from a gas or vapour

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H01L21/285

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/285from a gas or vapour

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a metal-oxide-semiconductor field-effect tr...
- Patent number 12,191,196
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact metallization process
- Patent number 12,191,199
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity tungsten film and method of manufacture
- Patent number 12,191,198
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition method and element including film deposited by the...
- Patent number 12,183,582
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD target design and semiconductor devices formed using the same
- Patent number 12,180,576
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having deep trench structure and method of man...
- Patent number 12,183,639
- Issue date Dec 31, 2024
- SK keyfoundry Inc.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail structure and methods of forming same
- Patent number 12,183,678
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transistor device with a gate structure having...
- Patent number 12,176,407
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transition metal containing film on a substrate...
- Patent number 12,173,402
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Timo Hatanpää
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of formation
- Patent number 12,170,331
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structures for semiconductor devices
- Patent number 12,170,335
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate structure and method of manufacturing...
- Patent number 12,170,280
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,170,206
- Issue date Dec 17, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,170,325
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,929
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a manufacturing method thereof
- Patent number 12,166,133
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a gate terminal of a HEMT device, and HEMT...
- Patent number 12,165,871
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Ferdinando Iucolano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition process apparatus and method of optimizin...
- Patent number 12,165,935
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of selective deposition
- Patent number 12,157,943
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 12,159,868
- Issue date Dec 3, 2024
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,154,902
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,148,837
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,148,621
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Backside contact structures with stacked metal silicide layers for...
- Patent number 12,148,807
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING HIGH ELECTRON MOBILITY TRANSISTOR
- Publication number 20250015174
- Publication date Jan 9, 2025
- Vanguard International Semiconductor Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015162
- Publication date Jan 9, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20250015152
- Publication date Jan 9, 2025
- ROHM CO., LTD.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus, Substrate Processing Method, Method...
- Publication number 20250011930
- Publication date Jan 9, 2025
- Kokusai Electric Corporation
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20250014904
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250015161
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250003067
- Publication date Jan 2, 2025
- Soulbrain Co., LTD
- Jae Sun JUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHO...
- Publication number 20250006561
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION
- Publication number 20250003054
- Publication date Jan 2, 2025
- Blue Origin, LLC
- Alexander lmbault
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Backside Via and Dual Side Power Rail For Epitaxial Source/Drain St...
- Publication number 20250006557
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ISOLATION OF CONTACT AND SOURCE/DRAIN STRUCTURES
- Publication number 20240429292
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION METHOD
- Publication number 20240429055
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Chiyu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING FILM
- Publication number 20240429039
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Eun Hyea Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20240407160
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE
- Publication number 20240404888
- Publication date Dec 5, 2024
- Applied Materuals, Inc.
- Thomas Anthony Empante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405090
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seong Heum CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molybdenum-Containing Device-Level Interconnects and Methods of Fab...
- Publication number 20240395894
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Chu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395811
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yuan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT METALLIZATION PROCESS
- Publication number 20240395611
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Pei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Metal Gapfill
- Publication number 20240395614
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20240395613
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD
- Publication number 20240384404
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Wei XU
- B08 - CLEANING
Information Patent Application
Semiconductor Device and Method
- Publication number 20240387661
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUG
- Publication number 20240387267
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED WAFER CHEMICAL VAPOR DEPOSITION DEVICE AND DEPOSITION...
- Publication number 20240384415
- Publication date Nov 21, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Tinglin YOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS

from a gas or vapour

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a metal-oxide-semiconductor field-effect tr...

Contact metallization process

Gate-all-around transistor with reduced source/drain contact resist...

Low resistivity tungsten film and method of manufacture

Film deposition method and element including film deposited by the...

PVD target design and semiconductor devices formed using the same

Semiconductor device having deep trench structure and method of man...

Bottom lateral expansion of contact plugs through implantation

Backside power rail structure and methods of forming same

Semiconductor device

Method of forming a transistor device with a gate structure having...

Method of forming a transition metal containing film on a substrate...

Formation and in-situ etching processes for metal layers

Conductive structures and methods of formation

Epitaxial structures for semiconductor devices

Method of manufacturing gate structure and method of manufacturing...

Method of processing substrate, method of manufacturing semiconduct...

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device and method

Semiconductor structure and a manufacturing method thereof

Method for manufacturing a gate terminal of a HEMT device, and HEMT...

Physical vapor deposition process apparatus and method of optimizin...

Methods of selective deposition

Semiconductor structure and method for forming same

Tungsten molybdenum structures

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Semiconductor device and manufacturing method thereof

Semiconductor devices

Method of processing substrate, method of manufacturing semiconduct...

Backside contact structures with stacked metal silicide layers for...

Patents Applicationslast 30 patents

METHOD OF FABRICATING HIGH ELECTRON MOBILITY TRANSISTOR

SEMICONDUCTOR DEVICE

NITRIDE SEMICONDUCTOR DEVICE

Substrate Processing Apparatus, Substrate Processing Method, Method...

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHO...

SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION

Backside Via and Dual Side Power Rail For Epitaxial Source/Drain St...

SEMICONDUCTOR DEVICE ISOLATION OF CONTACT AND SOURCE/DRAIN STRUCTURES

DEPOSITION METHOD

METHOD OF DEPOSITING FILM

Methods of Filling Openings with Conductive Material, and Assemblie...

DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Molybdenum-Containing Device-Level Interconnects and Methods of Fab...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONTACT METALLIZATION PROCESS

Method for Metal Gapfill

METHOD OF FORMING INTERCONNECT STRUCTURE

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

LOW-RESISTANCE COPPER INTERCONNECTS

SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD

Semiconductor Device and Method

CONTACT PLUG

NITRIDE-BASED WAFER CHEMICAL VAPOR DEPOSITION DEVICE AND DEPOSITION...

DEPOSITION WINDOW ENLARGEMENT