Gold (Au) as principal constituent

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H01L2224/45644

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45644Gold (Au) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire
- Patent number 12,132,025
- Issue date Oct 29, 2024
- Nippon Micrometal Corporation
- Takashi Yamada
- C21 - METALLURGY OF IRON
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for electrically connecting contact surfaces of electronic...
- Patent number 11,791,309
- Issue date Oct 17, 2023
- HERAEUS MATERIALS SINGAPORE PTE. LTD.
- Yean Mee Pun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,721,660
- Issue date Aug 8, 2023
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold-coated silver bonding wire and manufacturing method thereof, a...
- Patent number 11,289,442
- Issue date Mar 29, 2022
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented shielding using wirebonds
- Patent number 11,127,689
- Issue date Sep 21, 2021
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,570
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 10,622,531
- Issue date Apr 14, 2020
- Nichia Corporation
- Yasuo Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,529,683
- Issue date Jan 7, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
- Publication number 20240404980
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- MUHAMAD RIDHWAN HAFIZ BIN ROSDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290744
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THI...
- Publication number 20240178166
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230215834
- Publication date Jul 6, 2023
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE
- Publication number 20220157766
- Publication date May 19, 2022
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...
- Publication number 20220037284
- Publication date Feb 3, 2022
- Heraeus Materials Singapore Pte. Ltd.
- Yean M. Pun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20210050321
- Publication date Feb 18, 2021
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, A...
- Publication number 20200350273
- Publication date Nov 5, 2020
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED SHIELDING USING WIREBONDS
- Publication number 20190371738
- Publication date Dec 5, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190189584
- Publication date Jun 20, 2019
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS

Gold (Au) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire

Bonding wire for semiconductor devices

Palladium-coated copper bonding wire and method for manufacturing same

Chip package, method of forming a chip package and method of formin...

Palladium-coated copper bonding wire, manufacturing method of palla...

Bonding wire for semiconductor devices

Palladium-coated copper bonding wire, wire bonding structure, semic...

Semiconductor device packages with high angle wire bonding and non-...

Process for electrically connecting contact surfaces of electronic...

Bonding wire for semiconductor devices

Noble metal-coated silver wire for ball bonding and method for prod...

Gold-coated silver bonding wire and manufacturing method thereof, a...

Segmented shielding using wirebonds

Method of forming an electrical contact and method of forming a chi...

Coated wire

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire having a silver alloy core, wire bonding method using...

Light-emitting device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Chip package and method of forming a chip package with a metal cont...

Bonding wire for semiconductor device

Patents Applicationslast 30 patents

BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THI...

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

BONDING WIRE

PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, A...

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

COAXIAL WIRE

SEGMENTED SHIELDING USING WIREBONDS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

LIGHT EMITTING APPARATUS

WIRE BONDING SYSTEMS AND RELATED METHODS