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  • CPC
  • H01L2224/81051
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81051Forming additional members
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Patents Grantslast 30 patents

  • Information Patent Grant

    Injection molded solder bumping
    • Patent number 10,037,967
    • Issue date Jul 31, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents