Gas control

Industry

CPC
H01J37/32449

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32449Gas control

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, processing method, and non-transito...
- Patent number 12,368,043
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Akinori Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering apparatus and CVD mask coating method using the same
- Patent number 12,365,975
- Issue date Jul 22, 2025
- Samsung Display Co., Ltd.
- Sungmin Hur
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,368,027
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Takatoshi Orui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas analyzer apparatus
- Patent number 12,368,032
- Issue date Jul 22, 2025
- Atonarp Inc.
- Naoki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for supplying process gas into wafer process apparatus
- Patent number 12,359,318
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Horng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ion beam etching chamber with etching by-product redistributor
- Patent number 12,362,154
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming thermally stable carbon film
- Patent number 12,362,181
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Glow plasma stabilization
- Patent number 12,362,140
- Issue date Jul 15, 2025
- Servomex Group Limited
- Bahram Alizadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film stress control for plasma enhanced chemical vapor deposition
- Patent number 12,362,149
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,156
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas showerhead with controllable airflow distribution
- Patent number 12,351,916
- Issue date Jul 8, 2025
- PIOTECH INC.
- Zhenjie Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Porous inlet
- Patent number 12,351,915
- Issue date Jul 8, 2025
- Picosun Oy
- Marko Pudas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,354,849
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Gyeong min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin atomic layer deposition film accuracy thickness control
- Patent number 12,354,871
- Issue date Jul 8, 2025
- Lam Research Corporation
- Jun Qian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, substrate processing method, method...
- Patent number 12,354,848
- Issue date Jul 8, 2025
- Kokusai Electric Corporation
- Yasunori Ejiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform in situ cleaning and deposition
- Patent number 12,347,653
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Saket Rathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming plasma coating
- Patent number 12,347,652
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Lance A. Scudder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pressure control system for a multi-head processing chamber of a pl...
- Patent number 12,347,661
- Issue date Jul 1, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ignition in inductively coupled plasmas for workpiece proc...
- Patent number 12,347,677
- Issue date Jul 1, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Stephen E. Savas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and manufacturing method of semiconductor...
- Patent number 12,347,693
- Issue date Jul 1, 2025
- HITACHI HIGH-TECH CORPORATION
- Yu Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,347,645
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Shinya Morikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,347,651
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Koki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End point detection method and apparatus for anisotropic etching us...
- Patent number 12,347,663
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Shoichi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing apparatus with outer gas channel insert
- Patent number 12,340,981
- Issue date Jun 24, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chamber for improved precursor flow
- Patent number 12,340,979
- Issue date Jun 24, 2025
- Applied Materials, Inc.
- Tien Fak Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma-assisted and multi-step continuous preparation of...
- Patent number 12,340,982
- Issue date Jun 24, 2025
- Anhui University of Technology
- Yang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,341,020
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for backside deposition of a substrate
- Patent number 12,341,053
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Ronald Nasman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method and plasma processing apparatus
- Patent number 12,341,001
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Wakako Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma ultraviolet enhanced deposition
- Patent number 12,334,317
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS
- Publication number 20250239476
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Takamitsu TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PROTECTING OXYGEN-SENSITIVE TARGET MATERIALS...
- Publication number 20250239442
- Publication date Jul 24, 2025
- FHR Anlagenbau GmbH
- Sven HAEBERLEIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250239437
- Publication date Jul 24, 2025
- Hitachi High-Tech Corporation
- Makoto SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA MULTI-WAFER ASHING SYSTEM
- Publication number 20250237959
- Publication date Jul 24, 2025
- Rockwell Collins, Inc.
- Mark J. Reimer
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250226185
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuki MOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT SYSTEM
- Publication number 20250226189
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Toshiki AKAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250226207
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Yasunobu KOSHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250226223
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218743
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- In Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD
- Publication number 20250218732
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Seong Gil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS INCLUDING TH...
- Publication number 20250218734
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Sung Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS FLOW CONTROLLER, FLOW CONTROL METHOD USING THE SAME, AND SUBST...
- Publication number 20250216872
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seunghun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF CONTROLLING PLASMA CHARACTERISTIC, AND SYSTEM...
- Publication number 20250218730
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Dong Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD AND SUBSTRATE TREATMENT APPARATUS INCLUDING SHOWERHEAD
- Publication number 20250218731
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Je Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250215320
- Publication date Jul 3, 2025
- TOKYO ELECTRON LIMITED
- Ryo MATSUBARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ETCH SELECTIVITY CONTROL IN ATOMIC LAYER ETCHING
- Publication number 20250213650
- Publication date Jul 3, 2025
- LAM RESEARCH CORPORATION
- Andreas Fischer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218733
- Publication date Jul 3, 2025
- TES CO., LTD.
- Woo-Young CHUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD
- Publication number 20250218741
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Jin Hyeok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA INJECTION CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATE...
- Publication number 20250210314
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST ATOMIC LAYER ETCH
- Publication number 20250210363
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250210327
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE
- Publication number 20250210367
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Sonam Dorje SHERPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250210371
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Akihiro ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
- Publication number 20250201523
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Ji Hoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250201542
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Jinhyeok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PR...
- Publication number 20250201573
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Sonam Dorje SHERPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS GAS PROVIDING APPARATUS AND SUBSTRATE TREATING APPARATUS IN...
- Publication number 20250201524
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Tae Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR DEPOSITING A LAYER
- Publication number 20250201526
- Publication date Jun 19, 2025
- ASM IP HOLDING B.V.
- Daniele Piumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ABATEMENT TECHNOLOGY UTILIZING WATER VAPOR AND OXYGEN REAGENT
- Publication number 20250201539
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Colin John DICKINSON
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250201525
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Jinhyeok KIM
- H01 - BASIC ELECTRIC ELEMENTS

Gas control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus, processing method, and non-transito...

Sputtering apparatus and CVD mask coating method using the same

Substrate processing method and substrate processing apparatus

Gas analyzer apparatus

Mechanisms for supplying process gas into wafer process apparatus

Ion beam etching chamber with etching by-product redistributor

Methods of forming thermally stable carbon film

Glow plasma stabilization

Film stress control for plasma enhanced chemical vapor deposition

Substrate processing method and substrate processing apparatus

Gas showerhead with controllable airflow distribution

Porous inlet

Plasma processing apparatus

Ultrathin atomic layer deposition film accuracy thickness control

Substrate processing apparatus, substrate processing method, method...

Uniform in situ cleaning and deposition

Method for forming plasma coating

Pressure control system for a multi-head processing chamber of a pl...

Enhanced ignition in inductively coupled plasmas for workpiece proc...

Plasma processing method and manufacturing method of semiconductor...

Substrate processing method and substrate processing apparatus

Etching method and plasma processing apparatus

End point detection method and apparatus for anisotropic etching us...

Workpiece processing apparatus with outer gas channel insert

Semiconductor processing chamber for improved precursor flow

Method for plasma-assisted and multi-step continuous preparation of...

Substrate processing method and substrate processing apparatus

System for backside deposition of a substrate

Cleaning method and plasma processing apparatus

Remote plasma ultraviolet enhanced deposition

Patents Applicationslast 30 patents

ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS

METHOD AND DEVICE FOR PROTECTING OXYGEN-SENSITIVE TARGET MATERIALS...

PLASMA PROCESSING METHOD

PLASMA MULTI-WAFER ASHING SYSTEM

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE TREATMENT SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE TREATING APPARATUS AND METHOD

SHOWERHEAD ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS INCLUDING TH...

MASS FLOW CONTROLLER, FLOW CONTROL METHOD USING THE SAME, AND SUBST...

DEVICE AND METHOD OF CONTROLLING PLASMA CHARACTERISTIC, AND SYSTEM...

SHOWERHEAD AND SUBSTRATE TREATMENT APPARATUS INCLUDING SHOWERHEAD

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ETCH SELECTIVITY CONTROL IN ATOMIC LAYER ETCHING

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE TREATING APPARATUS AND METHOD

PLASMA INJECTION CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATE...

FAST ATOMIC LAYER ETCH

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SHOWERHEAD UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PR...

PROCESS GAS PROVIDING APPARATUS AND SUBSTRATE TREATING APPARATUS IN...

METHODS AND SYSTEMS FOR DEPOSITING A LAYER

PLASMA ABATEMENT TECHNOLOGY UTILIZING WATER VAPOR AND OXYGEN REAGENT

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD