Gold [Au] as principal constituent

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H01L2224/13444

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13444Gold [Au] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,343,389
- Issue date May 17, 2016
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic conductive resin, and electronic device including elastic c...
- Patent number 7,875,807
- Issue date Jan 25, 2011
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...
- Publication number 20190206822
- Publication date Jul 4, 2019
- Intel Corporation
- Ji Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20090246474
- Publication date Oct 1, 2009
- Panasonic Corporation
- Daisuke Sakurai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
- Publication number 20070132098
- Publication date Jun 14, 2007
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Elastic conductive resin, and electronic device including elastic c...
- Publication number 20040108133
- Publication date Jun 10, 2004
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering materials and attachment methods using same

Engineered polymer-based electronic materials

Magnetic contacts

Magnetic contacts

Solder and electrically conductive adhesive based interconnection f...

Elastic conductive resin, and electronic device including elastic c...

Semiconductor device, mounting circuit board, method of producing t...

Wiring board and fabricating method thereof, semiconductor device a...

Wiring board and fabricating method thereof, semiconductor device a...

Patents Applicationslast 30 patents

MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...

FORMATION OF CONDUCTIVE CIRCUIT

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...

ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...

Circuit substrate for packaging semiconductor device, method for pr...

Elastic conductive resin, and electronic device including elastic c...

Wiring board and fabricating method thereof, semiconductor device a...

Semiconductor device, mounting circuit board, method of producing t...

Wiring board and fabricating method thereof, semiconductor device a...