Forming additional members

Industry

CPC
H01L2224/81951

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81951Forming additional members

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,837,566
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,183,474
- Issue date Nov 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a chip
- Patent number 11,177,141
- Issue date Nov 16, 2021
- JWL (Zhejiang) Semiconductor Co., Ltd
- Linping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
- Patent number 10,763,286
- Issue date Sep 1, 2020
- Sony Corporation
- Susumu Hogyoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package for improving freedom of arrangement of...
- Patent number 10,714,402
- Issue date Jul 14, 2020
- Sony Corporation
- Hiroyuki Shigeta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for package on package through mold interconnects
- Patent number 9,659,908
- Issue date May 23, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,515,006
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 9,379,033
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus, method of manufacturing semiconductor appa...
- Patent number 9,105,625
- Issue date Aug 11, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 8,674,462
- Issue date Mar 18, 2014
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device with plural pad connection of semiconductor chip...
- Patent number 5,438,222
- Issue date Aug 1, 1995
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240113061
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230307419
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220084972
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210134751
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING A CHIP AND A CHIP PACKAGE STRUCTURE THEREOF
- Publication number 20200343109
- Publication date Oct 29, 2020
- Hangzhou JWL Technology Inc.
- LINPING LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS
- Publication number 20170133350
- Publication date May 11, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...
- Publication number 20130043585
- Publication date Feb 21, 2013
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHO...
- Publication number 20120127681
- Publication date May 24, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Man RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE
- Publication number 20090026560
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device package and method for manufacturing the same

Package structure and method for connecting components

Electronic device package and method for manufacturing the same

Method for packaging a chip

Semiconductor device, manufacturing method thereof, and electronic...

Semiconductor chip package for improving freedom of arrangement of...

Mounting structure and method for manufacturing same

Mounting structure and method for manufacturing same

Systems and methods for package on package through mold interconnects

3D device packaging using through-substrate posts

Sensor package

Semiconductor apparatus, method of manufacturing semiconductor appa...

Sensor package

Electronic device with plural pad connection of semiconductor chip...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PACKAGING A CHIP AND A CHIP PACKAGE STRUCTURE THEREOF

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS

SENSOR PACKAGE

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHO...

SENSOR PACKAGE