming A Porous Low-K Structure

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Metal-Comprising Bottom Isolation Structures

METHODS FOR SELECTIVE DEPOSITION USING A SACRIFICIAL CAPPING LAYER

INNOVATIVE FAN-OUT PANEL LEVEL PACKAGE (FOPLP) WARPAGE CONTROL

Metal Gates And Manufacturing Methods Thereof