Gallium [Ga] as principal constituent

Industry

CPC
H01L2224/29305

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29305Gallium [Ga] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive applications using alkali silicate glass for electronics
- Patent number 8,637,980
- Issue date Jan 28, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting terminals and method of mounting semicond...
- Patent number 7,524,748
- Issue date Apr 28, 2009
- Senju Metal Industry Co., Ltd.
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive connection with matrix material and randomly d...
- Patent number 5,445,308
- Issue date Aug 29, 1995
- Richard D. Nelson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally and electrically conductive adhesive material and method...
- Patent number 5,328,087
- Issue date Jul 12, 1994
- Microelectronics and Computer Technology Corporation
- Richard D. Nelson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
- Publication number 20240243033
- Publication date Jul 18, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BASE AND SEMICO...
- Publication number 20170229415
- Publication date Aug 10, 2017
- KABUSHIKI KAISHA TOSHIBA
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...
- Publication number 20110273847
- Publication date Nov 10, 2011
- Hong-Sik Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...
- Publication number 20110038124
- Publication date Feb 17, 2011
- Honeywell International Inc.
- Kikue S. Burnham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090023245
- Publication date Jan 22, 2009
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...
- Publication number 20070256761
- Publication date Nov 8, 2007
- Indium Corporation of America
- Hong-Sik Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of interconnecting terminals and method for mounting semicon...
- Publication number 20070001313
- Publication date Jan 4, 2007
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device including a substrate structure and a process for...
- Publication number 20060137901
- Publication date Jun 29, 2006
- Gang Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and materials for printing particle-enhanced electrical cont...
- Publication number 20040087128
- Publication date May 6, 2004
- Herbert J Neuhaus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Gallium [Ga] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface material, an integrated circuit formed therewith,...

Alternative compositions for high temperature soldering applications

Sintering pastes with high metal loading for semiconductor die atta...

Conductive connecting member and manufacturing method of same

Semiconductor packaging containing sintering die-attach material

Adhesive applications using alkali silicate glass for electronics

Flip chip mounting method and bump forming method

Flip chip mounting method and bump forming method

Method of interconnecting terminals and method of mounting semicond...

Thermally conductive connection with matrix material and randomly d...

Thermally and electrically conductive adhesive material and method...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

LIQUID METAL THERMAL INTERFACE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BASE AND SEMICO...

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...

Method of interconnecting terminals and method for mounting semicon...

Electronic device including a substrate structure and a process for...

Method and materials for printing particle-enhanced electrical cont...