Forming printed elements for providing electric connections to or between printed circuits

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CPC
H05K3/40

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/40Forming printed elements for providing electric connections to or between printed circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,369,250
- Issue date Jul 22, 2025
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back drilling vias of a printed circuit board
- Patent number 12,369,256
- Issue date Jul 22, 2025
- Dell Products L.P.
- Steven Richard Ethridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 12,359,334
- Issue date Jul 15, 2025
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 12,356,557
- Issue date Jul 8, 2025
- Ibiden Co., Ltd.
- Keisuke Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Externally grounded printed circuit board
- Patent number 12,349,266
- Issue date Jul 1, 2025
- Knowles Electronics, LLC
- Joshua Watson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Customized thermal pathways in a PCB
- Patent number 12,342,474
- Issue date Jun 24, 2025
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,336,095
- Issue date Jun 17, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless connector system
- Patent number 12,327,931
- Issue date Jun 10, 2025
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,317,424
- Issue date May 27, 2025
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for defects detection and classification using...
- Patent number 12,307,668
- Issue date May 20, 2025
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Through mold via frame
- Patent number 12,308,307
- Issue date May 20, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and manufacturing method therefor, and board card con...
- Patent number 12,309,922
- Issue date May 20, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Lei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure for display device
- Patent number 12,302,507
- Issue date May 13, 2025
- AUO CORPORATION
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to eliminate via striping
- Patent number 12,302,496
- Issue date May 13, 2025
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible membrane adapted to carry high-frequency (RF) power signal...
- Patent number 12,292,457
- Issue date May 6, 2025
- Technoprobe S.p.A.
- Flavio Maggioni
- G01 - MEASURING TESTING
Information Patent Grant
Closed-cavity printed circuit board
- Patent number 12,284,771
- Issue date Apr 22, 2025
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,274,001
- Issue date Apr 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Min Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,250,769
- Issue date Mar 11, 2025
- Kuan-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wireless Connector System
- Publication number 20250239769
- Publication date Jul 24, 2025
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable Fabrication of Microdevices From Metals, Ceramics, and Pol...
- Publication number 20250220821
- Publication date Jul 3, 2025
- Carnegie Mellon University
- O. Burak Ozdoganlar
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED VERTICAL INTERCONNECT ARRAY
- Publication number 20250201683
- Publication date Jun 19, 2025
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203776
- Publication date Jun 19, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20250194009
- Publication date Jun 12, 2025
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATION OF ELECTRONIC CIRCUIT SYSTEMS I...
- Publication number 20250194000
- Publication date Jun 12, 2025
- Goodrich Lighting Systems, Inc.
- Suresh Pathupilliath
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250194010
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jun Ki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLATING EDGE CONNECTORS ON CIRCUIT BOARD WITH GOLD, AND...
- Publication number 20250185181
- Publication date Jun 5, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fengyue CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20250185165
- Publication date Jun 5, 2025
- AOI ELECTRONICS CO., LTD.
- Takashi SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250185180
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method of manufacturing a metal-ceramic...
- Publication number 20250185166
- Publication date Jun 5, 2025
- Rogers Germany GmbH
- Tilo Welker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250175203
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Takanori UEJIMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176108
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sangyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...
- Publication number 20250174541
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...
- Publication number 20250168979
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd.
- Lei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...
- Publication number 20250168990
- Publication date May 22, 2025
- GRUPO ANTOLIN-INGENIERIA, S.A.
- Marta Castillo Garcia
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250168981
- Publication date May 22, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
- Publication number 20250159807
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250159806
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yongjin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES
- Publication number 20250151196
- Publication date May 8, 2025
- Hewlett-Packard Development Company, L.P.
- Marcus Joseph Benzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250151195
- Publication date May 8, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...
- Publication number 20250142717
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250142728
- Publication date May 1, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250133652
- Publication date Apr 24, 2025
- Cisco Technology, Inc.
- Yuqing Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Forming printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board structure and manufacturing method thereof

Back drilling vias of a printed circuit board

Systems and methods for manufacturing electrical components using e...

Printed wiring board and method for manufacturing printed wiring board

Method for manufacturing wiring substrate

Low cost, low loss material for microwave or antenna printed circui...

Externally grounded printed circuit board

Customized thermal pathways in a PCB

Wiring substrate and method for manufacturing wiring substrate

Wireless connector system

Wiring circuit board

Method for manufacturing printed wiring board and printed wiring board

Methods and systems for defects detection and classification using...

Through mold via frame

Mating backplane for high speed, high density electrical connector

Mounting of capacitors on printed circuit boards for non-volatile m...

Circuit carrier and manufacturing method thereof and package structure

Adapter board and manufacturing method therefor, and board card con...

Circuit board with convex shaped post, light emitting device, and m...

Circuit board structure for display device

System and method to eliminate via striping

Flexible membrane adapted to carry high-frequency (RF) power signal...

Closed-cavity printed circuit board

Printed circuit board

Electronic component and manufacturing method thereof

Electrical devices with electrodes on softening polymers and method...

Circuit board and manufacturing method thereof

Sensor interposer employing castellated through-vias

Interconnect structure having conductor extending along dielectric...

Component carrier with embedded semiconductor component and embedde...

Patents Applicationslast 30 patents

Wireless Connector System

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

MANUFACTURING METHOD OF CIRCUIT CARRIER

Scalable Fabrication of Microdevices From Metals, Ceramics, and Pol...

Thermal Management in Circuit Board Assemblies

MOLDED VERTICAL INTERCONNECT ARRAY

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

SYSTEMS AND METHODS FOR INTEGRATION OF ELECTRONIC CIRCUIT SYSTEMS I...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

METHOD FOR PLATING EDGE CONNECTORS ON CIRCUIT BOARD WITH GOLD, AND...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Metal-ceramic substrate and method of manufacturing a metal-ceramic...

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...

ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...

METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...

ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES

WIRING SUBSTRATE

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...

COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD ASSEMBLY