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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/285from a gas or vapour

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,328,930
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner for V-NAND word line stack
- Patent number 12,328,872
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Jacqueline S. Wrench
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ultraviolet radiation activated atomic layer deposition
- Patent number 12,327,721
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Christine Y. Ouyang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistance and reduced reactivity approaches for fabricating co...
- Patent number 12,328,927
- Issue date Jun 10, 2025
- Intel Coporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor tool for copper deposition
- Patent number 12,327,715
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vertical semiconductor device and method for fabricating the vertic...
- Patent number 12,328,877
- Issue date Jun 10, 2025
- SK hynix Inc.
- In-Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming a patterned layer of material
- Patent number 12,325,911
- Issue date Jun 10, 2025
- ASML Netherlands B.V.
- Tamara Druzhinina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures having varied materials
- Patent number 12,327,760
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guanyu Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free contact trench fill in gate-all-around FET architecture
- Patent number 12,327,761
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor gate structures and methods of forming the same
- Patent number 12,324,191
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 12,315,863
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for preventing silicide contamination during t...
- Patent number 12,317,488
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride-based compound semiconductor device
- Patent number 12,317,564
- Issue date May 27, 2025
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Shenghou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device with efficient edge...
- Patent number 12,308,235
- Issue date May 20, 2025
- STMicroelectronics S.r.l.
- Edoardo Zanetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including backside vias and methods of formin...
- Patent number 12,310,057
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced deposition rate by thermal isolation cover for GIS manipul...
- Patent number 12,308,207
- Issue date May 20, 2025
- Applied Materials Israel Ltd.
- Sean Kashy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition window enlargement
- Patent number 12,300,496
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of low temperature plasma enhanced chemical va...
- Patent number 12,300,497
- Issue date May 13, 2025
- Applied Materials, Inc.
- Thai Cheng Chua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and formation method thereof
- Patent number 12,302,599
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal chalcogenide film and method and device for manufacturing the...
- Patent number 12,297,532
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Kyung-Eun Byun
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low resistant contact method and structure
- Patent number 12,300,729
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 12,300,539
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with carbon-...
- Patent number 12,300,541
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a FET structure by selective deposition of film o...
- Patent number 12,288,692
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing display device, and electro...
- Patent number 12,289,959
- Issue date Apr 29, 2025
- Sony Group Corporation
- Hitoshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride semiconductor photoelectrode
- Patent number 12,286,718
- Issue date Apr 29, 2025
- Nippon Telegraph and Telephone Corporation
- Yuya Uzumaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual metal wrap-around contacts for semiconductor devices
- Patent number 12,284,820
- Issue date Apr 22, 2025
- Tokyo Electron Limited
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for compound semiconductor device
- Patent number 12,283,922
- Issue date Apr 22, 2025
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gated heterostructure and double-heterostructure active devices
- Patent number 12,284,817
- Issue date Apr 22, 2025
- MaxPower Semiconductor Inc.
- Jun Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and system for depositing transition metal carbide
- Publication number 20250188602
- Publication date Jun 12, 2025
- ASM IP HOLDING B.V.
- Paloma Ruiz Y Kärkkäinen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH
- Publication number 20250188601
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Wen CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TERMINATION STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20250191928
- Publication date Jun 12, 2025
- Virginia Tech Intellectual Properties, Inc.
- Yuhao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250185293
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Taesun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS
- Publication number 20250183041
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Yao-Tsung HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING
- Publication number 20250183039
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Brian Ellingwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20250183040
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Hsuan LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTO-EMITTING PLASMA FOR ACTIVATION IN PROCESSING CHAMBERS, AND RE...
- Publication number 20250183066
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Abbas RASTEGAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A LOWER INSULATING PATTERN
- Publication number 20250185295
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- KI HWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FORMATION OF ETCH STOP LAYERS AND THE STRUCTURES THEREOF
- Publication number 20250185329
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM ALUMINUM AND TANTALUM ALUMINUM THIN FILMS
- Publication number 20250176248
- Publication date May 29, 2025
- ASM IP HOLDING B.V.
- Suvi Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING IMPROVED ELECTROSTATIC DISCHARGE PROTEC...
- Publication number 20250169191
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250166996
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
- Publication number 20250169190
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUN-LI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK
- Publication number 20250162342
- Publication date May 22, 2025
- Lauren Michelle Neubauer
- B43 - WRITING OR DRAWING IMPLEMENTS BUREAU ACCESSORIES
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250169136
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hsiang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective metal Capping with Metal Halide enhancement
- Publication number 20250157824
- Publication date May 15, 2025
- Applied Materials, Inc.
- Shumao ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...
- Publication number 20250159965
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250149344
- Publication date May 8, 2025
- UNITED MICROELECTRONICS CORP.
- MING THAI CHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250149383
- Publication date May 8, 2025
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR DEVICE
- Publication number 20250151360
- Publication date May 8, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Wenjie SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING A SURFACE
- Publication number 20250149325
- Publication date May 8, 2025
- ASM IP HOLDING B.V.
- Shaoren Deng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250149380
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250151311
- Publication date May 8, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Wangping WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELF-ALIGNED BACKSIDE CONTACT STRUCT...
- Publication number 20250151362
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- WONHYUK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...
- Publication number 20250142954
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME
- Publication number 20250140562
- Publication date May 1, 2025
- Applied Materials, Inc.
- Zhaoxuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...
- Publication number 20250142915
- Publication date May 1, 2025
- Wolfspeed, Inc.
- Matthew KING
- H01 - BASIC ELECTRIC ELEMENTS

from a gas or vapour

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gate structures for semiconductor devices

Liner for V-NAND word line stack

Ultraviolet radiation activated atomic layer deposition

Low resistance and reduced reactivity approaches for fabricating co...

Semiconductor tool for copper deposition

Vertical semiconductor device and method for fabricating the vertic...

Method and apparatus for forming a patterned layer of material

Interconnect structures having varied materials

Void-free contact trench fill in gate-all-around FET architecture

Semiconductor package having composite seed-barrier layer and metho...

Transistor gate structures and methods of forming the same

Contact structures in semiconductor devices

Structure and method for preventing silicide contamination during t...

Gallium nitride-based compound semiconductor device

Manufacturing method of a semiconductor device with efficient edge...

Semiconductor devices including backside vias and methods of formin...

Enhanced deposition rate by thermal isolation cover for GIS manipul...

Deposition window enlargement

Method and apparatus of low temperature plasma enhanced chemical va...

Semiconductor device and formation method thereof

Metal chalcogenide film and method and device for manufacturing the...

Low resistant contact method and structure

Source/drain contact formation methods and devices

Structure and formation method of semiconductor device with carbon-...

Method of forming a FET structure by selective deposition of film o...

Display device, method of manufacturing display device, and electro...

Method for producing nitride semiconductor photoelectrode

Dual metal wrap-around contacts for semiconductor devices

Manufacturing method for compound semiconductor device

Trench-gated heterostructure and double-heterostructure active devices

Patents Applicationslast 30 patents

Method and system for depositing transition metal carbide

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH

TERMINATION STRUCTURES FOR SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT DEVICE

LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS

INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

PHOTO-EMITTING PLASMA FOR ACTIVATION IN PROCESSING CHAMBERS, AND RE...

SEMICONDUCTOR DEVICE INCLUDING A LOWER INSULATING PATTERN

SELECTIVE FORMATION OF ETCH STOP LAYERS AND THE STRUCTURES THEREOF

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

TITANIUM ALUMINUM AND TANTALUM ALUMINUM THIN FILMS

SEMICONDUCTOR DEVICE HAVING IMPROVED ELECTROSTATIC DISCHARGE PROTEC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE

DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

Selective metal Capping with Metal Halide enhancement

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

HIGH ELECTRON MOBILITY TRANSISTOR DEVICE

METHOD OF CLEANING A SURFACE

INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SELF-ALIGNED BACKSIDE CONTACT STRUCT...

SEMICONDUCTOR DEVICE HAVING A FIN AT A S/D REGION AND A SEMICONDUCT...

LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME

GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...