Four-layer coating

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CPC
H01L2224/13584

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13584Four-layer coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,106
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal core solder ball interconnector fan-out wafer level package
- Patent number 10,679,930
- Issue date Jun 9, 2020
- Hana Micron Inc.
- Hyun Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component that includes a protective structure
- Patent number 9,263,390
- Issue date Feb 16, 2016
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 9,219,010
- Issue date Dec 22, 2015
- Semiconductor Componenets Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic attachment structure
- Patent number 9,010,618
- Issue date Apr 21, 2015
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor component
- Patent number 8,445,375
- Issue date May 21, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic attachment structure
- Patent number 8,434,668
- Issue date May 7, 2013
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411330
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masatoshi SHOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS
- Publication number 20220270995
- Publication date Aug 25, 2022
- QUALCOMM Incorporated
- Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210134749
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20130244418
- Publication date Sep 19, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component that includes a protective structure
- Publication number 20130234311
- Publication date Sep 12, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20130224444
- Publication date Aug 29, 2013
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20110278044
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
- Publication number 20110074034
- Publication date Mar 31, 2011
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Four-layer coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sidewall wetting barrier for conductive pillars

Integrated circuit package and method

Metal core solder ball interconnector fan-out wafer level package

Semiconductor component that includes a protective structure

Method of manufacturing a semiconductor component

Magnetic attachment structure

TSV pillar as an interconnecting structure

Method for manufacturing a semiconductor component

Magnetic attachment structure

Doping minor elements into metal bumps

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS

Integrated Circuit Package and Method

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

Semiconductor component that includes a protective structure

MAGNETIC ATTACHMENT STRUCTURE

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

Doping Minor Elements into Metal Bumps

Doping Minor Elements into Metal Bumps

MAGNETIC ATTACHMENT STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE