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Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
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Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
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Memory component for a system-on-chip device
Patent number
12,340,862
Issue date
Jun 24, 2025
Alberto Troia
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3D flash memory module chip and method of fabricating the same
Patent number
12,327,594
Issue date
Jun 10, 2025
Macronix International Co., Ltd.
Teng-Hao Yeh
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Semiconductor device with buried gate word line drivers
Patent number
12,322,475
Issue date
Jun 3, 2025
SK Hynix Inc.
Dong Hyun Lee
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DIMM socket with seating floor to meet both longer length edge cont...
Patent number
12,315,587
Issue date
May 27, 2025
Intel Corporation
Xiang Li
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Unified micro system with memory integrated circuit and logic integ...
Patent number
12,302,554
Issue date
May 13, 2025
Etron Technology, Inc.
Chao-Chun Lu
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Manufacturing method of forming a semiconductor memory device with...
Patent number
12,293,805
Issue date
May 6, 2025
SK hynix Inc.
Nam Jae Lee
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3D memory circuit
Patent number
12,293,108
Issue date
May 6, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Javier A. DeLaCruz
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Semiconductor memory device
Patent number
12,277,989
Issue date
Apr 15, 2025
Kioxia Corporation
Ryu Ogiwara
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Sub-word line driver placement for memory device
Patent number
12,254,919
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Tzu Chen
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Multi-deck non-volatile memory architecture with reduced terminatio...
Patent number
12,254,946
Issue date
Mar 18, 2025
Intel Corporation
William K. Waller
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Write driver boost circuit for memory cells
Patent number
12,254,918
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sanjeev Kumar Jain
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On-die termination of address and command signals
Patent number
12,249,399
Issue date
Mar 11, 2025
RAMBUS INC.
Ian Shaeffer
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Integrated assemblies and methods of forming integrated assemblies
Patent number
12,250,812
Issue date
Mar 11, 2025
Micron Technology, Inc.
Jordan D. Greenlee
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Memory systems with vertical integration
Patent number
12,249,390
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chieh Lee
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Integrated assemblies comprising vertically-stacked decks with inte...
Patent number
12,249,598
Issue date
Mar 11, 2025
Micron Technology, Inc.
Werner Juengling
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Memory system having combined high density, low bandwidth and low d...
Patent number
12,243,575
Issue date
Mar 4, 2025
Apple Inc.
Sukalpa Biswas
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Method and apparatus to perform a read of a column in a memory acce...
Patent number
12,237,040
Issue date
Feb 25, 2025
Intel Corporation
Sourabh Dongaonkar
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Semiconductor memory device with conductive layers separated betwee...
Patent number
12,230,326
Issue date
Feb 18, 2025
Kioxia Corporation
Keisuke Suda
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Semiconductor device and method for fabricating the same
Patent number
12,223,989
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Harry-Hak-Lay Chuang
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Drive circuit and memory device
Patent number
12,217,825
Issue date
Feb 4, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zhonglai Liu
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Integrated assemblies having transistor body regions coupled to car...
Patent number
12,219,758
Issue date
Feb 4, 2025
Micron Technology, Inc.
Kamal M. Karda
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Memory array, integrated circuit including the same, and manufactur...
Patent number
12,211,825
Issue date
Jan 28, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Sheng Yun
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Semiconductor storage device comprising a one-port SRAM cell formed...
Patent number
12,213,298
Issue date
Jan 28, 2025
SOCIONEXT INC.
Masanobu Hirose
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Semiconductor storage device
Patent number
12,213,312
Issue date
Jan 28, 2025
Kioxia Corporation
Kaihei Kato
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Tier expansion offset
Patent number
12,207,461
Issue date
Jan 21, 2025
Intel Corporation
Li Cheng
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Semiconductor device
Patent number
12,193,225
Issue date
Jan 7, 2025
Kioxia Corporation
Takatoshi Minamoto
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Computer system, memory device formed on a wafer on wafer stack in...
Patent number
12,189,954
Issue date
Jan 7, 2025
WHALECHIP CO., LTD.
Kun-Hua Tsai
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Deferred fractional memory row activation
Patent number
12,190,990
Issue date
Jan 7, 2025
RAMBUS INC.
James E. Harris
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Semiconductor memory device with a three-dimensional stacked memory...
Patent number
12,185,538
Issue date
Dec 31, 2024
Kioxia Corporation
Tomoo Hishida
H01 - BASIC ELECTRIC ELEMENTS
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Structures for word line multiplexing in three-dimensional memory a...
Patent number
12,176,020
Issue date
Dec 24, 2024
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
Publication number
20250210068
Publication date
Jun 26, 2025
Rambus Inc.
Thomas Vogelsang
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SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
Publication number
20250201280
Publication date
Jun 19, 2025
Samsung Electronics Co., Ltd.
Junsuk KIM
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Sub-Word Line Driver Placement For Memory Device
Publication number
20250201297
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Tzu Chen
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Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
Publication number
20250194088
Publication date
Jun 12, 2025
Micron Technology, Inc.
Jordan D. Greenlee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Write Driver Boost Circuit for Memory Cells
Publication number
20250191635
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sanjeev Kumar Jain
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Patent Application
MEMORY CHIP, LOGIC CHIP, CHIP STACK STRUCTURE, AND MEMORY
Publication number
20250192110
Publication date
Jun 12, 2025
CXMT Corporation
Jiarui ZHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MEMORY SYSTEMS WITH VERTICAL INTEGRATION
Publication number
20250182796
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chieh Lee
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Patent Application
STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY A...
Publication number
20250174264
Publication date
May 29, 2025
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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Patent Application
Integrated Assemblies Comprising Vertically-Stacked Decks
Publication number
20250174619
Publication date
May 29, 2025
Micron Technology, Inc.
Werner Juengling
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES WITH WRAP-AROUND ARRAYS
Publication number
20250166682
Publication date
May 22, 2025
Micron Technology, Inc.
Sujeet Ayyapureddi
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Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
Publication number
20250157520
Publication date
May 15, 2025
Apple Inc.
Sukalpa Biswas
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MEMORY WITH DEFERRED FRACTIONAL ROW ACTIVATION
Publication number
20250157503
Publication date
May 15, 2025
Rambus Inc.
James E. Harris
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Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
Publication number
20250157521
Publication date
May 15, 2025
Apple Inc.
Sukalpa Biswas
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
Publication number
20250140295
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Harry-Hak-Lay CHUANG
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Patent Application
FLASH MEMORY STRUCTURE
Publication number
20250142816
Publication date
May 1, 2025
UNITED MICROELECTRONICS CORP.
QIULONG WU
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Patent Application
STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY A...
Publication number
20250118341
Publication date
Apr 10, 2025
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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Patent Application
MEMORY DEVICES INCLUDING PAD STRUCTURES
Publication number
20250098159
Publication date
Mar 20, 2025
Micron Technology, Inc.
Erwin E. Yu
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Application
SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY...
Publication number
20250098166
Publication date
Mar 20, 2025
KIOXIA Corporation
Tomoo HISHIDA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
APPARATUSES AND METHODS FOR OPERATIONS IN A SELF-REFRESH STATE
Publication number
20250095708
Publication date
Mar 20, 2025
Lodestar Licensing Group LLC
Perry V. Lea
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES AND ADDITIONAL SL...
Publication number
20250098158
Publication date
Mar 20, 2025
Micron Technology, Inc.
Shuangqiang Luo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...
Publication number
20250087252
Publication date
Mar 13, 2025
Rambus Inc.
Yohan Frans
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Patent Application
MEMORY DEVICES INCLUDING CAPACITORS
Publication number
20250063719
Publication date
Feb 20, 2025
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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Patent Application
ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDI...
Publication number
20250038045
Publication date
Jan 30, 2025
Micron Technology, Inc.
Lorenzo Fratin
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Patent Application
On-Die Termination of Address and Command Signals
Publication number
20250037746
Publication date
Jan 30, 2025
Rambus Inc.
Ian Shaeffer
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Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION...
Publication number
20250031364
Publication date
Jan 23, 2025
Samsung Electronics Co., Ltd.
Geunwon Lim
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Patent Application
MEMORY DEVICE HAVING SUPPORT STRUCTURE
Publication number
20240420738
Publication date
Dec 19, 2024
SK HYNIX INC.
Jae Ho KIM
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MEMORY DEVICES AND RELATED METHODS
Publication number
20240422967
Publication date
Dec 19, 2024
Lodestar Licensing Group LLC
Kunal R. Parekh
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Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
Publication number
20240414912
Publication date
Dec 12, 2024
Samsung Electronics Co., Ltd.
Yoonjo Hwang
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Patent Application
MULTI-DIE MEMORY DEVICE
Publication number
20240404580
Publication date
Dec 5, 2024
Rambus Inc.
Scott C. Best
H01 - BASIC ELECTRIC ELEMENTS
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MEMORY MODULE WITH DISTRIBUTED DATA BUFFERS
Publication number
20240394177
Publication date
Nov 28, 2024
Netlist, Inc.
Hyun Lee
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