Gallium arsenide phosphide [GaAsP]

Industry

CPC
H01L2924/10342

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10342Gallium arsenide phosphide [GaAsP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,715,727
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,094,680
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 10,847,443
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip high speed components with underfill
- Patent number 10,811,279
- Issue date Oct 20, 2020
- Ciena Corporation
- Francois Pelletier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,510,654
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 10,510,735
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 10,157,899
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,157,825
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer dicing
- Patent number 10,014,269
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufacur...
- Patent number 9,984,969
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,953,966
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming three-dimensional integrated circuit (3DIC)...
- Patent number 9,929,050
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 9,831,156
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and method for wafer dicing
- Patent number 9,748,187
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufactu...
- Patent number 9,659,863
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 9,646,955
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 9,299,640
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing same
- Patent number 9,076,931
- Issue date Jul 7, 2015
- Osram Opto Semiconductors GmbH
- Wolfgang Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic device using the same
- Patent number 8,975,529
- Issue date Mar 10, 2015
- Kyocera Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20210375842
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20210043547
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Metal with Zigzagged Edges
- Publication number 20200083156
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Metal with Zigzagged Edges
- Publication number 20190122975
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20190115332
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20180145011
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20170317043
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...
- Publication number 20170256487
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES AND METHODS OF FORMING PACKAGES
- Publication number 20170229436
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND METHOD FOR WAFER DICING
- Publication number 20160181213
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS
- Publication number 20140340900
- Publication date Nov 20, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Stephen Bathurst
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optoelectronic Component and Method for Producing Same
- Publication number 20130264596
- Publication date Oct 10, 2013
- Osram Opto Semiconductors GmbH
- Wolfgang Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE
- Publication number 20130127037
- Publication date May 23, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20130027895
- Publication date Jan 31, 2013
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

Gallium arsenide phosphide [GaAsP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Front-to-back bonding with through-substrate via (TSV)

Packages and methods of forming packages

System on integrated chips and methods of forming same

Packages and methods of forming packages

System on integrated chips and methods of forming same

Dummy metal with zigzagged edges

Front-to-back bonding with through-substrate via (TSV)

Flip-chip high speed components with underfill

System on integrated chips and methods of forming same

Dummy metal with zigzagged edges

Packages and methods of forming packages

Packages and methods of forming packages

Dummy metal with zigzagged edges

Method for wafer dicing

Semiconductor devices, multi-die packages, and methods of manufacur...

Semiconductor device and method of forming the same

Mechanisms for forming three-dimensional integrated circuit (3DIC)...

Front-to-back bonding with through-substrate via (TSV)

Wafer structure and method for wafer dicing

Semiconductor devices, multi-die packages, and methods of manufactu...

Packages and methods of forming packages

Package systems including passive electrical components

Front-to-back bonding with through-substrate via (TSV)

Optoelectronic component and method for producing same

Interposer and electronic device using the same

Patents Applicationslast 30 patents

Packages and Methods of Forming Packages

System on Integrated Chips and Methods of Forming Same

Device and Method for UBM/RDL Routing

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

Dummy Metal with Zigzagged Edges

Device and Method for UBM/RDL Routing

Dummy Metal with Zigzagged Edges

Packages and Methods of Forming Packages

System on Integrated Chips and Methods of Forming Same

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

Device and Method for UBM/RDL Routing

METHOD FOR WAFER DICING

Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...

PACKAGES AND METHODS OF FORMING PACKAGES

WAFER STRUCTURE AND METHOD FOR WAFER DICING

STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS

Optoelectronic Component and Method for Producing Same

SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

INTERPOSER AND ELECTRONIC DEVICE USING THE SAME