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H01L2224/29488

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29488Glasses

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Patents Grantslast 30 patents

Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS FOR USE IN ELECTRONICS DEVICES
- Publication number 20080054227
- Publication date Mar 6, 2008
- National Starch and Chemical Investment Holding Corporation
- Demetrius McCormick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compositions for use in electronics devices
- Publication number 20050247916
- Publication date Nov 10, 2005
- Demetrius McCormick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR