Free-standing redistribution layers

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CPC
H01L2224/02335

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02335Free-standing redistribution layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 11,282,761
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,251,144
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,075,182
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,971,429
- Issue date Apr 6, 2021
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,607,920
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,607,921
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a corresponding method of manufacturing se...
- Patent number 10,593,625
- Issue date Mar 17, 2020
- STMicroelectronics S.r.l.
- Samuele Sciarrillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 10,522,406
- Issue date Dec 31, 2019
- International Busniess Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 10,483,224
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for solder connections
- Patent number 10,453,815
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor packaging device, and met...
- Patent number 10,446,515
- Issue date Oct 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Li Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,276,526
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabrication of a redistribution layer to av...
- Patent number 10,211,052
- Issue date Feb 19, 2019
- Lam Research Corporation
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,141,276
- Issue date Nov 27, 2018
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,096,563
- Issue date Oct 9, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball amount process in the manufacturing of integrated circuit
- Patent number 9,997,483
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 9,935,009
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,865,526
- Issue date Jan 9, 2018
- Xintec Inc.
- Yu-Lung Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 9,570,412
- Issue date Feb 14, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible routing for chip on board applications
- Patent number 9,287,189
- Issue date Mar 15, 2016
- Broadcom Corporation
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant printed circuit wafer level semiconductor package
- Patent number 9,136,196
- Issue date Sep 15, 2015
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for an automobile
- Patent number 8,916,963
- Issue date Dec 23, 2014
- Valeo Etudes Electroniques
- Jean-Michel Morelle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIFFUSION BARRIERS AND METHOD OF FORMING SAME
- Publication number 20230132632
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220208633
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20220108962
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20200194340
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200176346
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190051625
- Publication date Feb 14, 2019
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20190027456
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20180182672
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20180138137
- Publication date May 17, 2018
- Samsung Electronics Co., Ltd.
- Jeong-gi JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180076157
- Publication date Mar 15, 2018
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Solder Connections
- Publication number 20170084560
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20170069590
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods of Manufacture Thereof
- Publication number 20170033064
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Amount Process in the Manufacturing of Integrated Circuit
- Publication number 20160141261
- Publication date May 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Amount Process in the Manufacturing of Integrated Circuit
- Publication number 20140252611
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE ROUTING FOR CHIP ON BOARD APPLICATIONS
- Publication number 20140124940
- Publication date May 8, 2014
- BROADCOM CORPORATION
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AN...
- Publication number 20120292086
- Publication date Nov 22, 2012
- E.I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
POWER MODULE FOR AN AUTOMOBILE
- Publication number 20120235290
- Publication date Sep 20, 2012
- VALEO ETUDES ELECTRONIQUES
- Jean-Michel Morelle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELA...
- Publication number 20120231257
- Publication date Sep 13, 2012
- E.I. du Pont de Nemours and Company
- Meredith L. Dunbar
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERLAY COMPOSITIONS AND METHODS RELATING THERETO
- Publication number 20120231263
- Publication date Sep 13, 2012
- E.I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRE WRAP COMPOSITIONS AND METHODS RELATING THERETO
- Publication number 20120231264
- Publication date Sep 13, 2012
- E. I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ASSEMBLIES COMPRISING A POLYIMIDE FILM AND AN ELECTRODE, AND METHOD...
- Publication number 20120227790
- Publication date Sep 13, 2012
- E.I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO
- Publication number 20120228616
- Publication date Sep 13, 2012
- E.I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPLIANT PRINTED CIRCUIT WAFER LEVEL SEMICONDUCTOR PACKAGE
- Publication number 20120056332
- Publication date Mar 8, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS

Free-standing redistribution layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of forming the same

Semiconductor chip

Alternative integration for redistribution layer process

IR assisted fan-out wafer level packaging using silicon handler

Semiconductor packages and methods of manufacturing the same

Semiconductor chip

Semiconductor package and method of forming the same

Method for forming a semiconductor package

Method and fixture for chip attachment to physical objects

Packaging devices and methods of manufacture thereof

Semiconductor package

Method for forming a semiconductor package

Semiconductor device and a corresponding method of manufacturing se...

IR assisted fan-out wafer level packaging using silicon handler

Semiconductor chip

Methods and apparatus for solder connections

Semiconductor substrate and semiconductor packaging device, and met...

Semiconductor package structure and manufacturing method thereof

Systems and methods for fabrication of a redistribution layer to av...

Semiconductor package structure and manufacturing method thereof

Semiconductor package and method of forming the same

Ball amount process in the manufacturing of integrated circuit

IR assisted fan-out wafer level packaging using silicon handler

Chip package and method for forming the same

Semiconductor device

Flexible routing for chip on board applications

Compliant printed circuit wafer level semiconductor package

Semiconductor module system having encapsulated through wire interc...

Through wire interconnect (TWI) for semiconductor components having...

Power module for an automobile

Patents Applicationslast 30 patents

DIFFUSION BARRIERS AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR CHIP

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Package and Method of Forming the Same

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods and Apparatus for Solder Connections

Semiconductor Package and Method of Forming the Same

Packaging Devices and Methods of Manufacture Thereof

Ball Amount Process in the Manufacturing of Integrated Circuit

Ball Amount Process in the Manufacturing of Integrated Circuit

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

FLEXIBLE ROUTING FOR CHIP ON BOARD APPLICATIONS

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

Through Wire Interconnect (TWI) For Semiconductor Components Having...

INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AN...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

POWER MODULE FOR AN AUTOMOBILE

THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELA...

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

COVERLAY COMPOSITIONS AND METHODS RELATING THERETO

WIRE WRAP COMPOSITIONS AND METHODS RELATING THERETO

ASSEMBLIES COMPRISING A POLYIMIDE FILM AND AN ELECTRODE, AND METHOD...

THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO

COMPLIANT PRINTED CIRCUIT WAFER LEVEL SEMICONDUCTOR PACKAGE