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Gold [Au] as principal constituent
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CPC
H01L2224/13944
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13944
Gold [Au] as principal constituent
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic packages with nanoparticle joining
Patent number
9,397,063
Issue date
Jul 19, 2016
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Microelectronic packages with nanoparticle joining
Patent number
9,030,001
Issue date
May 12, 2015
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Microelectronic packages with nanoparticle joining
Patent number
8,580,607
Issue date
Nov 12, 2013
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
Patent number
8,418,910
Issue date
Apr 16, 2013
Fujitsu Limited
Takatoyo Yamakami
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
Publication number
20140077351
Publication date
Mar 20, 2014
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
Publication number
20120211549
Publication date
Aug 23, 2012
Fujitsu Limited
Takatoyo YAMAKAMI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
Publication number
20120025365
Publication date
Feb 2, 2012
Tessera Research LLC
Belgacem Haba
B82 - NANO-TECHNOLOGY