Gold [Au] as principal constituent

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H01L2224/29444

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29444Gold [Au] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,024,439
- Issue date Jun 1, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,017,916
- Issue date May 25, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic assembly
- Patent number 10,672,690
- Issue date Jun 2, 2020
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, connected structure, and method for ma...
- Patent number 10,589,502
- Issue date Mar 17, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,546,831
- Issue date Jan 28, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film (ACF) and forming method thereof, ACF r...
- Patent number 10,510,708
- Issue date Dec 17, 2019
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 10,504,866
- Issue date Dec 10, 2019
- Kudko Chemical Co., Ltd.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic assembly with enhanced thermal dissipation
- Patent number 10,461,021
- Issue date Oct 29, 2019
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing anisotropically conductive film, anisotrop...
- Patent number 10,350,872
- Issue date Jul 16, 2019
- Dexerials Corporation
- Tomoyuki Ishimatsu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Mounting substrate and display device
- Patent number 10,353,253
- Issue date Jul 16, 2019
- SHARP KABUSHIKI KAISHA
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Semiconductor device and electronic device having the same
- Patent number 10,236,271
- Issue date Mar 19, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Yukie Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Anisotropic conductive film and connection structure
- Patent number 9,953,947
- Issue date Apr 24, 2018
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,865,558
- Issue date Jan 9, 2018
- Samsung SDI Co., Ltd.
- Young Ju Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,748,191
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY
- Publication number 20200020619
- Publication date Jan 16, 2020
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF) AND FORMING METHOD THEREOF, ACF R...
- Publication number 20190035760
- Publication date Jan 31, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180297154
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Electrically Conductive Film and Connection Structure
- Publication number 20180301432
- Publication date Oct 18, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION
- Publication number 20180247885
- Publication date Aug 30, 2018
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING SUBSTRATE AND DISPLAY DEVICE
- Publication number 20180004030
- Publication date Jan 4, 2018
- SHARP KABUSHIKI KAISHA
- Katsuhiro YAMAGUCHI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20170309590
- Publication date Oct 26, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...
- Publication number 20170271299
- Publication date Sep 21, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- HONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...
- Publication number 20170004901
- Publication date Jan 5, 2017
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20160345442
- Publication date Nov 24, 2016
- DEXERIALS CORPORATION
- Reiji TSUKAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20140319684
- Publication date Oct 30, 2014
- Yukie SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140312493
- Publication date Oct 23, 2014
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Packaged Device Comprising Non-Integer Lead Pitches and Method of M...
- Publication number 20140264798
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...
- Publication number 20140231983
- Publication date Aug 21, 2014
- Yuki SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140225144
- Publication date Aug 14, 2014
- DEXERIALS CORPORATION
- Hidetsugu NAMIKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179065
- Publication date Jun 26, 2014
- Kil Yong LEE
- G02 - OPTICS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid bonding structures and semiconductor devices including the same

Anisotropic conductive film and display device using the same

Multilayered transient liquid phase bonding

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Semiconductor device and a method of manufacturing the same

Particles, connecting material and connection structure

Particles, connecting material and connection structure

Bump-forming film, semiconductor device and manufacturing method th...

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film and production method of the same

Anisotropic electrically conductive film and connection structure

Conductive paste for bonding

Semiconductor device and a method of manufacturing the same

Engineered polymer-based electronic materials

Method for manufacturing an electronic assembly

Anisotropic conductive film, connected structure, and method for ma...

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film (ACF) and forming method thereof, ACF r...

Semiconductor device connected by anisotropic conductive film

Electronic assembly with enhanced thermal dissipation

Method for manufacturing anisotropically conductive film, anisotrop...

Mounting substrate and display device

Semiconductor device and electronic device having the same

Anisotropic conductive film and display device using the same

Semiconductor device and a method of manufacturing the same

Mounted substrate, mounted-substrate production method, and mounted...

Anisotropic conductive film and connection structure

Semiconductor device connected by anisotropic conductive film

Semiconductor device and a method of manufacturing the same

Patents Applicationslast 30 patents

Core-Shell Particle Die-Attach Material

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

ANISOTROPIC CONDUCTIVE FILM (ACF) AND FORMING METHOD THEREOF, ACF R...

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Anisotropic Electrically Conductive Film and Connection Structure

ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION

Conductive Paste For Bonding

MOUNTING SUBSTRATE AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...

FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

Anisotropic Conductive Adhesive with Reduced Migration

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

INTERCONNECT STRUCTURES WITH POLYMER CORE

Packaged Device Comprising Non-Integer Lead Pitches and Method of M...

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE