Forming printed elements for providing electric connections to or between printed circuits

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CPC
H05K3/40

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/40Forming printed elements for providing electric connections to or between printed circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board
- Patent number 12,317,424
- Issue date May 27, 2025
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through mold via frame
- Patent number 12,308,307
- Issue date May 20, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for defects detection and classification using...
- Patent number 12,307,668
- Issue date May 20, 2025
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and manufacturing method therefor, and board card con...
- Patent number 12,309,922
- Issue date May 20, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Lei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure for display device
- Patent number 12,302,507
- Issue date May 13, 2025
- AUO CORPORATION
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to eliminate via striping
- Patent number 12,302,496
- Issue date May 13, 2025
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible membrane adapted to carry high-frequency (RF) power signal...
- Patent number 12,292,457
- Issue date May 6, 2025
- Technoprobe S.p.A.
- Flavio Maggioni
- G01 - MEASURING TESTING
Information Patent Grant
Closed-cavity printed circuit board
- Patent number 12,284,771
- Issue date Apr 22, 2025
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,274,001
- Issue date Apr 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Min Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,250,769
- Issue date Mar 11, 2025
- Kuan-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for forming the same
- Patent number 12,238,863
- Issue date Feb 25, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having multilayered substrate and manufacturing m...
- Patent number 12,232,260
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Seungjin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector including signal pins shielded by buried ground vias
- Patent number 12,224,510
- Issue date Feb 11, 2025
- NEOCONIX, INC
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery interconnects
- Patent number 12,218,385
- Issue date Feb 4, 2025
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,213,253
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250175203
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Takanori UEJIMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176108
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sangyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...
- Publication number 20250174541
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...
- Publication number 20250168979
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd.
- Lei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...
- Publication number 20250168990
- Publication date May 22, 2025
- GRUPO ANTOLIN-INGENIERIA, S.A.
- Marta Castillo Garcia
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250168981
- Publication date May 22, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
- Publication number 20250159807
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250159806
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yongjin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES
- Publication number 20250151196
- Publication date May 8, 2025
- Hewlett-Packard Development Company, L.P.
- Marcus Joseph Benzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250151195
- Publication date May 8, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...
- Publication number 20250142717
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250142728
- Publication date May 1, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250133652
- Publication date Apr 24, 2025
- Cisco Technology, Inc.
- Yuqing Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250126703
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT COMPENSATION METHOD APPLIED TO PATTERN DISPLACEMENT AND CIR...
- Publication number 20250126722
- Publication date Apr 17, 2025
- Industrial Technology Research Institute
- Chieh-Wei Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUIT BOARD
- Publication number 20250126723
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARD AND METHOD OF FORMING ELE...
- Publication number 20250126721
- Publication date Apr 17, 2025
- Elephantech Inc.
- Shinya SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS
- Publication number 20250125546
- Publication date Apr 17, 2025
- Neoconix, Inc.
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250120010
- Publication date Apr 10, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...
- Publication number 20250113445
- Publication date Apr 3, 2025
- Meta Platforms Technologies, LLC
- Wenyang Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20250113428
- Publication date Apr 3, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
- Publication number 20250106979
- Publication date Mar 27, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...
- Publication number 20250106987
- Publication date Mar 27, 2025
- CYNTEC CO., LTD.
- Chia-Fu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD AND ELECTRONIC DEVICE
- Publication number 20250098076
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250089173
- Publication date Mar 13, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250089164
- Publication date Mar 13, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Forming printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board

Method for manufacturing printed wiring board and printed wiring board

Through mold via frame

Methods and systems for defects detection and classification using...

Mating backplane for high speed, high density electrical connector

Mounting of capacitors on printed circuit boards for non-volatile m...

Circuit carrier and manufacturing method thereof and package structure

Adapter board and manufacturing method therefor, and board card con...

Circuit board with convex shaped post, light emitting device, and m...

Circuit board structure for display device

System and method to eliminate via striping

Flexible membrane adapted to carry high-frequency (RF) power signal...

Closed-cavity printed circuit board

Printed circuit board

Electronic component and manufacturing method thereof

Electrical devices with electrodes on softening polymers and method...

Circuit board and manufacturing method thereof

Sensor interposer employing castellated through-vias

Interconnect structure having conductor extending along dielectric...

Component carrier with embedded semiconductor component and embedde...

Electronic device and method for forming the same

Electronic device having multilayered substrate and manufacturing m...

Connector including signal pins shielded by buried ground vias

Battery interconnects

Printed circuit board

Electronic component with metallic cap

Embeddable electrically insulating thermal connector and circuit bo...

Circuit board and semiconductor device including the same

Wiring substrate and method for manufacturing wiring substrate

Capacitive compensation for vertical interconnect accesses

Patents Applicationslast 30 patents

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...

ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...

METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...

ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES

WIRING SUBSTRATE

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND TERMINAL DEVIC...

COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT COMPENSATION METHOD APPLIED TO PATTERN DISPLACEMENT AND CIR...

METHOD FOR FORMING CIRCUIT BOARD

PRINTED WIRING BOARD

METHOD OF PRODUCING PRINTED CIRCUIT BOARD AND METHOD OF FORMING ELE...

CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS

WIRING BOARD

SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...

TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD

Embeddable Electrically Insulating Thermal Connector and Circuit Bo...

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...

BOARD AND ELECTRONIC DEVICE

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC DEVICE