Gallium phosphide [GaP]

Industry

CPC
H01L2924/10331

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10331Gallium phosphide [GaP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,502,039
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,158,557
- Issue date Oct 26, 2021
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced selective heating for microLED placement and bonding
- Patent number 10,998,286
- Issue date May 4, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,867,965
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 10,784,203
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,529,690
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer dicing
- Patent number 10,014,269
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufacur...
- Patent number 9,984,969
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern generator having stacked chips
- Patent number 9,865,550
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Chieh Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer structure and method for wafer dicing
- Patent number 9,748,187
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 9,728,490
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufactu...
- Patent number 9,659,863
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for wafer level package and methods of form...
- Patent number 9,659,896
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 8,641,859
- Issue date Feb 4, 2014
- Thin Materials AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages
- Publication number 20230075602
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210005554
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Forming the Same
- Publication number 20190109119
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366417
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20170317043
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...
- Publication number 20170256487
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing the Same
- Publication number 20170062308
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Ju-ll Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER STRUCTURE AND METHOD FOR WAFER DICING
- Publication number 20160181213
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS
- Publication number 20140340900
- Publication date Nov 20, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Stephen Bathurst
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20110272092
- Publication date Nov 10, 2011
- THIN MATERIALS AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Gallium phosphide [GaP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Semiconductor device with a passivation layer and method for produc...

System on integrated chips and methods of forming same

Semiconductor package and method

Semiconductor device and a method of manufacturing thereof

Semiconductor device with a passivation layer and method for produc...

System on integrated chips and methods of forming same

Laser-induced selective heating for microLED placement and bonding

Semiconductor device and a method of manufacturing thereof

Package structures and methods of forming the same

Method for permanently bonding wafers

Semiconductor package and method

Semiconductor device and a method of manufacturing thereof

System on integrated chips and methods of forming same

Package structures and methods of forming the same

Method for applying a bonding layer

Semiconductor device and a method of manufacturing thereof

Semiconductor arrangement, semiconductor system and method of formi...

Method for wafer dicing

Semiconductor devices, multi-die packages, and methods of manufacur...

Pattern generator having stacked chips

Wafer structure and method for wafer dicing

Semiconductor devices and methods of manufacturing the same

Semiconductor devices, multi-die packages, and methods of manufactu...

Interconnect structures for wafer level package and methods of form...

Method for applying a bonding layer

Package systems including passive electrical components

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Bonding method

Patents Applicationslast 30 patents

Semiconductor Packages

System on Integrated Chips and Methods of Forming Same

Device and Method for UBM/RDL Routing

Semiconductor Package and Method

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

Package Structures and Methods of Forming the Same

System on Integrated Chips and Methods of Forming Same

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

Device and Method for UBM/RDL Routing

METHOD FOR WAFER DICING

Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...

METHOD FOR PERMANENTLY BONDING WAFERS

Semiconductor Devices and Methods of Manufacturing the Same

METHOD FOR APPLYING A BONDING LAYER

WAFER STRUCTURE AND METHOD FOR WAFER DICING

STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

BONDING METHOD