Glasses

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Industry

CPC
H01L2224/05788

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05788Glasses

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,453,819
- Issue date Oct 22, 2019
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for fabricating glass substrate package
- Patent number 10,096,565
- Issue date Oct 9, 2018
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20190027459
- Publication date Jan 24, 2019
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
- Publication number 20170207188
- Publication date Jul 20, 2017
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS