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H01L2924/15788

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15788Glasses

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Illumination apparatus
- Patent number 11,994,268
- Issue date May 28, 2024
- Optovate Limited
- Jonathan Harrold
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of inspecting the same
- Patent number 11,715,701
- Issue date Aug 1, 2023
- Kioxia Corporation
- Yuusuke Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna on interposer substrate
- Patent number 11,715,668
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jr Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination apparatus
- Patent number 11,629,847
- Issue date Apr 18, 2023
- Optovate Limited
- Jonathan Harrold
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 11,502,392
- Issue date Nov 15, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device package including conformal m...
- Patent number 11,488,842
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple coplanar interposers
- Patent number 11,469,210
- Issue date Oct 11, 2022
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 11,437,707
- Issue date Sep 6, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,424,220
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass interposer module, imaging device, and electronic apparatus
- Patent number 11,410,896
- Issue date Aug 9, 2022
- Sony Corporation
- Mitsuo Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing mounting substrate and method of manufactur...
- Patent number 11,370,047
- Issue date Jun 28, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiizu Ootorii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 11,315,896
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number RE49045
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
Information Patent Grant
Light emitting device
- Patent number RE49047
- Issue date Apr 19, 2022
- Nichia Corporation
- Ryoma Suenaga
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266321
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS
- Publication number 20240194548
- Publication date Jun 13, 2024
- Intel Corporation
- Kristof Darmawikarta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...
- Publication number 20240170351
- Publication date May 23, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY
- Publication number 20240063127
- Publication date Feb 22, 2024
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20240019106
- Publication date Jan 18, 2024
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20230137296
- Publication date May 4, 2023
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A HYBRID BONDED INTERPOSER FOR D...
- Publication number 20220399294
- Publication date Dec 15, 2022
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED BRIDGE BETWEEN A PACKAGE AND A COMPONENT
- Publication number 20220384330
- Publication date Dec 1, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367414
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...
- Publication number 20220320028
- Publication date Oct 6, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND METHOD OF MANUFACTUR...
- Publication number 20220234126
- Publication date Jul 28, 2022
- Sony Semiconductor Solutions Corporation
- Hiizu OOTORII
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Illumination apparatus
- Publication number 20220205615
- Publication date Jun 30, 2022
- Optovate Limited
- Jonathan HARROLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CARRIER FOR DIE-UP FAN-OUT PACKAGING AND METHODS FOR MAKING T...
- Publication number 20220149004
- Publication date May 12, 2022
- Corning Incorporated
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20220026047
- Publication date Jan 27, 2022
- Optovate Limited
- Jonathan HARROLD
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210366871
- Publication date Nov 25, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
- Publication number 20210335668
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jr Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...
- Publication number 20210225793
- Publication date Jul 22, 2021
- AG MATERIALS TECHNOLOGY CO.,LTD.
- Hsing-Hua TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210090906
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Packaging Method for Antenna
- Publication number 20210083362
- Publication date Mar 18, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020591
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020606
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Feeder Package Structure and Packaging Method
- Publication number 20200411948
- Publication date Dec 31, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20200355349
- Publication date Nov 12, 2020
- RealD Spark, LLC
- Jonathan HARROLD
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200235131
- Publication date Jul 23, 2020
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-hole electrode substrate

Methods and devices for fabricating and assembling printable semico...

Illumination apparatus

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Hybrid felts of electrospun nanofibers

Anisotropic conductive film and method of producing the same

Semiconductor device and method of inspecting the same

Integrated antenna on interposer substrate

Anisotropic conductive film and method of producing the same

Illumination apparatus

Semiconductor device comprising semiconductor die and interposer an...

Chip assembly

Packaging structure and packaging method for antenna

Method of making semiconductor device package including conformal m...

Silver nano-twinned thin film structure and method for forming the...

Semiconductor package with multiple coplanar interposers

Antenna feeder package structure and packaging method

Semiconductor structure and manufacturing method thereof

Three dimensional integrated circuit (3DIC) with support structures

Glass interposer module, imaging device, and electronic apparatus

Anisotropic conductive film and method of producing the same

Method of manufacturing mounting substrate and method of manufactur...

Through-hole electrode substrate

Anisotropic conductive film and method of producing the same

Conical-shaped or tier-shaped pillar connections

Package on package devices and methods of packaging semiconductor dies

Light emitting device

Integrated interposer solutions for 2D and 3D IC packaging

Patents Applicationslast 30 patents

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

THROUGH-HOLE ELECTRODE SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...

CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY

Illumination apparatus

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Illumination apparatus

MICROELECTRONIC ASSEMBLIES HAVING A HYBRID BONDED INTERPOSER FOR D...

HIGH SPEED BRIDGE BETWEEN A PACKAGE AND A COMPONENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...

METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND METHOD OF MANUFACTUR...

Illumination apparatus

GLASS CARRIER FOR DIE-UP FAN-OUT PACKAGING AND METHODS FOR MAKING T...

Illumination apparatus

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE

SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...

Semiconductor Device and Method

Packaging Structure and Packaging Method for Antenna

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Antenna Feeder Package Structure and Packaging Method

Illumination apparatus

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME