Gold (Au) as principal constituent

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H01L2224/85544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85544Gold (Au) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Die package structure
- Patent number 9,299,626
- Issue date Mar 29, 2016
- Shih-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE PACKAGE STRUCTURE
- Publication number 20140197524
- Publication date Jul 17, 2014
- Shih-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS