Gas supply means

Industry

CPC
H01J37/3244

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/3244Gas supply means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Detaching and installing device for gas distribution plate of etchi...
- Patent number 12,230,480
- Issue date Feb 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ko Wei Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,230,474
- Issue date Feb 18, 2025
- Kokusai Electric Corporation
- Takeshi Yasui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process and device for diamond synthesis by CVD
- Patent number 12,227,834
- Issue date Feb 18, 2025
- DIAROTECH
- Horacio Tellez Oliva
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ex situ coating of chamber components for semiconductor processing
- Patent number 12,227,837
- Issue date Feb 18, 2025
- Lam Research Corporation
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,230,504
- Issue date Feb 18, 2025
- Kioxia Corporation
- Junji Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave plasma source for spatial plasma enhanced atomic layer de...
- Patent number 12,224,156
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Xiaopu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas mixing method to enhance plasma
- Patent number 12,224,159
- Issue date Feb 11, 2025
- SKY TECH INC.
- Ta-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conditioning of a processing chamber
- Patent number 12,221,694
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Pramit Manna
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Topographic selective deposition
- Patent number 12,224,160
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Shyam Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,224,157
- Issue date Feb 11, 2025
- HITACHI HIGH-TECH CORPORATION
- Yuki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,224,158
- Issue date Feb 11, 2025
- HITACHI HIGH-TECH CORPORATION
- Yoshinori Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and electrostatic chuck
- Patent number 12,217,943
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kohei Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing uniform films on moving substrates...
- Patent number 12,217,947
- Issue date Feb 4, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Michael Vergöhl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching method using perfluoropropyl carbinol
- Patent number 12,217,970
- Issue date Feb 4, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
To an inductively coupled plasma source
- Patent number 12,217,938
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- James Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film and plasma processing apparatus
- Patent number 12,217,973
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kosuke Ogasawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching features using a targeted deposition for selecti...
- Patent number 12,217,955
- Issue date Feb 4, 2025
- Lam Research Corporation
- Wenchi Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
DC bias in plasma process
- Patent number 12,217,936
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for metastable activated radical selective stri...
- Patent number 12,211,709
- Issue date Jan 28, 2025
- Lam Research Corporation
- Dengliang Yang
- B08 - CLEANING
Information Patent Grant
Flowable chemical vapor deposition of metal oxides
- Patent number 12,211,736
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Hurshvardhan Srivastava
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for treating substrate and method for treating a substrate
- Patent number 12,211,675
- Issue date Jan 28, 2025
- Semes Co., Ltd.
- Ji Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniformity control for plasma processing
- Patent number 12,211,677
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Vladimir Nagorny
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Joining techniques for composite ceramic bodies
- Patent number 12,211,685
- Issue date Jan 28, 2025
- Lam Research Corporation
- Karl Frederick Leeser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,205,799
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Isao Gunji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-induced temperature modification during atomic scale proce...
- Patent number 12,205,803
- Issue date Jan 21, 2025
- Kurt J. Lesker Company
- Gilbert Bruce Rayner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering apparatus, film formation method, and method for manufac...
- Patent number 12,205,805
- Issue date Jan 21, 2025
- Canon Kabushiki Kaisha
- Kazuya Demura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,198,937
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Koki Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of processing substrate, met...
- Patent number 12,195,854
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Teruo Yoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...
- Publication number 20250059645
- Publication date Feb 20, 2025
- Duck Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid...
- Publication number 20250062133
- Publication date Feb 20, 2025
- Mattson Technology, Inc.
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA CLEAN (RPC) DELIVERY INLET ADAPTER
- Publication number 20250062106
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Danae Nicole Kay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250062130
- Publication date Feb 20, 2025
- TOKYO ELECTRON LIMITED
- Yusuke TAKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE
- Publication number 20250054767
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20250054733
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Yirop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250051915
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Yuta NAKANE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD
- Publication number 20250054731
- Publication date Feb 13, 2025
- ULVAC, Inc.
- Kazuhiko Tonari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS MIXING METHOD TO ENHANCE PLASMA
- Publication number 20250054732
- Publication date Feb 13, 2025
- SKY TECH INC.
- TA-HAO KUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHOWERHEAD FACEPLATE CONFIGURATIONS
- Publication number 20250054734
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Bin LUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ASSEMBLED MONOLAYER DEPOSITION FROM LOW VAPOR PRESSURE ORGANIC...
- Publication number 20250054739
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS
- Publication number 20250054748
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Guangyan Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION CHAMBER SYSTEM DIFFUSER WITH INCREASED POWER EFFICIENCY
- Publication number 20250046578
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Changling Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEM...
- Publication number 20250043425
- Publication date Feb 6, 2025
- LAM RESEARCH CORPORATION
- Pratik Mankidy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA VESSEL CLEANING FOR ION BEAM SYSTEM
- Publication number 20250046586
- Publication date Feb 6, 2025
- VEECO INSTRUMENTS INC.
- Mohammad SAGHAYEZHIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCURRENT OR CYCLICAL ETCH AND DIRECTIONAL DEPOSITION
- Publication number 20250046601
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Morgan EVANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING
- Publication number 20250046635
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Sangchul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-LAYER ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250046579
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Hirotoshi SAKAUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING
- Publication number 20250046574
- Publication date Feb 6, 2025
- UVAT TECHNOLOGY CO.,LTD.
- YUAN-CHI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME
- Publication number 20250046584
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250038005
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Yoshihide YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FILLING TRENCHES ON SUBSTRATE SURFACE
- Publication number 20250037994
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Yoshio Susa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS STACK FOR CVD PLASMA TREATMENT
- Publication number 20250037976
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Anirudh K. Alewoor
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS DISTRIBUTION ASSEMBLIES FOR SEMICONDUCTOR DEVICES
- Publication number 20250037978
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Sanjeev Baluja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-FORMING METHOD AND FILM-FORMING APPARATUS
- Publication number 20250037991
- Publication date Jan 30, 2025
- TOKYO ELECTRON LIMITED
- Takashi CHIBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250038048
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PLASMA PROCESSING
- Publication number 20250037977
- Publication date Jan 30, 2025
- TOKYO ELECTRON LIMITED
- Barton Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actively Controlled gas inject FOR PROCESS Temperature CONTROL
- Publication number 20250037975
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MOUNTING CONNECTION STRUCTURE AND CORRESPONDING PLASMA PRO...
- Publication number 20250029814
- Publication date Jan 23, 2025
- Advanced Micro-Fabrication Equipment Inc. China
- Mingming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250029817
- Publication date Jan 23, 2025
- JUSUNG ENGINEERING CO., LTD.
- WOONG KYO OH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Gas supply means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detaching and installing device for gas distribution plate of etchi...

Substrate processing apparatus, method of manufacturing semiconduct...

Process and device for diamond synthesis by CVD

Ex situ coating of chamber components for semiconductor processing

Plasma etching method and plasma etching apparatus

Microwave plasma source for spatial plasma enhanced atomic layer de...

Gas mixing method to enhance plasma

Conditioning of a processing chamber

Topographic selective deposition

Plasma processing apparatus and plasma processing method

Plasma processing apparatus

Substrate processing apparatus and electrostatic chuck

Method and device for producing uniform films on moving substrates...

Plasma etching method using perfluoropropyl carbinol

To an inductively coupled plasma source

FinFET device and method of forming same

Method of etching film and plasma processing apparatus

Method for etching features using a targeted deposition for selecti...

DC bias in plasma process

Systems and methods for metastable activated radical selective stri...

Flowable chemical vapor deposition of metal oxides

Apparatus for treating substrate and method for treating a substrate

Uniformity control for plasma processing

Joining techniques for composite ceramic bodies

Plasma processing apparatus

Pressure-induced temperature modification during atomic scale proce...

Plasma control method in semiconductor wafer fabrication

Sputtering apparatus, film formation method, and method for manufac...

Etching method and plasma processing apparatus

Substrate processing apparatus, method of processing substrate, met...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXI...

Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid...

REMOTE PLASMA CLEAN (RPC) DELIVERY INLET ADAPTER

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE

APPARATUS FOR PROCESSING A SUBSTRATE

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD

GAS MIXING METHOD TO ENHANCE PLASMA

SHOWERHEAD FACEPLATE CONFIGURATIONS

SELF-ASSEMBLED MONOLAYER DEPOSITION FROM LOW VAPOR PRESSURE ORGANIC...

ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS

DEPOSITION CHAMBER SYSTEM DIFFUSER WITH INCREASED POWER EFFICIENCY

SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEM...

PLASMA VESSEL CLEANING FOR ION BEAM SYSTEM

CONCURRENT OR CYCLICAL ETCH AND DIRECTIONAL DEPOSITION

SUBSTRATE PROCESSING

COPPER-LAYER ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS

CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING

APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

METHODS OF FILLING TRENCHES ON SUBSTRATE SURFACE

PROCESS STACK FOR CVD PLASMA TREATMENT

GAS DISTRIBUTION ASSEMBLIES FOR SEMICONDUCTOR DEVICES

FILM-FORMING METHOD AND FILM-FORMING APPARATUS

SUBSTRATE PROCESSING METHOD

APPARATUS AND METHOD FOR PLASMA PROCESSING

Actively Controlled gas inject FOR PROCESS Temperature CONTROL

FLEXIBLE MOUNTING CONNECTION STRUCTURE AND CORRESPONDING PLASMA PRO...

SUBSTRATE PROCESSING APPARATUS