Fuzz's as connector elements

Industry

CPC
H05K2201/10348

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10348Fuzz's as connector elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 11,129,277
- Issue date Sep 21, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 10,104,773
- Issue date Oct 16, 2018
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and electronic device
- Patent number 8,431,830
- Issue date Apr 30, 2013
- Fujitsu Limited
- Akira Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with joint reliability, entangled wires inclu...
- Patent number 7,969,024
- Issue date Jun 28, 2011
- Samsung Electronics Co., Ltd.
- Hyun-soo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-bumps to enhance LGA interconnections
- Patent number 7,302,757
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array structures and methods for engineering change
- Patent number 7,077,660
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor mounting structure
- Patent number 6,989,995
- Issue date Jan 24, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array structure
- Patent number 6,954,984
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with thermally conductive standoff
- Patent number 6,631,078
- Issue date Oct 7, 2003
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost, large scale RF hybrid package for simple assembly onto mi...
- Patent number 6,417,747
- Issue date Jul 9, 2002
- Raytheon Company
- Timothy E. Dearden
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20210368622
- Publication date Nov 25, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20180376595
- Publication date Dec 27, 2018
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC TILE PACKAGING
- Publication number 20180116052
- Publication date Apr 26, 2018
- Northrop Grumman Systems Corporation
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE
- Publication number 20110073355
- Publication date Mar 31, 2011
- Fujitsu Limited
- Akira TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package with joint reliability
- Publication number 20090315177
- Publication date Dec 24, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Hyun-soo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Testing of interconnections between stacked circuit boards
- Publication number 20060172564
- Publication date Aug 3, 2006
- Mattias Nilsson
- G01 - MEASURING TESTING
Information Patent Application
Micro-bumps to enhance LGA interconnections
- Publication number 20060030170
- Publication date Feb 9, 2006
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS
- Publication number 20050221635
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array structures and methods for engineering change
- Publication number 20040159915
- Publication date Aug 19, 2004
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor mounting structure
- Publication number 20040085742
- Publication date May 6, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array structures and methods for engineering change
- Publication number 20040016114
- Publication date Jan 29, 2004
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF
- Publication number 20030129863
- Publication date Jul 10, 2003
- International Business Machines Corporation
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Fuzz's as connector elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resilient micro lattice electrical interconnection assembly

Resilient micro lattice electrical interconnection assembly

Resilient micro lattice electrical interconnection assembly

Interposer and electronic device

Semiconductor package with joint reliability, entangled wires inclu...

Micro-bumps to enhance LGA interconnections

Land grid array structures and methods for engineering change

Capacitor mounting structure

Land grid array structure

Electronic package with thermally conductive standoff

Low cost, large scale RF hybrid package for simple assembly onto mi...

Patents Applicationslast 30 patents

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

ELECTRONIC TILE PACKAGING

INTERPOSER AND ELECTRONIC DEVICE

Semiconductor package with joint reliability

Testing of interconnections between stacked circuit boards

Micro-bumps to enhance LGA interconnections

MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS

Land grid array structures and methods for engineering change

Capacitor mounting structure

Land grid array structures and methods for engineering change

ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF