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Glass ceramic coating

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  • CPC
  • H05K2201/017
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/017Glass ceramic coating
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250194004
    • Publication date Jun 12, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Mi Sun Hwang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250185162
    • Publication date Jun 5, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126715
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Hak KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
    • Publication number 20250106997
    • Publication date Mar 27, 2025
    • Intel Corporation
    • Ehsan ZAMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20250039529
    • Publication date Jan 30, 2025
    • LG Innotek Co., Ltd.
    • JONG HO CHUNG
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ULTRAVIOLET-CURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, INSULATIN...
    • Publication number 20250026917
    • Publication date Jan 23, 2025
    • PELNOX, LTD.
    • Kazuki KIMURA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    SILICA GLASS SUBSTRATE
    • Publication number 20240407089
    • Publication date Dec 5, 2024
    • AGC Inc.
    • Kent SUGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
    • Publication number 20240287347
    • Publication date Aug 29, 2024
    • Mitsubishi Gas Chemical Company, Inc.
    • Yune KUMAZAWA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
    • Publication number 20240268022
    • Publication date Aug 8, 2024
    • NOF Corporation
    • Toshinobu FUJIMURA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240237201
    • Publication date Jul 11, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
    • Publication number 20240222295
    • Publication date Jul 4, 2024
    • Intel Corporation
    • Mahdi Mohammadighaleni
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF
    • Publication number 20240206050
    • Publication date Jun 20, 2024
    • WUHAN TIANMA MICROELECTRONICS CO., LTD.
    • Xuejing XIAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240196524
    • Publication date Jun 13, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • CHIKARA OHMORI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
    • Publication number 20240064907
    • Publication date Feb 22, 2024
    • FICT LIMITED
    • Taiji Sakai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
    • Publication number 20240064895
    • Publication date Feb 22, 2024
    • DENKA COMPANY LIMITED
    • Kenji MIYATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240040694
    • Publication date Feb 1, 2024
    • Murata Manufacturing Co., Ltd.
    • Tomoki YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20240040695
    • Publication date Feb 1, 2024
    • Murata Manufacturing Co., Ltd.
    • Tomoya OOSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
    • Publication number 20230309213
    • Publication date Sep 28, 2023
    • HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
    • Thomas Matthew Selter
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230309217
    • Publication date Sep 28, 2023
    • TORAY INDUSTRIES, INC.
    • Ryutaro IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
    • Publication number 20230247759
    • Publication date Aug 3, 2023
    • Shin-Etsu Chemical Co., Ltd.
    • Toshio SHIOBARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230071257
    • Publication date Mar 9, 2023
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
    • Publication number 20230025748
    • Publication date Jan 26, 2023
    • HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
    • Thomas Matthew Selter
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
    • Publication number 20230022285
    • Publication date Jan 26, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Nobuyuki Terasaki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAMINATED SHEET FOR METAL-CLAD LAMINATE, METHOD OF MANUFACTURING LA...
    • Publication number 20230013404
    • Publication date Jan 19, 2023
    • FUJIFILM CORPORATION
    • Takahiko ICHIKI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PACKAGING STRUCTURE FOR CIRCUIT UNITS
    • Publication number 20220408549
    • Publication date Dec 22, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Haisheng Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
    • Publication number 20220248526
    • Publication date Aug 4, 2022
    • Shin-Etsu Chemical Co., Ltd.
    • Toshio SHIOBARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMALLY CONDUCTIVE BOARD
    • Publication number 20220201856
    • Publication date Jun 23, 2022
    • POLYTRONICS TECHNOLOGY CORP.
    • KUO HSUN CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
    • Publication number 20220141965
    • Publication date May 5, 2022
    • Murata Manufacturing Co., Ltd.
    • Yusuke KAMITSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ceramic Copper Circuit Board And Method For Manufacturing The Same
    • Publication number 20220104350
    • Publication date Mar 31, 2022
    • Kabushiki Kaisha Toshiba
    • Hiromasa KATO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Ceramic Copper Circuit Board And Method For Manufacturing The Same
    • Publication number 20220104351
    • Publication date Mar 31, 2022
    • Kabushiki Kaisha Toshiba
    • Hiromasa KATO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR