Forming or treating discontinuous thin films

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CPC
H01L21/76868

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76868Forming or treating discontinuous thin films

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Radiation hardened thin-film transistors
- Patent number 12,027,630
- Issue date Jul 2, 2024
- Auburn University
- Minseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanostructures utilizing self-assembled nucleic...
- Patent number 11,923,197
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional semiconductor memory devices having a vertical se...
- Patent number 11,839,084
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation hardened thin-film transistors
- Patent number 11,682,734
- Issue date Jun 20, 2023
- Auburn University
- Minseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 11,621,190
- Issue date Apr 4, 2023
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,398,392
- Issue date Jul 26, 2022
- Samsung Electronics Co., Ltd.
- Byoungdeog Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 11,367,652
- Issue date Jun 21, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional semiconductor memory devices
- Patent number 11,348,942
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming structures utilizing self-assembling nucleic acids
- Patent number 11,335,558
- Issue date May 17, 2022
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming self-aligned via
- Patent number 11,270,914
- Issue date Mar 8, 2022
- Applied Materials Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition system and method using the same
- Patent number 11,232,982
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Zhi Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a method of forming the semiconductor device
- Patent number 11,171,049
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation hardened thin-film transistors
- Patent number 11,069,815
- Issue date Jul 20, 2021
- Auburn University
- Minseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 11,024,535
- Issue date Jun 1, 2021
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a via and methods of forming t...
- Patent number 10,957,579
- Issue date Mar 23, 2021
- Samsung Electronics Co., Ltd.
- Yung Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices comprising manganese-containing conductive...
- Patent number 10,950,496
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kentaro Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming self-aligned via
- Patent number 10,923,396
- Issue date Feb 16, 2021
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,903,116
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming tungsten film
- Patent number 10,886,170
- Issue date Jan 5, 2021
- Tokyo Electron Limited
- Koji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,845
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices
- Patent number 10,777,572
- Issue date Sep 15, 2020
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 10,672,654
- Issue date Jun 2, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic devices comprising manganese-containing conductive...
- Patent number 10,651,084
- Issue date May 12, 2020
- Micron Technology, Inc.
- Kentaro Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming self-aligned via
- Patent number 10,629,484
- Issue date Apr 21, 2020
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming structures
- Patent number 10,607,836
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Array substrate and repairing method thereof
- Patent number 10,381,275
- Issue date Aug 13, 2019
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Guanghui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-organizing barrier layer disposed between a metallization laye...
- Patent number 10,332,793
- Issue date Jun 25, 2019
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer rigidity with reinforcement structure
- Patent number 10,325,862
- Issue date Jun 18, 2019
- GLOBALFOUNDRIES Inc.
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch sensing unit and display device
- Patent number 10,283,347
- Issue date May 7, 2019
- Samsung Display Co., Ltd.
- Choon-Hyop Lee
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20240258161
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Yong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THIN FILM, AND SEMICONDUCTOR SUBSTRATE
- Publication number 20240162086
- Publication date May 16, 2024
- NISSAN CHEMICAL CORPORATION
- Wataru SHIBAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
- Publication number 20240090224
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Euntaek JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION HARDENED THIN-FILM TRANSISTORS
- Publication number 20240038897
- Publication date Feb 1, 2024
- Auburn University
- Minseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...
- Publication number 20230230881
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20230223302
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
- Publication number 20220293633
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Euntaek JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20220285213
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...
- Publication number 20220262623
- Publication date Aug 18, 2022
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RADIATION HARDENED THIN-FILM TRANSISTORS
- Publication number 20210343868
- Publication date Nov 4, 2021
- Auburn University
- Minseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20210287936
- Publication date Sep 16, 2021
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM AND METHOD USING THE SAME
- Publication number 20210217660
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Zhi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Self-Aligned Via
- Publication number 20210166973
- Publication date Jun 3, 2021
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210118705
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- Byoungdeog Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES COMPRISING MANGANESE-CONTAINING CONDUCTIVE...
- Publication number 20210020503
- Publication date Jan 21, 2021
- Micron Technology, Inc.
- Kentaro Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
- Publication number 20200388634
- Publication date Dec 10, 2020
- Samsung Electronics Co., Ltd.
- Euntaek JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATION DEVICE, PROJECTION MASK AND LASER IRRADIATION METHOD
- Publication number 20200388495
- Publication date Dec 10, 2020
- V TECHNOLOGY CO., LTD.
- Michinobu MIZUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STRUCTURES
- Publication number 20200251339
- Publication date Aug 6, 2020
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20200243380
- Publication date Jul 30, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method Of Forming Self-Aligned Via
- Publication number 20200219768
- Publication date Jul 9, 2020
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...
- Publication number 20200144103
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Yung Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Self-Aligned Via
- Publication number 20200144117
- Publication date May 7, 2020
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20200118871
- Publication date Apr 16, 2020
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200043781
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION HARDENED THIN-FILM TRANSISTORS
- Publication number 20200027989
- Publication date Jan 23, 2020
- Auburn University
- Minseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
- Publication number 20190333931
- Publication date Oct 31, 2019
- Samsung Electronics Co., Ltd.
- Euntaek JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF FORMING THE SEMICONDUCTOR DEVICE
- Publication number 20190267283
- Publication date Aug 29, 2019
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STRUCTURES
- Publication number 20190074183
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Forming or treating discontinuous thin films

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic assembly from processed substrate

Radiation hardened thin-film transistors

Methods of forming nanostructures utilizing self-assembled nucleic...

Three-dimensional semiconductor memory devices having a vertical se...

Radiation hardened thin-film transistors

Method for filling recessed features in semiconductor devices with...

Integrated circuit device and method of manufacturing the same

Microelectronic assembly from processed substrate

Three-dimensional semiconductor memory devices

Methods of forming structures utilizing self-assembling nucleic acids

Method of forming self-aligned via

Deposition system and method using the same

Semiconductor device and a method of forming the semiconductor device

Radiation hardened thin-film transistors

Method for filling recessed features in semiconductor devices with...

Integrated circuit devices including a via and methods of forming t...

Microelectronic devices comprising manganese-containing conductive...

Method of forming self-aligned via

Void-free metallic interconnect structures with self-formed diffusi...

Method of forming tungsten film

Semiconductor device and method

Three-dimensional semiconductor memory devices

Microelectronic assembly from processed substrate

Microelectronic devices comprising manganese-containing conductive...

Method of forming self-aligned via

Methods of forming structures

Array substrate and repairing method thereof

Self-organizing barrier layer disposed between a metallization laye...

Wafer rigidity with reinforcement structure

Touch sensing unit and display device

Patents Applicationslast 30 patents

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHODS OF FORMING INTERCONNECT STRUCTURES

SUBSTRATE WITH THIN FILM, AND SEMICONDUCTOR SUBSTRATE

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

RADIATION HARDENED THIN-FILM TRANSISTORS

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...

RADIATION HARDENED THIN-FILM TRANSISTORS

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...

DEPOSITION SYSTEM AND METHOD USING THE SAME

Method Of Forming Self-Aligned Via

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC DEVICES COMPRISING MANGANESE-CONTAINING CONDUCTIVE...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

LASER IRRADIATION DEVICE, PROJECTION MASK AND LASER IRRADIATION METHOD

METHODS OF FORMING STRUCTURES

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

Method Of Forming Self-Aligned Via

INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...

Method Of Forming Self-Aligned Via

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...

Semiconductor Device and Method

RADIATION HARDENED THIN-FILM TRANSISTORS

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

SEMICONDUCTOR DEVICE AND A METHOD OF FORMING THE SEMICONDUCTOR DEVICE

METHODS OF FORMING STRUCTURES

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...