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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/02362
formation of intermediate layers
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last 30 patents
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Selective capping processes and structures formed thereby
Patent number
11,830,742
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chien Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of material deposition
Patent number
11,798,804
Issue date
Oct 24, 2023
FEI Company
Brian Roberts Routh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Diffusion barriers for germanium
Patent number
11,791,155
Issue date
Oct 17, 2023
Applied Materials, Inc.
Huiyuan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gate walls for quantum dot devices
Patent number
11,749,721
Issue date
Sep 5, 2023
Intel Corporation
Hubert C. George
B82 - NANO-TECHNOLOGY
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Patent Grant
Photoresist layer surface treatment, cap layer, and method of formi...
Patent number
11,705,332
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Chen Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory structure
Patent number
11,665,889
Issue date
May 30, 2023
Winbond Electronics Corp.
Shuen-Hsiang Ke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method of forming a porous low-k structure
Patent number
11,637,010
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Bo-Jiun Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect structure for semiconductor device and methods of fabr...
Patent number
11,610,841
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Ta Yu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Integrated circuits with doped gate dielectrics
Patent number
11,605,537
Issue date
Mar 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods for selective deposition using a sacrificial capping layer
Patent number
11,495,459
Issue date
Nov 8, 2022
ASM IP Holding B.V.
Lucas Petersen Barbosa Lima
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Transistor comprising an air gap positioned adjacent a gate electrode
Patent number
11,456,382
Issue date
Sep 27, 2022
GLOBALFOUNDRIES U.S. Inc.
Laertis Economikos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Innovative fan-out panel level package (FOPLP) warpage control
Patent number
11,450,620
Issue date
Sep 20, 2022
Intel Corporation
Eunyong Chung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Metal gates and manufacturing methods thereof
Patent number
11,404,555
Issue date
Aug 2, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Jen-Hsiang Lu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective capping processes and structures formed thereby
Patent number
11,380,542
Issue date
Jul 5, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chien Chi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method for manufacturing the same
Patent number
11,361,963
Issue date
Jun 14, 2022
ENKRIS SEMICONDUCTOR, INC.
Kai Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming nitrogen-containing layers as oxidation blocking layers
Patent number
11,355,339
Issue date
Jun 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wan-Yi Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for conformal doping of three dimensional structures
Patent number
11,335,555
Issue date
May 17, 2022
Applied Materials, Inc.
Rui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
PMOS transistor including low thermal-budget gate stack
Patent number
11,282,837
Issue date
Mar 22, 2022
Imec VZW
Jacopo Franco
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Top via on subtractively etched conductive line
Patent number
11,276,611
Issue date
Mar 15, 2022
International Business Machines Corporation
Brent Anderson
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Copper interconnect cladding
Patent number
11,270,943
Issue date
Mar 8, 2022
Intel Corporation
Flavio Griggio
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Air-replaced spacer for self-aligned contact scheme
Patent number
11,264,270
Issue date
Mar 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Meng-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming an interconnect structure with enhanced corner co...
Patent number
11,239,165
Issue date
Feb 1, 2022
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
Patent number
11,222,980
Issue date
Jan 11, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Hsien Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structures including liners comprising alucone and re...
Patent number
11,223,014
Issue date
Jan 11, 2022
Micron Technology, Inc.
Zhe Song
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming a semiconductor memory structure
Patent number
11,205,574
Issue date
Dec 21, 2021
Winbond Electronics Corp.
Shuen-Hsiang Ke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including hermetic micro-cavity and methods of pr...
Patent number
11,139,164
Issue date
Oct 5, 2021
Raytheon Company
Thomas A. Hanft
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of selective deposition for BEOL dielectric etch
Patent number
11,087,973
Issue date
Aug 10, 2021
Tokyo Electron Limited
Yannick Feurprier
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing semiconductor devices using a capping layer...
Patent number
11,081,584
Issue date
Aug 3, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Chandrashekhar Prakash Savant
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of material deposition
Patent number
11,069,523
Issue date
Jul 20, 2021
FEI Company
Brian Roberts Routh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Aromatic amino siloxane functionalized materials for use in capping...
Patent number
11,031,237
Issue date
Jun 8, 2021
Merck Patent GmbH
Sachin Bobade
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR TRANSISTOR AND MANUFACTURING METHOD THEREFOR
Publication number
20240128337
Publication date
Apr 18, 2024
XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
Shenghou LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...
Publication number
20240112908
Publication date
Apr 4, 2024
SOITEC
Hugo Biard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REDUCING CONTACT RESISTANCE
Publication number
20240105464
Publication date
Mar 28, 2024
Shanghai Huali Integrated Circuit Corporation
Wensheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240088041
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
TSENG-CHIEH PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS
Publication number
20240071817
Publication date
Feb 29, 2024
Applied Materials, Inc.
Ruitong Xiong
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SELECTIVE CAPPING OF CONTACT LAYER FOR CMOS DEVICES
Publication number
20240014076
Publication date
Jan 11, 2024
Applied Materials, Inc.
Nicolas Louis BREIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION
Publication number
20230377879
Publication date
Nov 23, 2023
Applied Materials, Inc.
Srinivas Gandikota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMI...
Publication number
20230326754
Publication date
Oct 12, 2023
Taiwan Semiconductor Manfacturing Company, Ltd.
Yi-Chen KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
Publication number
20230307241
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Hsu Ming HSIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System And Method Of Forming A Porous Low-K Structure
Publication number
20230260781
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-Jiun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230223276
Publication date
Jul 13, 2023
MEDIATEK INC.
Po-Chao TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal-Comprising Bottom Isolation Structures
Publication number
20230178593
Publication date
Jun 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Ting Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR SELECTIVE DEPOSITION USING A SACRIFICIAL CAPPING LAYER
Publication number
20230026413
Publication date
Jan 26, 2023
ASM IP HOLDING B.V.
Lucas Petersen Barbosa Lima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INNOVATIVE FAN-OUT PANEL LEVEL PACKAGE (FOPLP) WARPAGE CONTROL
Publication number
20220384365
Publication date
Dec 1, 2022
Intel Corporation
Eunyong CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Gates And Manufacturing Methods Thereof
Publication number
20220344489
Publication date
Oct 27, 2022
Taiwan Semiconductor Manufacturing Co., LTD
Jen-Hsiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective Capping Processes and Structures Formed Thereby
Publication number
20220328309
Publication date
Oct 13, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chien CHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming Nitrogen-Containing Layers as Oxidation Blocking Layers
Publication number
20220301868
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Wan-Yi Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TOP VIA ON SUBTRACTIVELY ETCHED CONDUCTIVE LINE
Publication number
20220223473
Publication date
Jul 14, 2022
International Business Machines Corporation
Brent Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLECULAR DOPING
Publication number
20220216057
Publication date
Jul 7, 2022
Consiglio Nazionale Delle Ricerche
Rosaria Anna PUGLISI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
AIR-REPLACED SPACER FOR SELF-ALIGNED CONTACT SCHEME
Publication number
20220181202
Publication date
Jun 9, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Meng-Yu LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER INTERCONNECT CLADDING
Publication number
20220157735
Publication date
May 19, 2022
Intel Corporation
Flavio Griggio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
Publication number
20220130993
Publication date
Apr 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Hsien TU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WRAP-AROUND LABEL FOR SSD
Publication number
20220115231
Publication date
Apr 14, 2022
Intel Corporation
Cory Runyan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING AIR GAP
Publication number
20220093387
Publication date
Mar 24, 2022
Samsung Electronics Co., Ltd.
Dain LEE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR MEMORY STRUCTURE
Publication number
20220068654
Publication date
Mar 3, 2022
WINBOND ELECTRONICS CORP.
Shuen-Hsiang KE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION BARRIERS FOR GERMANIUM
Publication number
20220068640
Publication date
Mar 3, 2022
Applied Materials, Inc.
Huiyuan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW STRESS FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS
Publication number
20220068636
Publication date
Mar 3, 2022
LAM RESEARCH CORPORATION
Reza Bayati
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
Publication number
20220059684
Publication date
Feb 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chandrashekhar Prakash SAVANT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMI...
Publication number
20210305040
Publication date
Sep 30, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Chen KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TOP VIA ON SUBTRACTIVELY ETCHED CONDUCTIVE LINE
Publication number
20210296171
Publication date
Sep 23, 2021
International Business Machines Corporation
Brent Anderson
H01 - BASIC ELECTRIC ELEMENTS