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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80051Forming additional members

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Patents Grantslast 30 patents

Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and method of manufacturing thereof
- Patent number 10,770,424
- Issue date Sep 8, 2020
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,748,824
- Issue date Aug 18, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,529,634
- Issue date Jan 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 9,583,451
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS
- Publication number 20200105630
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Probe methodology for ultrafine pitch Interconnects
- Publication number 20180331000
- Publication date Nov 15, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20160372430
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond pad with micro-protrusions for direct metallic bonding

Low temperature hybrid bonding

Semiconductor structure and method of manufacturing thereof

Probe methodology for ultrafine pitch interconnects

Probe methodology for ultrafine pitch interconnects

Method for bonding substrates

Conductive pillar shaped for solder confinement

Patents Applicationslast 30 patents

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS

Probe methodology for ultrafine pitch Interconnects

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT