Membership
Tour
Register
Log in
Gold [Au] as principal constituent
Follow
Industry
CPC
H01L2224/05944
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/05944
Gold [Au] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Patents Applications
last 30 patents
Information
Patent Application
Method for Producing a Metal Layer on a Substrate and Device
Publication number
20120292773
Publication date
Nov 22, 2012
INFINEON TECHNOLOGIES AG
Khalil Hosseini
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...