Frame comprising an aperture

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CPC
H01L2924/17151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/17151Frame comprising an aperture

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,057,356
- Issue date Aug 6, 2024
- Kyocera Corporation
- Eiji Kukita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, and electronic device
- Patent number 11,996,339
- Issue date May 28, 2024
- Kyocera Corporation
- Kenichi Ura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with shifted lead neck
- Patent number 11,211,320
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and manufacturing method therefor
- Patent number 10,930,573
- Issue date Feb 23, 2021
- Murata Manufacturing Co., Ltd.
- Shingo Funakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 10,658,255
- Issue date May 19, 2020
- ADVANCED SEMSCONDUCTOR ENGINEERING, INC.
- Tsung-Yu Lin
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure of semiconductor device
- Patent number 10,535,813
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Shinsei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,424,526
- Issue date Sep 24, 2019
- Powertech Technology Inc.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure of semiconductor device
- Patent number 10,153,424
- Issue date Dec 11, 2018
- Rohm Co., Ltd.
- Shinsei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 9,905,498
- Issue date Feb 27, 2018
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 9,806,005
- Issue date Oct 31, 2017
- KYOCERA Corporation
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor housing with contact mechanism
- Patent number 9,018,748
- Issue date Apr 28, 2015
- ABB Technology AG
- Mauro Monge
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System of chip package build-up
- Patent number 8,829,690
- Issue date Sep 9, 2014
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip package build-up
- Patent number 8,623,699
- Issue date Jan 7, 2014
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR
- Publication number 20240038683
- Publication date Feb 1, 2024
- NXP B.V.
- Tzu Ya Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
- Publication number 20230100769
- Publication date Mar 30, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230005801
- Publication date Jan 5, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220208623
- Publication date Jun 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20220077012
- Publication date Mar 10, 2022
- KYOCERA CORPORATION
- Eiji KUKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SHIFTED LEAD NECK
- Publication number 20210202365
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200243408
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUTING STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20190067560
- Publication date Feb 28, 2019
- ROHM CO., LTD.
- Shinsei MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20170323845
- Publication date Nov 9, 2017
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20170186672
- Publication date Jun 29, 2017
- KYOCERA CORPORATION
- Hiroshi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT AND/OR CLIP FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR COMPO...
- Publication number 20170110390
- Publication date Apr 20, 2017
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Housing With Contact Mechanism
- Publication number 20140145321
- Publication date May 29, 2014
- Mauro Monge
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20140110866
- Publication date Apr 24, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20120018857
- Publication date Jan 26, 2012
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR A HIGH-FREQUENCY ELECTRONIC COMPONENT
- Publication number 20080186112
- Publication date Aug 7, 2008
- Eiichi Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig structure for manufacturing an image sensor
- Publication number 20060263460
- Publication date Nov 23, 2006
- Chief Lin
- H01 - BASIC ELECTRIC ELEMENTS

Frame comprising an aperture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic element mounting substrate and electronic device

High density interconnection and wiring layers, package structures,...

Electronic element mounting substrate, and electronic device

Semiconductor device package and a method of manufacturing the same

Semiconductor device package and a method of manufacturing the same

Package with shifted lead neck

Circuit module and manufacturing method therefor

Semiconductor device package and a method of manufacturing the same

Semiconductor module with temperature detecting element

Semiconductor device and mounting structure of semiconductor device

Chip package structure and manufacturing method thereof

Semiconductor device and mounting structure of semiconductor device

Electronic package

Electronic element mounting substrate and electronic device

Power semiconductor housing with contact mechanism

System of chip package build-up

Method of chip package build-up

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

CHIP PROTECTION DEVICE

SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

PACKAGE WITH SHIFTED LEAD NECK

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MOUTING STRUCTURE OF SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE

ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

SUPPORT AND/OR CLIP FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR COMPO...

Power Semiconductor Housing With Contact Mechanism

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

PACKAGE STRUCTURE FOR A HIGH-FREQUENCY ELECTRONIC COMPONENT

Jig structure for manufacturing an image sensor