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Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
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Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
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DIMM socket with seating floor to meet both longer length edge cont...
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Unified micro system with memory integrated circuit and logic integ...
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12,302,554
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May 13, 2025
Etron Technology, Inc.
Chao-Chun Lu
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Manufacturing method of forming a semiconductor memory device with...
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12,293,805
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May 6, 2025
SK hynix Inc.
Nam Jae Lee
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3D memory circuit
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12,293,108
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May 6, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
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Semiconductor memory device
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12,277,989
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Apr 15, 2025
Kioxia Corporation
Ryu Ogiwara
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Sub-word line driver placement for memory device
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12,254,919
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Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Tzu Chen
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Multi-deck non-volatile memory architecture with reduced terminatio...
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12,254,946
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Mar 18, 2025
Intel Corporation
William K. Waller
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Write driver boost circuit for memory cells
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12,254,918
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Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sanjeev Kumar Jain
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Integrated assemblies and methods of forming integrated assemblies
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12,250,812
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Micron Technology, Inc.
Jordan D. Greenlee
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On-die termination of address and command signals
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12,249,399
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Mar 11, 2025
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Ian Shaeffer
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Memory systems with vertical integration
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12,249,390
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Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chieh Lee
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Integrated assemblies comprising vertically-stacked decks with inte...
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12,249,598
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Mar 11, 2025
Micron Technology, Inc.
Werner Juengling
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Memory system having combined high density, low bandwidth and low d...
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12,243,575
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Mar 4, 2025
Apple Inc.
Sukalpa Biswas
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Method and apparatus to perform a read of a column in a memory acce...
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12,237,040
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Feb 25, 2025
Intel Corporation
Sourabh Dongaonkar
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Semiconductor memory device with conductive layers separated betwee...
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12,230,326
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Feb 18, 2025
Kioxia Corporation
Keisuke Suda
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Semiconductor device and method for fabricating the same
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12,223,989
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Feb 11, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Harry-Hak-Lay Chuang
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Drive circuit and memory device
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12,217,825
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Feb 4, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zhonglai Liu
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Integrated assemblies having transistor body regions coupled to car...
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12,219,758
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Feb 4, 2025
Micron Technology, Inc.
Kamal M. Karda
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Memory array, integrated circuit including the same, and manufactur...
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12,211,825
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Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Sheng Yun
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SOCIONEXT INC.
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12,213,312
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Li Cheng
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Computer system, memory device formed on a wafer on wafer stack in...
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WHALECHIP CO., LTD.
Kun-Hua Tsai
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Deferred fractional memory row activation
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Jan 7, 2025
RAMBUS INC.
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Semiconductor memory device with a three-dimensional stacked memory...
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Kioxia Corporation
Tomoo Hishida
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Structures for word line multiplexing in three-dimensional memory a...
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12,176,020
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Dec 24, 2024
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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12,178,041
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Micron Technology, Inc.
Shuangqiang Luo
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Channel routing for simultaneous switching outputs
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12,176,065
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Dec 24, 2024
ATI Technologies ULC
Xuan Chen
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Microelectronic devices, and related memory devices and electronic...
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12,171,096
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Micron Technology, Inc.
Erwin E. Yu
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Integrated Assemblies Comprising Vertically-Stacked Decks
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20250174619
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May 29, 2025
Micron Technology, Inc.
Werner Juengling
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STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY A...
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20250174264
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May 29, 2025
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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20250166682
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May 22, 2025
Micron Technology, Inc.
Sujeet Ayyapureddi
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Memory System Having Combined High Density, Low Bandwidth and Low D...
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20250157520
Publication date
May 15, 2025
Apple Inc.
Sukalpa Biswas
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MEMORY WITH DEFERRED FRACTIONAL ROW ACTIVATION
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20250157503
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May 15, 2025
Rambus Inc.
James E. Harris
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20250157521
Publication date
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Apple Inc.
Sukalpa Biswas
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METHOD FOR FORMING SEMICONDUCTOR DEVICE
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20250140295
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May 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Harry-Hak-Lay CHUANG
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FLASH MEMORY STRUCTURE
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20250142816
Publication date
May 1, 2025
UNITED MICROELECTRONICS CORP.
QIULONG WU
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STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY A...
Publication number
20250118341
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Apr 10, 2025
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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MEMORY DEVICES INCLUDING PAD STRUCTURES
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20250098159
Publication date
Mar 20, 2025
Micron Technology, Inc.
Erwin E. Yu
B81 - MICRO-STRUCTURAL TECHNOLOGY
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SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY...
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20250098166
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Mar 20, 2025
KIOXIA Corporation
Tomoo HISHIDA
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APPARATUSES AND METHODS FOR OPERATIONS IN A SELF-REFRESH STATE
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20250095708
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Mar 20, 2025
Lodestar Licensing Group LLC
Perry V. Lea
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MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES AND ADDITIONAL SL...
Publication number
20250098158
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Mar 20, 2025
Micron Technology, Inc.
Shuangqiang Luo
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MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...
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20250087252
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Mar 13, 2025
Rambus Inc.
Yohan Frans
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MEMORY DEVICES INCLUDING CAPACITORS
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20250063719
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Feb 20, 2025
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
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ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDI...
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20250038045
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Jan 30, 2025
Micron Technology, Inc.
Lorenzo Fratin
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On-Die Termination of Address and Command Signals
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20250037746
Publication date
Jan 30, 2025
Rambus Inc.
Ian Shaeffer
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SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION...
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20250031364
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Jan 23, 2025
Samsung Electronics Co., Ltd.
Geunwon Lim
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MEMORY DEVICE HAVING SUPPORT STRUCTURE
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20240420738
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Dec 19, 2024
SK HYNIX INC.
Jae Ho KIM
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MEMORY DEVICES AND RELATED METHODS
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20240422967
Publication date
Dec 19, 2024
Lodestar Licensing Group LLC
Kunal R. Parekh
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SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
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20240414912
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Dec 12, 2024
Samsung Electronics Co., Ltd.
Yoonjo Hwang
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20240404580
Publication date
Dec 5, 2024
Rambus Inc.
Scott C. Best
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MEMORY MODULE WITH DISTRIBUTED DATA BUFFERS
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Netlist, Inc.
Hyun Lee
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METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT
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20240387475
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Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Sheng Yun
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SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...
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20240379568
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Micron Technology, Inc.
Kyle K. Kirby
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TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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20240373616
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Taiwan Semiconductor Manufacturing Company, Ltd.
Te-Hsin Chiu
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MICROELECTRONIC DEVICES AND MEMORY DEVICES
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Lodestar Licensing Group LLC
John D. Hopkins
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SK HYNIX INC.
Dong Uk LEE
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Lodestar Licensing Group LLC
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H01 - BASIC ELECTRIC ELEMENTS
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Samsung Electronics Co., Ltd.
Tong-Suk Kim
H01 - BASIC ELECTRIC ELEMENTS