Gallium [Ga] as principal constituent

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H01L2224/81405

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81405Gallium [Ga] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Electrical connector
- Patent number 9,439,298
- Issue date Sep 6, 2016
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,397,021
- Issue date Jul 19, 2016
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip-chip connection that uses gallium or...
- Patent number 7,750,484
- Issue date Jul 6, 2010
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit module
- Patent number 5,829,125
- Issue date Nov 3, 1998
- Taiyo Yuden Co., Ltd.
- Masayuki Fujimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240258218
- Publication date Aug 1, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090001571
- Publication date Jan 1, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS