Gallium (Ga) as principal constituent

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H01L2224/45105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45105Gallium (Ga) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,721,660
- Issue date Aug 8, 2023
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag alloy bonding wire for semiconductor device
- Patent number 11,612,966
- Issue date Mar 28, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy bonding wire for semiconductor device
- Patent number 10,985,130
- Issue date Apr 20, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,571
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epitaxially growing GaN layers on silicon (100) wafers
- Patent number 9,006,083
- Issue date Apr 14, 2015
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230215834
- Publication date Jul 6, 2023
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20220266396
- Publication date Aug 25, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20210043599
- Publication date Feb 11, 2021
- NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20190326246
- Publication date Oct 24, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170194280
- Publication date Jul 6, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170110430
- Publication date Apr 20, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Gallium (Ga) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Ag alloy bonding wire for semiconductor device

Bonding wire for semiconductor devices

Method for processing an ultra-high density space interconnect lead...

Cu alloy bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Reliable wire method

Apparatus with a multi-layer coating and method of forming the same

Epitaxially growing GaN layers on silicon (100) wafers

Reliable wire structure and method

Semiconductor device including an insulating film and insulating pi...

Semiconductor device with improved bonding

Patents Applicationslast 30 patents

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

RELIABLE WIRE STRUCTURE AND METHOD

RELIABLE WIRE STRUCTURE AND METHOD

Apparatus with a Multi-Layer Coating and Method of Forming the Same

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device