Gallium [Ga] as principal constituent

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H01L2224/13605

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13605Gallium [Ga] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,495,441
- Issue date Dec 17, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,344,690
- Issue date Feb 5, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,333,554
- Issue date Dec 25, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL COATING FOR INDIUM BUMP BONDING
- Publication number 20110315429
- Publication date Dec 29, 2011
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with gold bumps, and method and apparatus of p...
- Publication number 20020100972
- Publication date Aug 1, 2002
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS