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Void free low stress fill
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Patent number 11,978,666
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Issue date May 7, 2024
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Lam Research Corporation
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Anand Chandrashekar
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Gas transport system
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Patent number 11,971,057
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Issue date Apr 30, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd
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Jheng-Syun Li
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Thin film manufacturing apparatus
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Patent number 11,967,492
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Issue date Apr 23, 2024
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AP SYSTEMS INC.
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Byoung Il Lee
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Atomic layer deposition method
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Patent number 11,961,716
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Issue date Apr 16, 2024
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Industrial Technology Research Institute
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Hsuan-Fu Wang
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Substrate processing apparatus
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Patent number 11,961,714
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Issue date Apr 16, 2024
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Linco Technology Co., Ltd.
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Yi-Yuan Huang
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H01 - BASIC ELECTRIC ELEMENTS
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Deposition method
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Patent number 11,952,661
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Issue date Apr 9, 2024
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Tokyo Electron Limited
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Hitoshi Kato
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Film formation apparatus
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Patent number 11,955,367
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Issue date Apr 9, 2024
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SHIBAURA MECHATRONICS CORPORATION
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Shohei Tanabe
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H01 - BASIC ELECTRIC ELEMENTS
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