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Gold (Au) as principal constituent
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CPC
H01L2224/45444
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/45444
Gold (Au) as principal constituent
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last 30 patents
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Patent Grant
Semiconductor chip, semiconductor package and fabricating method th...
Patent number
9,620,460
Issue date
Apr 11, 2017
Samsung Electronics Co., Ltd.
Hyun-Pil Noh
H01 - BASIC ELECTRIC ELEMENTS