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Gallium arsenide nitride [GaAsN]
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CPC
H01L2924/10341
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/10341
Gallium arsenide nitride [GaAsN]
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Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating a semiconductor package with conductive carr...
Patent number
9,673,109
Issue date
Jun 6, 2017
Infineon Technologies Americas Corp.
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a semiconductor package with conductive carr...
Patent number
9,269,655
Issue date
Feb 23, 2016
Infineon Technologies Americas Corp.
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
Publication number
20150348887
Publication date
Dec 3, 2015
INTERNATIONAL RECTIFIER CORPORATION
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Integrated Heat Spreader
Publication number
20150348888
Publication date
Dec 3, 2015
INTERNATIONAL RECTIFIER CORPORATION
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
Publication number
20150200265
Publication date
Jul 16, 2015
Sumitomo Electric Industries, Ltd.
Tetsuya Kumano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
Publication number
20140110796
Publication date
Apr 24, 2014
INTERNATIONAL RECTIFIER CORPORATION
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS