Gadolinium [Gd]

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CPC
H01L2924/01064

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01064Gadolinium [Gd]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pnictide buffer structures and devices for GaN base applications
- Patent number 10,615,141
- Issue date Apr 7, 2020
- IQE plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 10,593,652
- Issue date Mar 17, 2020
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 10,403,606
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rare earth pnictides for strain management
- Patent number 10,332,857
- Issue date Jun 25, 2019
- IQE plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacked semiconductor packages and methods of fabrica...
- Patent number 9,978,721
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 9,042,115
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,927,341
- Issue date Jan 6, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting semiconductor element bonded to a base by a silver c...
- Patent number 8,836,130
- Issue date Sep 16, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,735,222
- Issue date May 27, 2014
- Renesas Electronics Corporation
- Masakatsu Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having surface protect...
- Patent number 8,716,122
- Issue date May 6, 2014
- Renesas Electronics Corporation
- Takuro Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure and its manufacturing method, and semiconductor...
- Patent number 8,710,679
- Issue date Apr 29, 2014
- Hitachi Metals, Ltd.
- Setsuo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,679,898
- Issue date Mar 25, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,652,880
- Issue date Feb 18, 2014
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for improving bond pad performance
- Patent number 8,524,596
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems employing a stacked semiconductor package
- Patent number 8,508,954
- Issue date Aug 13, 2013
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au bonding wire for semiconductor device
- Patent number 8,440,137
- Issue date May 14, 2013
- Tanaka Denshi Kogyo K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Widebody coil isolators
- Patent number 8,427,844
- Issue date Apr 23, 2013
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Dominique Ho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device having surface protective films on bond pad
- Patent number 8,390,134
- Issue date Mar 5, 2013
- Renesas Electronics Corporation
- Takuro Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer and manufacturing method...
- Patent number 8,378,459
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Yasuhiro Naka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,377,752
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Masakatsu Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for forming photovoltaic devices
- Patent number 8,294,024
- Issue date Oct 23, 2012
- E I du Pont de Nemours and Company
- William J. Borland
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,258,604
- Issue date Sep 4, 2012
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device having luminescent layer with opening to expo...
- Patent number 8,138,509
- Issue date Mar 20, 2012
- Visera Technologies Company, Limited
- Tzy-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 8,106,418
- Issue date Jan 31, 2012
- Nichia Corporation
- Yoshitaka Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional blocks for assembly
- Patent number 8,022,416
- Issue date Sep 20, 2011
- General Electric Company
- William Hullinger Huber
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device with inductor
- Patent number 7,986,023
- Issue date Jul 26, 2011
- Infineon Technologies AG
- Helmut Tews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electro-optical device, and method for manufa...
- Patent number 7,855,107
- Issue date Dec 21, 2010
- Seiko Epson Corporation
- Toshiki Hara
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20180331071
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...
- Publication number 20180012858
- Publication date Jan 11, 2018
- IQE, plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY
- Publication number 20150069588
- Publication date Mar 12, 2015
- National Institute of Aerospace Associates
- Jin Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140141550
- Publication date May 22, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES
- Publication number 20130292828
- Publication date Nov 7, 2013
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130149855
- Publication date Jun 13, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130059420
- Publication date Mar 7, 2013
- RENESAS ELECTRONICS CORPORATION
- Masakatsu GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
- Publication number 20130000709
- Publication date Jan 3, 2013
- E I DU PONT DE NEMOURS AND COMPANY NORTH CAROLINA STATE UNIVERSITY
- WILLIAM J. BORLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20120309131
- Publication date Dec 6, 2012
- Renesas Electronics Corporation
- KOJI BANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Improving Bond Pad Performance
- Publication number 20120279767
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20120153486
- Publication date Jun 21, 2012
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110193203
- Publication date Aug 11, 2011
- Renesas Electronics Corporation
- Masakatsu GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR D...
- Publication number 20110151588
- Publication date Jun 23, 2011
- COOLEDGE LIGHTING, INC.
- Ian Ashdown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20110149493
- Publication date Jun 23, 2011
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD...
- Publication number 20100308442
- Publication date Dec 9, 2010
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100295044
- Publication date Nov 25, 2010
- RENESAS TECHNOLOGY CORP.
- Takuro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Widebody Coil Isolators
- Publication number 20100259909
- Publication date Oct 14, 2010
- Avago Technologies ECBU (Singapore) Pte. Ltd.
- Dominique Ho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR...
- Publication number 20100258954
- Publication date Oct 14, 2010
- Hitachi Metals, Ltd.
- Setsuo ANDOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICES
- Publication number 20100219433
- Publication date Sep 2, 2010
- Tzy-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100190298
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20100164077
- Publication date Jul 1, 2010
- RENESAS TECHNOLOGY CORP.
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20100155771
- Publication date Jun 24, 2010
- Nichia Corporation.
- Yoshitaka Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONS AND PROCESSES FOR FORMING PHOTOVOLTAIC DEVICES
- Publication number 20100037942
- Publication date Feb 18, 2010
- E.I. du Pont de Nemours and Company
- WILLIAM J. BORLAND
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Bonding wire for semiconductor device
- Publication number 20090188696
- Publication date Jul 30, 2009
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR
- Publication number 20090072388
- Publication date Mar 19, 2009
- Infineon Technologies AG
- Helmut Tews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL SYSTEM
- Publication number 20080137300
- Publication date Jun 12, 2008
- Chris G. Macris
- H01 - BASIC ELECTRIC ELEMENTS

Gadolinium [Gd]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive member, display device, and manufacturing method of displa...

Pnictide buffer structures and devices for GaN base applications

Stacked semiconductor packages

Method of fabricating a semiconductor package

Rare earth pnictides for strain management

Apparatus for stacked semiconductor packages and methods of fabrica...

Stacked semiconductor packages

Semiconductor device and production method therefor

Semiconductor device and production method therefor

Light emitting semiconductor element bonded to a base by a silver c...

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device having surface protect...

Electrode structure and its manufacturing method, and semiconductor...

Semiconductor device and production method therefor

Semiconductor device and method of manufacturing same

Semiconductor device and production method therefor

Techniques for improving bond pad performance

Systems employing a stacked semiconductor package

Au bonding wire for semiconductor device

Widebody coil isolators

Semiconductor device having surface protective films on bond pad

Semiconductor device, semiconductor wafer and manufacturing method...

Semiconductor device and method of manufacturing the same

Processes for forming photovoltaic devices

Semiconductor device and method of manufacturing same

Light emitting device having luminescent layer with opening to expo...

Light emitting device

Functional blocks for assembly

Semiconductor device with inductor

Semiconductor device, electro-optical device, and method for manufa...

Patents Applicationslast 30 patents

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...

RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

STACKED SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Techniques for Improving Bond Pad Performance

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR D...

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Widebody Coil Isolators

ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR...

LIGHT EMITTING DEVICES

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

LIGHT EMITTING DEVICE

COMPOSITIONS AND PROCESSES FOR FORMING PHOTOVOLTAIC DEVICES

Bonding wire for semiconductor device

SEMICONDUCTOR DEVICE WITH INDUCTOR

LIQUID METAL THERMAL INTERFACE MATERIAL SYSTEM