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H01L2224/83951

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83951Forming additional members

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,087,721
- Issue date Sep 10, 2024
- Kyocera Corporation
- Tomonao Kikuchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a back via stack
- Patent number 11,935,908
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Mihye Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display module and manufacturing method thereof
- Patent number 11,916,052
- Issue date Feb 27, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Li Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hetero-integrated structure
- Patent number 11,004,816
- Issue date May 11, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,770,405
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,707,177
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier configured for delamination-free encapsulation and sta...
- Patent number 10,586,756
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semiconductor device having bi-material d...
- Patent number 10,366,944
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and its fabrication method
- Patent number 10,361,160
- Issue date Jul 23, 2019
- PHOENIX & CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, display panel, display device, and electronic...
- Patent number 10,304,787
- Issue date May 28, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jun Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper seed layer and nickel-tin microbump structures
- Patent number 10,297,563
- Issue date May 21, 2019
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical device and electrical devices
- Patent number 10,269,695
- Issue date Apr 23, 2019
- Intel Corporation
- Robert F Cheney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230260961
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230009495
- Publication date Jan 12, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359477
- Publication date Nov 10, 2022
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Li Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Module, Use of Chip Module, Test Arrangement and Test Method
- Publication number 20220181247
- Publication date Jun 9, 2022
- FIRST SENSOR AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS
- Publication number 20220040662
- Publication date Feb 10, 2022
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
IMAGE SENSOR INCLUDING A BACK VIA STACK
- Publication number 20220028915
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Mihye JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Having an Installation Place for Electronic Compone...
- Publication number 20210351151
- Publication date Nov 11, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Robby Urbahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Having Different Thicknesses in Packages
- Publication number 20200402926
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
- Publication number 20200294892
- Publication date Sep 17, 2020
- Huawei Technologies Co., Ltd
- Kairong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME
- Publication number 20200075519
- Publication date Mar 5, 2020
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20190244922
- Publication date Aug 8, 2019
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20190181119
- Publication date Jun 13, 2019
- United Microelectronics Corp.
- Guo-Zhong Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC...
- Publication number 20180047702
- Publication date Feb 15, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180012833
- Publication date Jan 11, 2018
- Kabushiki Kaisha Toyota Jidoshokki
- Naoki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTO-ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20170170160
- Publication date Jun 15, 2017
- ULTRA DISPLAY TECHNOLOGY CORP.
- Yung-Yu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, DISPLAY PANEL, DISPLAY DEVICE, ELECTRONIC DEV...
- Publication number 20170117262
- Publication date Apr 27, 2017
- SONY CORPORATION
- JUN SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

System and method for integration of biological chips

Electronic device and method for manufacturing electronic device

Display device and method of manufacturing the same

Display panel, preparation method thereof, and display device

Electronic device and display device using the same

Image sensor including a back via stack

Stretchable display module and manufacturing method thereof

Thermal interface material having different thicknesses in packages

Seal ring structures and methods of forming same

Semiconductor element bonding structure, method for producing semic...

Bonding of bridge to multiple semiconductor chips

Seal ring structures and methods of forming same

Hetero-integrated structure

Methods and apparatus for a semiconductor device having bi-material...

Thermal interface material having different thicknesses in packages

Wafer-level packaging methods using a photolithographic bonding mat...

Printed adhesion deposition to mitigate integrated circuit package...

Seal ring structures and methods of forming same

Thermal interface material having different thicknesses in packages

Integrated multi-color light-emitting pixel arrays based devices by...

Chip carrier configured for delamination-free encapsulation and sta...

Seal ring structures and methods of forming same

Methods and apparatus for semiconductor device having bi-material d...

Package structure and its fabrication method

Printed adhesion deposition to mitigate integrated circuit delamina...

Integrated multi-color light-emitting pixel arrays based devices by...

Semiconductor device, display panel, display device, and electronic...

Copper seed layer and nickel-tin microbump structures

Method for forming an electrical device and electrical devices

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

STRETCHABLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

Chip Module, Use of Chip Module, Test Arrangement and Test Method

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS

IMAGE SENSOR INCLUDING A BACK VIA STACK

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Circuit Carrier Having an Installation Place for Electronic Compone...

Thermal Interface Material Having Different Thicknesses in Packages

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME

STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC...

SEMICONDUCTOR MODULE

OPTO-ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, DISPLAY PANEL, DISPLAY DEVICE, ELECTRONIC DEV...