formation of thin insulating films on the sidewalls or on top of conductors

Industry

CPC
H01L21/76834

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76834formation of thin insulating films on the sidewalls or on top of conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,916
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Won Keun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,154,824
- Issue date Nov 26, 2024
- ASM IP Holding B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure having a gate contact above a metal gate and strad...
- Patent number 12,148,834
- Issue date Nov 19, 2024
- Huawei Technologies Co., Ltd.
- Xinfang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor device having the same
- Patent number 12,142,521
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with doped low-k sidewall spacers for gate stacks
- Patent number 12,136,658
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral circuitry under array memory device and method of fabric...
- Patent number 12,137,566
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 12,125,743
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for integrated circuit structure and forming the...
- Patent number 12,125,746
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap isolation for back-end-of-the-line semiconductor interconnec...
- Patent number 12,125,790
- Issue date Oct 22, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,119,261
- Issue date Oct 15, 2024
- Winbond Electronics Corp.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,113,107
- Issue date Oct 8, 2024
- SK Hynix Inc.
- Dae Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 12,113,021
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,094,805
- Issue date Sep 17, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line single damascene top via spacer defined by pillar...
- Patent number 12,094,774
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs and methods of forming FinFETs
- Patent number 12,087,861
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with air gap
- Patent number 12,087,620
- Issue date Sep 10, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate spacers with stepped sidewalls by remo...
- Patent number 12,087,841
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,068,241
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-resistance contact plugs and method forming same
- Patent number 12,068,191
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with air gaps
- Patent number 12,062,611
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a field effect transistor by tilted implant...
- Patent number 12,062,707
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONTACTS FOR GATE, SOURCE, AND DRAIN
- Publication number 20240421003
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413088
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Jin Yul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240404920
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Yasuhito YOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL CIRCUITRY UNDER ARRAY MEMORY DEVICE AND METHOD OF FABRIC...
- Publication number 20240397724
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURES
- Publication number 20240387696
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20240387364
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER
- Publication number 20240387179
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379417
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20240379559
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240379418
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20240371687
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371683
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure
- Publication number 20240371754
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371684
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240371699
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH SPACERS AND MANUFACTURING METHOD THEREOF
- Publication number 20240355898
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON BEAM PROBING TECHNIQUES AND RELATED STRUCTURES
- Publication number 20240355685
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Amitava Majumdar
- G11 - INFORMATION STORAGE
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20240347383
- Publication date Oct 17, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING AN AIR GAP ADJACENT TO AN INTERCONN...
- Publication number 20240347380
- Publication date Oct 17, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS

formation of thin insulating films on the sidewalls or on top of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective passivation and selective deposition

Semiconductor device

Chemical direct pattern plating method

Method of forming an interconnect structure having an air gap and s...

Substrate processing method

Semiconductor device and a method of manufacturing the same

FinFET structure having a gate contact above a metal gate and strad...

Semiconductor device

Interconnect structure and semiconductor device having the same

Contact over active gate structures for advanced integrated circuit...

Integrated circuit with doped low-k sidewall spacers for gate stacks

Peripheral circuitry under array memory device and method of fabric...

Semiconductor device structure and methods of forming the same

Via-first process for connecting a contact and a gate electrode

Passivation layer for integrated circuit structure and forming the...

Airgap isolation for back-end-of-the-line semiconductor interconnec...

Semiconductor structure and manufacturing method of the same

Method for fabricating semiconductor device

Graphene-assisted low-resistance interconnect structures and method...

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Semiconductor device and method for manufacturing same

Interconnect structure and methods of forming the same

Back-end-of-line single damascene top via spacer defined by pillar...

FinFETs and methods of forming FinFETs

Semiconductor device structure with air gap

Method of manufacturing gate spacers with stepped sidewalls by remo...

Semiconductor structure

Low-resistance contact plugs and method forming same

Integrated circuit interconnect structures with air gaps

Method of manufacturing a field effect transistor by tilted implant...

Patents Applicationslast 30 patents

BACKSIDE CONTACTS FOR GATE, SOURCE, AND DRAIN

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

PERIPHERAL CIRCUITRY UNDER ARRAY MEMORY DEVICE AND METHOD OF FABRIC...

LOW-RESISTANCE COPPER INTERCONNECTS

SELF-ALIGNED CONTACT STRUCTURES

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

Semiconductor Structure

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

Semiconductor structure and manufacturing method thereof

FIELD EFFECT TRANSISTOR WITH SPACERS AND MANUFACTURING METHOD THEREOF

ELECTRON BEAM PROBING TECHNIQUES AND RELATED STRUCTURES

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

SEMICONDUCTOR DEVICES INCLUDING AN AIR GAP ADJACENT TO AN INTERCONN...