Forming printed elements for providing electric connections to or between printed circuits

Industry

CPC
H05K3/40

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/40Forming printed elements for providing electric connections to or between printed circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Battery interconnects
- Patent number 12,218,385
- Issue date Feb 4, 2025
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,213,253
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spectral module and method for manufacturing spectral module
- Patent number 12,181,339
- Issue date Dec 31, 2024
- Hamamatsu Photonics K.K.
- Takafumi Yokino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and method of producing the same
- Patent number 12,185,463
- Issue date Dec 31, 2024
- Nitto Denko Corporation
- Kanayo Sawashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame and method for stacking discrete components to be embedd...
- Patent number 12,185,469
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Richard Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making printed wiring board, printed wiring board, and a...
- Patent number 12,185,477
- Issue date Dec 31, 2024
- Ajinomoto Co., Inc.
- Habib Hichri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light board, method for manufacturing the same, and LED backlight m...
- Patent number 12,177,966
- Issue date Dec 24, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Xinghan He
- F21 - LIGHTING
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent antenna and manufacturing method thereof
- Patent number 12,166,278
- Issue date Dec 10, 2024
- Industrial Technology Research Institute
- Shih-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for via-hole processing, via-hole processing device, and via-ho...
- Patent number 12,156,347
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Jong Heum Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connections to embedded electronic components
- Patent number 12,156,343
- Issue date Nov 26, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable interconnect structure and method of fabricating the same
- Patent number 12,120,814
- Issue date Oct 15, 2024
- National University of Singapore
- Chee Keong Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method for manufacturing same
- Patent number 12,063,738
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,052,819
- Issue date Jul 30, 2024
- Ibiden Co., Ltd.
- Tomohiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic circuit production method using 3D layer shaping
- Patent number 12,048,102
- Issue date Jul 23, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME
- Publication number 20250048550
- Publication date Feb 6, 2025
- The Charles Stark Draper Laboratory, Inc.
- William A. ROY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PRINTED CIRCUIT BOARD ARRANGEMENT AND WAVEGUIDE INTERFACE ARRANGE...
- Publication number 20250040046
- Publication date Jan 30, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Klas ERIKSSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20250024602
- Publication date Jan 16, 2025
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...
- Publication number 20250016934
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
- Publication number 20250008656
- Publication date Jan 2, 2025
- Meta Platforms Technologies, LLC
- Andrew Matthew BARDAGJY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008652
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
- Publication number 20240431027
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING...
- Publication number 20240417586
- Publication date Dec 19, 2024
- TAIYO HOLDINGS CO., LTD.
- Yasuyo KANAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS
- Publication number 20240407093
- Publication date Dec 5, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS
- Publication number 20240397610
- Publication date Nov 28, 2024
- Intel Corporation
- Aik Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES
- Publication number 20240397618
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Martin G. Pineda
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341033
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Forming printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Battery interconnects

Printed circuit board

Electronic component with metallic cap

Embeddable electrically insulating thermal connector and circuit bo...

Circuit board and semiconductor device including the same

Wiring substrate and method for manufacturing wiring substrate

Capacitive compensation for vertical interconnect accesses

Method and apparatus for flexible circuit cable attachment

Spectral module and method for manufacturing spectral module

Electronic device

Wiring circuit board and method of producing the same

Lead frame and method for stacking discrete components to be embedd...

Method for making printed wiring board, printed wiring board, and a...

Light board, method for manufacturing the same, and LED backlight m...

High frequency and high power thin film component

Multilayer substrate

Transparent antenna and manufacturing method thereof

Jig for via-hole processing, via-hole processing device, and via-ho...

Electrical connections to embedded electronic components

Stretchable interconnect structure and method of fabricating the same

Manufacturing method for double-sided wiring circuit board and doub...

Offset interposers for large-bottom packages and large-die package-...

Printed wiring board

Multilayer substrate and method for manufacturing same

Circuit board and method for manufacturing the same

Methods of manufacturing circuit board and circuit board assembly

Devices and methods related to metallization of ceramic substrates...

Printed wiring board and method for manufacturing printed wiring board

Camera module and manufacturing method thereof

Electronic circuit production method using 3D layer shaping

Patents Applicationslast 30 patents

TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

WIRING SUBSTRATE

A PRINTED CIRCUIT BOARD ARRANGEMENT AND WAVEGUIDE INTERFACE ARRANGE...

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...

WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

PRINTED WIRING BOARD

GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...

CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING...

Circuit board

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS

OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

PPTC SMALL PLANAR SMD TEMPERATURE SENSORS AND OVERCURRENT DEVICES

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

PRINTING COMPONENTS TO SUBSTRATE POSTS

WIRING SUBSTRATE

Component Carrier Method of Manufacturing the Component Carrier and...