Four-layer arrangements

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H01L2224/29084

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29084Four-layer arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, power module, and manufacturing method of...
- Patent number 11,848,298
- Issue date Dec 19, 2023
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,753,963
- Issue date Aug 25, 2020
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package structure, optical module, and method for manufactu...
- Patent number 10,720,751
- Issue date Jul 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,700,036
- Issue date Jun 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,431,562
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for producing a device
- Patent number 10,431,715
- Issue date Oct 1, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,345,343
- Issue date Jul 9, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,242,962
- Issue date Mar 26, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
- Patent number 9,640,514
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting joining parts
- Patent number 9,502,376
- Issue date Nov 22, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature high strength metal stack for die attachment
- Patent number 9,443,903
- Issue date Sep 13, 2016
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die substrate assembly and method
- Patent number 9,324,674
- Issue date Apr 26, 2016
- Ampleon Netherlands B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,099,425
- Issue date Aug 4, 2015
- Kabushiki Kaisha Toshiba
- Keiichi Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submicron connection layer and method for using the same to connect...
- Patent number 8,951,837
- Issue date Feb 10, 2015
- National Chiao Tung University
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including cap
- Patent number 8,946,877
- Issue date Feb 3, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, POWER MODULE, AND MANUFACTURING METHOD OF...
- Publication number 20220238476
- Publication date Jul 28, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20220028821
- Publication date Jan 27, 2022
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210090903
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Tatsuo Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20210057370
- Publication date Feb 25, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...
- Publication number 20200258818
- Publication date Aug 13, 2020
- STMicroelectronics (Tours) SAS
- Samuel MENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR ISOLATION
- Publication number 20190277889
- Publication date Sep 12, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20160075920
- Publication date Mar 17, 2016
- Samsung SDI Co., Ltd.
- Dong Seon UH
- B32 - LAYERED PRODUCTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUBSTRATE ASSEMBLY AND METHOD
- Publication number 20150179599
- Publication date Jun 25, 2015
- NXP B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20140273318
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Yung Ho RYU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...
- Publication number 20140097534
- Publication date Apr 10, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...
- Publication number 20140008801
- Publication date Jan 9, 2014
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Low Temperature High Strength Metal Stack for Die Attachment
- Publication number 20120211793
- Publication date Aug 23, 2012
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120141786
- Publication date Jun 7, 2012
- Dong Seon UH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20120135242
- Publication date May 31, 2012
- Yuki SUGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CAP
- Publication number 20120074555
- Publication date Mar 29, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME
- Publication number 20110042817
- Publication date Feb 24, 2011
- PANASONIC CORPORATION
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20100055842
- Publication date Mar 4, 2010
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip chip underfill process
- Publication number 20030203536
- Publication date Oct 30, 2003
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Four-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact and die attach metallization for silicon carbide based devi...

Semiconductor apparatus, power module, and manufacturing method of...

Electronic device with multi-layer contact and system

Anisotropic conductive film and display device using the same

Electronic device, electronic module and methods for fabricating th...

Back side metallization

Contact and die attach metallization for silicon carbide based devi...

Back side metallization

Encapsulated stress mitigation layer and power electronic assemblie...

Current sensor isolation

Electronic device, electronic module and methods for fabricating th...

Optical package structure, optical module, and method for manufactu...

Encapsulated stress mitigation layer and power electronic assemblie...

Method for producing electronic device with multi-layer contact

Back side metallization

Structure and formation method of chip package structure

Device and method for producing a device

Current sensor isolation

Back side metallization

Anisotropic conductive film and display device using the same

Electronic device and method for producing an electronic device

Electronic devices with semiconductor die attached with sintered me...

Wafer bonding using boron and nitrogen based bonding stack

Electronic devices with semiconductor die coupled to a thermally co...

Process for connecting joining parts

Low temperature high strength metal stack for die attachment

Die substrate assembly and method

Semiconductor device and method for manufacturing the same

Submicron connection layer and method for using the same to connect...

Semiconductor package including cap

Patents Applicationslast 30 patents

COMPONENT-EMBEDDED PACKAGING STRUCTURE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

DISPLAY PANEL

SEMICONDUCTOR APPARATUS, POWER MODULE, AND MANUFACTURING METHOD OF...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...

Electronic Device with Multi-Layer Contact and System

CURRENT SENSOR ISOLATION

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

Method for Producing Electronic Device With Multi-Layer Contact

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Electronic Device and Method for Producing an Electronic Device

Electronic Device with Multi-Layer Contact

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

DIE SUBSTRATE ASSEMBLY AND METHOD

METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...

DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...

SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...

Package Structure and Substrate Bonding Method

Low Temperature High Strength Metal Stack for Die Attachment

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

THERMOSETTING DIE-BONDING FILM

SEMICONDUCTOR PACKAGE INCLUDING CAP

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

THERMOSETTING DIE-BONDING FILM

Flip chip underfill process