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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/288from a liquid

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,368,068
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Yuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and apparatus for electronic component
- Patent number 12,351,934
- Issue date Jul 8, 2025
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating co-planarity improvement by die shielding
- Patent number 12,344,955
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Charles Sharbono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 12,349,434
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Koji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic measurement of fabrication equipment clearance
- Patent number 12,320,782
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Hao Deng
- B08 - CLEANING
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 12,312,702
- Issue date May 27, 2025
- Applied Materials, Inc.
- Cameron Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,276,027
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Katsuhiro Morikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing solar cell, solar module, and power genera...
- Patent number 12,278,306
- Issue date Apr 15, 2025
- SOLARLAB AIKO EUROPE GMBH
- Yongqian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition and method for fabrication of nickel interconnects
- Patent number 12,270,121
- Issue date Apr 8, 2025
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lipseal edge exclusion engineering to maintain material integrity a...
- Patent number 12,247,310
- Issue date Mar 11, 2025
- Lam Research Corporation
- Justin Oberst
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing and reuse of semiconductor substrates
- Patent number 12,249,504
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 12,227,865
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal grid, thin film sensor and manufactur...
- Patent number 12,224,234
- Issue date Feb 11, 2025
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Hu Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist-free deposition and patterning with vacuum ultraviolet...
- Patent number 12,174,544
- Issue date Dec 24, 2024
- The Board of Trustees of the University of Illinois
- J. Gary Eden
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Additive process for circular printing
- Patent number 12,172,374
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Crop growth information monitoring method and device and method for...
- Patent number 12,163,942
- Issue date Dec 10, 2024
- AGRICULTURAL INFORMATION INSTITUTE OF CHINESE ACADEMY OF AGRICULTURAL SCIENCES
- Denghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,148,658
- Issue date Nov 19, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing data line, method for manufacturing array...
- Patent number 12,132,058
- Issue date Oct 29, 2024
- BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuming Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device, semiconductor structure and method for forming same
- Patent number 12,100,654
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Juanjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 12,080,648
- Issue date Sep 3, 2024
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250226228
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Mitsuaki IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND APPLICATION THEREOF, AND LEVELING AGENT AND PREPARA...
- Publication number 20250198036
- Publication date Jun 19, 2025
- Huawei Technologies Co., Ltd
- Li ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20250201598
- Publication date Jun 19, 2025
- SCREEN Holdings Co., Ltd.
- Yukifumi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Deposition Process for Semiconductor Devices
- Publication number 20250201565
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Meagan Lenore Coleman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTOSENSITIVE SURFACE TREATING AGENT, PATTERN FORMATION SUBSTRATE,...
- Publication number 20250189894
- Publication date Jun 12, 2025
- Nikon Corporation
- Yusuke KAWAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTOSENSITIVE SURFACE TREATING AGENT, LAMINATE, PATTERN FORMATION...
- Publication number 20250180990
- Publication date Jun 5, 2025
- Nikon Corporation
- Yusuke KAWAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20250183031
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP METAL GATE FOR STACKED DEVICE STRUCTURE
- Publication number 20250151367
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250149380
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTE...
- Publication number 20250147418
- Publication date May 8, 2025
- JSR Corporation
- Naoki NISHIGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...
- Publication number 20250129503
- Publication date Apr 24, 2025
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20250125151
- Publication date Apr 17, 2025
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250081657
- Publication date Mar 6, 2025
- Sony Semiconductor Solutions Corporation
- TAKAHISA FURUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIAL DEPOSITION ON SEMICONDUCTOR WITH PHASE TRANSITI...
- Publication number 20250038004
- Publication date Jan 30, 2025
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Sen YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHOD...
- Publication number 20240421230
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...
- Publication number 20240413011
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240376625
- Publication date Nov 14, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Meng Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Acoustic Measurement of Fabrication Equipment Clearance
- Publication number 20240377364
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Hao Deng
- B08 - CLEANING
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355670
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
- Publication number 20240321795
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240309511
- Publication date Sep 19, 2024
- TOKYO ELECTRON LIMITED
- Takeshi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS

from a liquid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Manufacturing method and apparatus for electronic component

Electroplating co-planarity improvement by die shielding

Manufacturing method for semiconductor device

Acoustic measurement of fabrication equipment clearance

Plating systems having reduced air entrainment

Method for manufacturing an electronic device

Substrate processing apparatus and substrate processing method

Method for manufacturing solar cell, solar module, and power genera...

Composition and method for fabrication of nickel interconnects

Info structure with copper pillar having reversed profile

Lipseal edge exclusion engineering to maintain material integrity a...

Manufacturing and reuse of semiconductor substrates

Wafer shielding for prevention of lipseal plate-out

Plating apparatus and method for electroplating wafer

Semiconductor device and method of forming micro interconnect struc...

Manufacturing method of metal grid, thin film sensor and manufactur...

Photoresist-free deposition and patterning with vacuum ultraviolet...

Additive process for circular printing

Crop growth information monitoring method and device and method for...

Method of controlling chemical concentration in electrolyte

Chemical direct pattern plating method

Plating method, insoluble anode for plating, and plating apparatus

Method for manufacturing an electronic device

Method for manufacturing data line, method for manufacturing array...

Through-substrate via structure and method of manufacture

Storage device, semiconductor structure and method for forming same

Tungsten alloys in semiconductor devices

Methods for forming contact plugs with reduced corrosion

Plating for thermal management

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

COMPOSITION AND APPLICATION THEREOF, AND LEVELING AGENT AND PREPARA...

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

Electroless Deposition Process for Semiconductor Devices

PHOTOSENSITIVE SURFACE TREATING AGENT, PATTERN FORMATION SUBSTRATE,...

PHOTOSENSITIVE SURFACE TREATING AGENT, LAMINATE, PATTERN FORMATION...

METHOD OF PROCESSING A SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BOTTOM-UP METAL GATE FOR STACKED DEVICE STRUCTURE

INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTE...

COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CONDUCTIVE MATERIAL DEPOSITION ON SEMICONDUCTOR WITH PHASE TRANSITI...

ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHOD...

AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

SUBSTRATE PROCESSING METHOD

Acoustic Measurement of Fabrication Equipment Clearance

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

SEMICONDUCTOR DEVICE

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS

PLATING METHOD AND PLATING APPARATUS

Methods of Forming Material Within Openings Extending into a Semico...