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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/288from a liquid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Photoresist-free deposition and patterning with vacuum ultraviolet...
- Patent number 12,174,544
- Issue date Dec 24, 2024
- The Board of Trustees of the University of Illinois
- J. Gary Eden
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Additive process for circular printing
- Patent number 12,172,374
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Crop growth information monitoring method and device and method for...
- Patent number 12,163,942
- Issue date Dec 10, 2024
- AGRICULTURAL INFORMATION INSTITUTE OF CHINESE ACADEMY OF AGRICULTURAL SCIENCES
- Denghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,148,658
- Issue date Nov 19, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing data line, method for manufacturing array...
- Patent number 12,132,058
- Issue date Oct 29, 2024
- BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuming Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device, semiconductor structure and method for forming same
- Patent number 12,100,654
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Juanjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 12,080,648
- Issue date Sep 3, 2024
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device and semiconductor device
- Patent number 12,051,617
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing source-drain electrode, method for manufac...
- Patent number 12,040,334
- Issue date Jul 16, 2024
- BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuming Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with back side metal
- Patent number 12,040,310
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrically conductive feature traversing a m...
- Patent number 12,033,862
- Issue date Jul 9, 2024
- XTPL S.A.
- Łukasz Witczak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 12,033,883
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for electro-chemical plating
- Patent number 12,020,922
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Lung Hou
- B08 - CLEANING
Information Patent Grant
Method for metal gate surface clean
- Patent number 11,996,283
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improving within die co-planarity uniformity
- Patent number 11,984,358
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 11,978,678
- Issue date May 7, 2024
- Innolux Corporation
- Tung-Kai Liu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for metal plating comprising suppressing agent for void...
- Patent number 11,926,918
- Issue date Mar 12, 2024
- BASF SE
- Marcel Patrik Kienle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHOD...
- Publication number 20240421230
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...
- Publication number 20240413011
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240376625
- Publication date Nov 14, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Meng Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Acoustic Measurement of Fabrication Equipment Clearance
- Publication number 20240377364
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Hao Deng
- B08 - CLEANING
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355670
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
- Publication number 20240321795
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240309511
- Publication date Sep 19, 2024
- TOKYO ELECTRON LIMITED
- Takeshi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADDLE CHAMBER WITH ANTI-SPLASHING BAFFLES
- Publication number 20240271312
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20240249983
- Publication date Jul 25, 2024
- InnoLux Corporation
- Tung-Kai LIU
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240250036
- Publication date Jul 25, 2024
- TAIWAN SEMICODUCTOR MANUFACTURING CO., LTD.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR HYSTERETIC CURRENT-VOLTAGE MEDIATED VOID-FREE SUPERCONF...
- Publication number 20240229282
- Publication date Jul 11, 2024
- Government of the United States of America, as Represented by the Secretary o...
- Trevor Michael Braun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR...
- Publication number 20240222129
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Christian Huber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM
- Publication number 20240213090
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Keiichi Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTOSENSITIVE SURFACE TREATMENT AGENT, LAMINATE, TRANSISTOR, METHO...
- Publication number 20240201575
- Publication date Jun 20, 2024
- Nikon Corporation
- Yusuke KAWAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR CONTROLLING OP...
- Publication number 20240203768
- Publication date Jun 20, 2024
- EBARA CORPORATION
- Kazuma IDEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...
- Publication number 20240167188
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR A RECTIFIER CIRCUIT OF AN ELECTRODEPOSITION...
- Publication number 20240162811
- Publication date May 16, 2024
- Redwood Materials, Inc.
- Patrick Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

from a liquid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photoresist-free deposition and patterning with vacuum ultraviolet...

Additive process for circular printing

Crop growth information monitoring method and device and method for...

Method of controlling chemical concentration in electrolyte

Chemical direct pattern plating method

Plating method, insoluble anode for plating, and plating apparatus

Method for manufacturing an electronic device

Method for manufacturing data line, method for manufacturing array...

Through-substrate via structure and method of manufacture

Storage device, semiconductor structure and method for forming same

Tungsten alloys in semiconductor devices

Methods for forming contact plugs with reduced corrosion

Plating for thermal management

Semiconductor device having via sidewall adhesion with encapsulant

Method of making a semiconductor device and semiconductor device

Method for manufacturing source-drain electrode, method for manufac...

Methods of forming semiconductor packages with back side metal

Method of forming an electrically conductive feature traversing a m...

Fan-out interconnect structure and methods forming the same

Methods of forming material within openings extending into a semico...

Apparatus for electro-chemical plating

Method for metal gate surface clean

Info structure with copper pillar having reversed profile

Systems and methods for improving within die co-planarity uniformity

Display device

Nanotwin copper materials in semiconductor devices

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor package and method

Semiconductor package and method

Composition for metal plating comprising suppressing agent for void...

Patents Applicationslast 30 patents

ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHOD...

AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

SUBSTRATE PROCESSING METHOD

Acoustic Measurement of Fabrication Equipment Clearance

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

SEMICONDUCTOR DEVICE

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS

PLATING METHOD AND PLATING APPARATUS

Methods of Forming Material Within Openings Extending into a Semico...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

PADDLE CHAMBER WITH ANTI-SPLASHING BAFFLES

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

LIGHT-EMITTING DEVICE

SEMICONDUCTOR PACKAGE AND METHOD

PROCESS FOR HYSTERETIC CURRENT-VOLTAGE MEDIATED VOID-FREE SUPERCONF...

METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR...

SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM

PHOTOSENSITIVE SURFACE TREATMENT AGENT, LAMINATE, TRANSISTOR, METHO...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR CONTROLLING OP...

SEMICONDUCTOR PACKAGE AND METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...

MOUNTING STRUCTURE FOR A RECTIFIER CIRCUIT OF AN ELECTRODEPOSITION...

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION