Gold [Au] as principal constituent

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H01L2224/29244

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29244Gold [Au] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,856,828
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and substrate with dimple region
- Patent number 11,842,968
- Issue date Dec 12, 2023
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,652,196
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device, sintered metal sheet, and method for manufact...
- Patent number 11,437,338
- Issue date Sep 6, 2022
- Hitachi, Ltd.
- Tomohisa Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and manufacturing method for power semic...
- Patent number 11,342,281
- Issue date May 24, 2022
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,145,706
- Issue date Oct 12, 2021
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device package
- Patent number 11,094,865
- Issue date Aug 17, 2021
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Byung Yeon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device package
- Patent number 11,063,196
- Issue date Jul 13, 2021
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Byung Yeon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic sintered bonding body and die bonding method
- Patent number 11,024,598
- Issue date Jun 1, 2021
- Senju Metal Industry Co., Ltd.
- Tetsu Takemasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image display device
- Patent number 10,763,249
- Issue date Sep 1, 2020
- SHARP KABUSHIKI KAISHA
- Katsuji Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power semiconductor device having void filled with resin
- Patent number 10,468,368
- Issue date Nov 5, 2019
- Mitsubishi Electric Corporation
- Sho Kumada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 10,180,288
- Issue date Jan 15, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 9,601,452
- Issue date Mar 21, 2017
- Northrup Grumman Systems Corporation
- John A. Starkovich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20220254738
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220093719
- Publication date Mar 24, 2022
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion Soldering with Contaminant Protection
- Publication number 20220084981
- Publication date Mar 17, 2022
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20220028820
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...
- Publication number 20210265298
- Publication date Aug 26, 2021
- Hitachi, Ltd
- Tomohisa SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111325
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200403054
- Publication date Dec 24, 2020
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20200251423
- Publication date Aug 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20200172767
- Publication date Jun 4, 2020
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD
- Publication number 20190393188
- Publication date Dec 26, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Tetsu TAKEMASA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMAGE DISPLAY DEVICE
- Publication number 20190371777
- Publication date Dec 5, 2019
- Sharp Kabushiki Kaisha
- KATSUJI IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20190341536
- Publication date Nov 7, 2019
- LG Innotek Co., Ltd.
- Byung Yeon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20190241771
- Publication date Aug 8, 2019
- Hitachi Chemical Company, Ltd.
- Takashi TATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20190103374
- Publication date Apr 4, 2019
- Mitsubishi Electric Corporation
- Sho KUMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...
- Publication number 20180033760
- Publication date Feb 1, 2018
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Shinji ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION
- Publication number 20170369746
- Publication date Dec 28, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
- Publication number 20170326640
- Publication date Nov 16, 2017
- Heraeus Deutschland GmbH & Co. KG
- Wolfgang SCHMITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS
- Publication number 20160372438
- Publication date Dec 22, 2016
- Northrop Grumman Systems Corporation
- John A. Starkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
POWER CONVERTER
- Publication number 20120235162
- Publication date Sep 20, 2012
- KABUSHIKI KAISHA YASKAWA DENKI
- Tasuku ISOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120211764
- Publication date Aug 23, 2012
- Fujitsu Limited,
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diffusion soldering with contaminant protection

Display device and method of manufacturing the same

Power semiconductor device and substrate with dimple region

Semiconductor device including a solder compound containing a compo...

Electroconductive film, roll, connected structure, and process for...

Display module and manufacturing method thereof

Diffusion soldering with contaminant protection

Metal paste for joints, assembly, production method for assembly, s...

Semiconductor device, sintered metal sheet, and method for manufact...

Power semiconductor device and manufacturing method for power semic...

Display device and method of manufacturing the same

Semiconductor device and semiconductor device package

Semiconductor device including a solder compound containing a compo...

Semiconductor device and semiconductor device package

Metallic sintered bonding body and die bonding method

Method and apparatus for creating a bond between objects based on f...

Microelectronic components having integrated heat dissipation posts...

Image display device

Sintering pastes with high metal loading for semiconductor die atta...

Electrically conductive composition

Assembly and semiconductor device

Power semiconductor device having void filled with resin

Microelectronic components having integrated heat dissipation posts...

High-conductivity bonding of metal nanowire arrays

High-conductivity bonding of metal nanowire arrays

Joint material, and jointed body

Patents Applicationslast 30 patents

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Diffusion Soldering with Contaminant Protection

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

ELECTROCONDUCTIVE ADHESIVE

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD

IMAGE DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

POWER SEMICONDUCTOR DEVICE

ASSEMBLY AND SEMICONDUCTOR DEVICE

CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...

ELECTRICALLY CONDUCTIVE COMPOSITION

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...

HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS

Joint Material, and Jointed Body

POWER CONVERTER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE