formation of thin insulating films on the sidewalls or on top of conductors

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CPC
H01L21/76834

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76834formation of thin insulating films on the sidewalls or on top of conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,948,879
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch barrier for microelectronic packaging conductive structures
- Patent number 11,948,898
- Issue date Apr 2, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,882
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer in integrated circuits
- Patent number 11,942,419
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching platinum-containing thin film using protective cap layer
- Patent number 11,929,423
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Sebastian Meier
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 11,923,298
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Hyun-Seung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses having tungsten-containing structures
- Patent number 11,923,305
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Luca Fumagalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact structures
- Patent number 11,916,133
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayers as sacrificial capping layers
- Patent number 11,915,973
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Ainhoa Romo Negreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via interconnects including super vias
- Patent number 11,916,013
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,901,295
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,437
- Issue date Feb 13, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,894,266
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,894,269
- Issue date Feb 6, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 11,894,227
- Issue date Feb 6, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing the same having a profile modifier
- Patent number 11,894,259
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-En Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grating replication using helmets and topographically-selective dep...
- Patent number 11,894,270
- Issue date Feb 6, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial self-aligned contact for MOL
- Patent number 11,887,890
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance crosspoint architecture
- Patent number 11,882,774
- Issue date Jan 23, 2024
- Micron Technology, Inc.
- Rajasekhar Venigalla
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
REDUCED GATE TOP CD WITH WRAP-AROUND GATE CONTACT
- Publication number 20240128345
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112950
- Publication date Apr 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Chia Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE
- Publication number 20240105588
- Publication date Mar 28, 2024
- Intel Corporation
- Ilya V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096642
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALL...
- Publication number 20240096790
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...
- Publication number 20240096692
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240087956
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Woojin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OR DEVICE WITH SEALING LAYER
- Publication number 20240088012
- Publication date Mar 14, 2024
- STMicroelectronics S.r.l.
- Francesca MILANESI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20240088025
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20240079268
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE
- Publication number 20240079267
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH VIAS HAVING VERTICAL AND HORIZONTAL SE...
- Publication number 20240038656
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN M...
- Publication number 20240038528
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...
- Publication number 20240030062
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- Dennis M. Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMATION METHOD
- Publication number 20240030025
- Publication date Jan 25, 2024
- Tokyo Electron Limited
- Shinichi IKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURES
- Publication number 20240021707
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including Resistor Structures
- Publication number 20240014250
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Tae-yeol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420543
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ling CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20230420545
- Publication date Dec 28, 2023
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230411210
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...
- Publication number 20230403855
- Publication date Dec 14, 2023
- SK HYNIX INC.
- In-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOLOGICAL SENSING SYSTEM HAVING MICRO-ELECTRODE ARRAY
- Publication number 20230400450
- Publication date Dec 14, 2023
- Purdue Research Foundation
- Hossein Pajouhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20230395508
- Publication date Dec 7, 2023
- Semiconductor Manufacturing International (Tianjin) Corporation
- Ya DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE INTERCONNECTS
- Publication number 20230395504
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Air Gaps and Method of Fabrication Thereof
- Publication number 20230386905
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS

formation of thin insulating films on the sidewalls or on top of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Selective tungsten deposition at low temperatures

Dual metal gate structure having portions of metal gate layers in c...

Semiconductor device including a porous dielectric layer, and metho...

Heterogeneous metal line compositions for advanced integrated circu...

Semiconductor device structure and methods of forming the same

Trench contact structures for advanced integrated circuit structure...

Etch barrier for microelectronic packaging conductive structures

Semiconductor device and method of fabricating the same

Etch stop layer in integrated circuits

Semiconductor package and method

Selective deposition for integrated circuit interconnect structures

Via connection to a partially filled trench

Etching platinum-containing thin film using protective cap layer

Electro-migration barrier for interconnect

Method of fabricating semiconductor device

Methods of forming apparatuses having tungsten-containing structures

Self-aligned contact structures

Self-assembled monolayers as sacrificial capping layers

Via interconnects including super vias

Vias for cobalt-based interconnects and methods of fabrication thereof

Dielectric film for semiconductor fabrication

Semiconductor device and method for fabricating the same

Metal capping layer and methods thereof

Integrated assemblies and methods of forming integrated assemblies

Conformal deposition of silicon carbide films

Method for manufacturing the same having a profile modifier

Grating replication using helmets and topographically-selective dep...

Partial self-aligned contact for MOL

Low resistance crosspoint architecture

Patents Applicationslast 30 patents

REDUCED GATE TOP CD WITH WRAP-AROUND GATE CONTACT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE

METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME

PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALL...

HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...

MULTI-LAYER LINE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE OR DEVICE WITH SEALING LAYER

SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

INTERCONNECT STRUCTURES WITH VIAS HAVING VERTICAL AND HORIZONTAL SE...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN M...

INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...

FILM FORMATION METHOD

DEVICES WITH REDUCED CAPACITANCES

SELF-ALIGNED CONTACT STRUCTURES

Semiconductor Devices Including Resistor Structures

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...

BIOLOGICAL SENSING SYSTEM HAVING MICRO-ELECTRODE ARRAY

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

CONDUCTIVE STRUCTURE INTERCONNECTS

Semiconductor Device with Air Gaps and Method of Fabrication Thereof