Geometry aspects

Industry

CPC
G01R1/06733

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/06733Geometry aspects

Industries

Patents Grantslast 30 patents

Information Patent Grant
Inspection jig and inspection device
- Patent number 12,158,480
- Issue date Dec 3, 2024
- Nidec-Read Corporation
- Kohei Tsumura
- G01 - MEASURING TESTING
Information Patent Grant
Test socket
- Patent number 12,105,138
- Issue date Oct 1, 2024
- Leeno Industrial Inc.
- Young taek Shin
- G01 - MEASURING TESTING
Information Patent Grant
IC socket includes a base part with a contact pin and a sheet membe...
- Patent number 12,050,234
- Issue date Jul 30, 2024
- Enplas Corporation
- Kazutaka Koshiishi
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming probe head structure
- Patent number 12,019,097
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- G01 - MEASURING TESTING
Information Patent Grant
Contact pin and socket
- Patent number 11,821,917
- Issue date Nov 21, 2023
- Enplas Corporation
- Yuki Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
High-frequency test connector device, high frequency testing system...
- Patent number 11,747,364
- Issue date Sep 5, 2023
- Ingun Prüfmittelbau GmbH
- Thomas Schrodi
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,740,259
- Issue date Aug 29, 2023
- Renesas Electronics Corporation
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe head and probe card
- Patent number 11,733,267
- Issue date Aug 22, 2023
- MPI CORPORATION
- Che-Wei Lin
- G01 - MEASURING TESTING
Information Patent Grant
Test probe assembly and test socket
- Patent number 11,639,945
- Issue date May 2, 2023
- LEENO INDUSTRIAL INC.
- Jae-hwan Jeong
- G01 - MEASURING TESTING
Information Patent Grant
Probe for characteristic inspection of a connector
- Patent number 11,619,654
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Hajime Suemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact probe and corresponding testing head of an apparatus for te...
- Patent number 11,549,965
- Issue date Jan 10, 2023
- Technoprobe S.p.A.
- Daniele Perego
- G01 - MEASURING TESTING
Information Patent Grant
Probe card device and dual-arm probe
- Patent number 11,536,744
- Issue date Dec 27, 2022
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Kai-Chieh Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Contact probe and electrical connection jig
- Patent number 11,415,599
- Issue date Aug 16, 2022
- Nidec-Read Corporation
- Masami Yamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Cylindrical body and method for producing same
- Patent number 11,408,915
- Issue date Aug 9, 2022
- Nidec-Read Corporation
- Masami Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-conductive part protecting member for signal transmission c...
- Patent number 11,233,352
- Issue date Jan 25, 2022
- TSE CO., LTD.
- Chang Su Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card device and neck-like probe thereof
- Patent number 11,209,461
- Issue date Dec 28, 2021
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Wen-Tsung Lee
- G01 - MEASURING TESTING
Information Patent Grant
Probe
- Patent number 11,204,370
- Issue date Dec 21, 2021
- Kabushiki Kaisha Nihon Micronics
- Mika Nasu
- G01 - MEASURING TESTING
Information Patent Grant
Plate spring-type connecting pin
- Patent number 11,162,979
- Issue date Nov 2, 2021
- Sangyang Pak
- G01 - MEASURING TESTING
Information Patent Grant
Probe head with linear probe
- Patent number 11,143,674
- Issue date Oct 12, 2021
- MPI Corporation
- Tzu Yang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Low-force wafer test probes
- Patent number 11,131,689
- Issue date Sep 28, 2021
- International Business Machines Corporation
- David M. Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector having contact members
- Patent number 11,067,603
- Issue date Jul 20, 2021
- GITech Inc.
- John Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low force wafer test probe
- Patent number 11,029,334
- Issue date Jun 8, 2021
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Probe, inspection jig, and inspection apparatus
- Patent number 11,009,523
- Issue date May 18, 2021
- Nidec-Read Corporation
- Minoru Kato
- G01 - MEASURING TESTING
Information Patent Grant
High speed probe card device and rectangular probe
- Patent number 11,009,524
- Issue date May 18, 2021
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Wen-Tsung Lee
- G01 - MEASURING TESTING
Information Patent Grant
System, a tangent probe card and a probe head assembly for testing...
- Patent number 10,962,570
- Issue date Mar 30, 2021
- Wing Cheuk Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector pin device for testing semiconductor chip and method of m...
- Patent number 10,948,520
- Issue date Mar 16, 2021
- Jaesuk Oh
- G01 - MEASURING TESTING
Information Patent Grant
Testing apparatus and method for microcircuit testing with conical...
- Patent number 10,928,423
- Issue date Feb 23, 2021
- Johnstech International Corporation
- John DeBauche
- G01 - MEASURING TESTING
Information Patent Grant
Method for placing and contacting a test contact
- Patent number 10,914,759
- Issue date Feb 9, 2021
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Grant
Vertical probe card
- Patent number 10,884,026
- Issue date Jan 5, 2021
- TWINSOLUTION TECHNOLOGY (SUZHOU) LTD
- Yuanjun Shi
- G01 - MEASURING TESTING
Information Patent Grant
Clamp probe for non-contact electrical parameter measurement
- Patent number 10,775,409
- Issue date Sep 15, 2020
- Fluke Corporation
- Jeffrey Worones
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...
- Publication number 20240393368
- Publication date Nov 28, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...
- Publication number 20240393367
- Publication date Nov 28, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
CANTILEVER PROBE CARD DEVICE AND CANTILEVER PROBE MODULE
- Publication number 20240385222
- Publication date Nov 21, 2024
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- HAO-YEN CHENG
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND PROBE WITH STEPPED COLLAR FOR SEMICONDUCTOR INTEGRA...
- Publication number 20240377433
- Publication date Nov 14, 2024
- Smiths Interconnect Americas, Inc.
- Jiachun Zhou
- G01 - MEASURING TESTING
Information Patent Application
MEMBRANE PROBE CARD, METHOD OF MAKING THE SAME AND METHOD OF MAKING...
- Publication number 20240361355
- Publication date Oct 31, 2024
- MPI Corporation
- YU-SHAN HU
- G01 - MEASURING TESTING
Information Patent Application
Device for Handling a Test Contact
- Publication number 20240337677
- Publication date Oct 10, 2024
- Pac Tech - Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Application
CONTACT PROBE AND SOCKET FOR ELECTRICAL COMPONENT TESTING
- Publication number 20240329082
- Publication date Oct 3, 2024
- ENPLAS CORPORATION
- Yuta INOUE
- G01 - MEASURING TESTING
Information Patent Application
MEASUREMENT UNIT
- Publication number 20240302409
- Publication date Sep 12, 2024
- NHK Spring Co, Ltd.
- Tsuyoshi Inuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE HEAD STRUCTURE
- Publication number 20240302410
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
SOCKET
- Publication number 20240295584
- Publication date Sep 5, 2024
- YOKOWO CO., LTD.
- Daisuke HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PIN
- Publication number 20240288470
- Publication date Aug 29, 2024
- AWESOMENICS INC.
- Woo Yoel JEONG
- G01 - MEASURING TESTING
Information Patent Application
IC NOISE IMMUNITY DETECTION DEVICE AND IC NOISE IMMUNITY DETECTION...
- Publication number 20240280631
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAKAJI
- G01 - MEASURING TESTING
Information Patent Application
VOICE COIL LEAF SPRING PROBER
- Publication number 20240125847
- Publication date Apr 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy James VANDERWERF
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICALLY CONDUCTIVE CONTACT PIN
- Publication number 20240094248
- Publication date Mar 21, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
PROBE PIN
- Publication number 20240085456
- Publication date Mar 14, 2024
- LUKEN Technologies
- Yun Tae AN
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD, PROBE ASSEMBLY AND SPRING PROBE STRUCTURE INCLUDING THE...
- Publication number 20240085455
- Publication date Mar 14, 2024
- AZOTH STUDIO LTD. CO.
- Zhou Yi Lin
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE PROBE FOR MICROLED DEFECT DETECTION AND MANUFACTURING METH...
- Publication number 20240085493
- Publication date Mar 14, 2024
- INSTITUTE OF FLEXIBLE ELECTRONICS TECHNOLOGY OF THU, ZHEJIANG
- Xian Huang
- G01 - MEASURING TESTING
Information Patent Application
PROBE ARRAY AND PROBE STRUCTURE
- Publication number 20240053381
- Publication date Feb 15, 2024
- STAR TECHNOLOGIES, INC.
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
TEST PROBES AND TEST SOCKET FOR USE WITH THE SAME
- Publication number 20240036072
- Publication date Feb 1, 2024
- HIROSE ELECTRIC CO., LTD.
- Tatsuya ARAI
- G01 - MEASURING TESTING
Information Patent Application
SOCKET AND INSPECTION SOCKET
- Publication number 20240019459
- Publication date Jan 18, 2024
- ENPLAS CORPORATION
- Kazutaka KOSHIISHI
- G01 - MEASURING TESTING
Information Patent Application
MICROBUMP CLUSTER PROBING ARCHITECTURE FOR 2.5D AND 3D DIES
- Publication number 20230314479
- Publication date Oct 5, 2023
- Intel Corporation
- Jagat SHAKYA
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230266362
- Publication date Aug 24, 2023
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONEN...
- Publication number 20230243870
- Publication date Aug 3, 2023
- Microfabrica Inc.
- Arun S. Veeramani
- G01 - MEASURING TESTING
Information Patent Application
Probes with Planar Unbiased Spring Elements for Electronic Componen...
- Publication number 20230243872
- Publication date Aug 3, 2023
- Microfabrica Inc.
- Arun S. Veeramani
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET
- Publication number 20230228808
- Publication date Jul 20, 2023
- LENO INDUSTRIAL INC.
- Young taek SHIN
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION JIG AND INSPECTION DEVICE
- Publication number 20230138341
- Publication date May 4, 2023
- NIDEC READ CORPORATION
- Kohei TSUMURA
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230065443
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL PROBE, PROBE CARD, MEASURING SYSTEM, AND MEASURING METHOD
- Publication number 20230038088
- Publication date Feb 9, 2023
- Kabushiki Kaisha Nihon Micronics
- Michitaka OKUTA
- G01 - MEASURING TESTING
Information Patent Application
MEASUREMENT UNIT
- Publication number 20220196704
- Publication date Jun 23, 2022
- NHK Spring Co., Ltd.
- Tsuyoshi Inuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD DEVICE AND DUAL-ARM PROBE
- Publication number 20220170960
- Publication date Jun 2, 2022
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- KAI-CHIEH HSIEH
- G01 - MEASURING TESTING

Geometry aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inspection jig and inspection device

Test socket

IC socket includes a base part with a contact pin and a sheet membe...

Method for forming probe head structure

Contact pin and socket

High-frequency test connector device, high frequency testing system...

Method of manufacturing semiconductor device

Probe head and probe card

Test probe assembly and test socket

Probe for characteristic inspection of a connector

Contact probe and corresponding testing head of an apparatus for te...

Probe card device and dual-arm probe

Contact probe and electrical connection jig

Cylindrical body and method for producing same

Electro-conductive part protecting member for signal transmission c...

Probe card device and neck-like probe thereof

Probe

Plate spring-type connecting pin

Probe head with linear probe

Low-force wafer test probes

Connector having contact members

Low force wafer test probe

Probe, inspection jig, and inspection apparatus

High speed probe card device and rectangular probe

System, a tangent probe card and a probe head assembly for testing...

Connector pin device for testing semiconductor chip and method of m...

Testing apparatus and method for microcircuit testing with conical...

Method for placing and contacting a test contact

Vertical probe card

Clamp probe for non-contact electrical parameter measurement

Patents Applicationslast 30 patents

PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...

PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMI...

CANTILEVER PROBE CARD DEVICE AND CANTILEVER PROBE MODULE

TEST SOCKET AND PROBE WITH STEPPED COLLAR FOR SEMICONDUCTOR INTEGRA...

MEMBRANE PROBE CARD, METHOD OF MAKING THE SAME AND METHOD OF MAKING...

Device for Handling a Test Contact

CONTACT PROBE AND SOCKET FOR ELECTRICAL COMPONENT TESTING

MEASUREMENT UNIT

PROBE HEAD STRUCTURE

SOCKET

TEST PIN

IC NOISE IMMUNITY DETECTION DEVICE AND IC NOISE IMMUNITY DETECTION...

VOICE COIL LEAF SPRING PROBER

ELECTRICALLY CONDUCTIVE CONTACT PIN

PROBE PIN

PROBE HEAD, PROBE ASSEMBLY AND SPRING PROBE STRUCTURE INCLUDING THE...

FLEXIBLE PROBE FOR MICROLED DEFECT DETECTION AND MANUFACTURING METH...

PROBE ARRAY AND PROBE STRUCTURE

TEST PROBES AND TEST SOCKET FOR USE WITH THE SAME

SOCKET AND INSPECTION SOCKET

MICROBUMP CLUSTER PROBING ARCHITECTURE FOR 2.5D AND 3D DIES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONEN...

Probes with Planar Unbiased Spring Elements for Electronic Componen...

TEST SOCKET

INSPECTION JIG AND INSPECTION DEVICE

PROBE HEAD STRUCTURE AND METHOD FOR FORMING THE SAME

OPTICAL PROBE, PROBE CARD, MEASURING SYSTEM, AND MEASURING METHOD

MEASUREMENT UNIT

PROBE CARD DEVICE AND DUAL-ARM PROBE