Glasses

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CPC
H01L2224/05188

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05188Glasses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,658,315
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,153,241
- Issue date Dec 11, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takemasa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,759,177
- Issue date Jul 20, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION LAYER FOR SEMICONDUCTOR DEVICE
- Publication number 20230402405
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230209926
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Shinhyuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER GLASS SUBSTRATE
- Publication number 20230197618
- Publication date Jun 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20200144208
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20190304939
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180218987
- Publication date Aug 2, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takemasa WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070037337
- Publication date Feb 15, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution layer metallic structure and method

Redistribution layer metallic structure and method

Semiconductor apparatus

Redistribution layer metallic structure and method

Redistribution layer metallic structure and method

Semiconductor device and method of manufacturing the same

Semiconductor device and method for producing the same

Manufacturing method of semiconductor device

Patents Applicationslast 30 patents

PROTECTION LAYER FOR SEMICONDUCTOR DEVICE

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

MULTILAYER GLASS SUBSTRATE

Redistribution Layer Metallic Structure and Method

Redistribution Layer Metallic Structure and Method

Redistribution Layer Metallic Structure and Method

Redistribution Layer Metallic Structure and Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Manufacturing method of semiconductor device