TREA

Grounding of printed circuits by connection to external grounding means

Follow

Industry

  • CPC
  • H05K1/0215
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0215Grounding of printed circuits by connection to external grounding means
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20240130035
    • Publication date Apr 18, 2024
    • FUJIFILM CORPORATION
    • Yota AKASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEATSINK BASED POWER DELIVERY FOR CPUS
    • Publication number 20240130033
    • Publication date Apr 18, 2024
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL DEVICE
    • Publication number 20240098881
    • Publication date Mar 21, 2024
    • MEIDENSHA CORPORATION
    • Shota SUZUKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS
    • Publication number 20240080979
    • Publication date Mar 7, 2024
    • Hitachi, Ltd
    • Goro HAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROSTATIC DISCHARGE PROTECTION ARRANGEMENT FOR FREQUENCY CONVERTER
    • Publication number 20240074128
    • Publication date Feb 29, 2024
    • Zhejiang Holip Electronic Technology Co., Ltd.
    • Yuedong LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND PRINTING APPARATUS
    • Publication number 20240023226
    • Publication date Jan 18, 2024
    • Canon Kabushiki Kaisha
    • Yo Kobayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY SUBSTRATE AND DISPLAY DEVICE
    • Publication number 20240015939
    • Publication date Jan 11, 2024
    • BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    • Yaya QI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OVERMOLDED PRINTED CIRCUIT BOARD AND CONNECTOR WITH INTEGRATED STAN...
    • Publication number 20230397346
    • Publication date Dec 7, 2023
    • Vitesco Technologies USA, LLC
    • David Poot Rodriguez
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
    • Publication number 20230397356
    • Publication date Dec 7, 2023
    • Japan Aviation Electronics Industry, Ltd.
    • Kenta OONISHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Crystal Oscillator Circuit On PCB, PCB And Server
    • Publication number 20230380051
    • Publication date Nov 23, 2023
    • INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD.
    • Liliang TIAN
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    SHIELD PRINTED WIRING BOARD EQUIPPED WITH GROUND MEMBER, AND GROUND...
    • Publication number 20230371168
    • Publication date Nov 16, 2023
    • Yuusuke HARUNA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEATSINK BASED POWER DELIVERY FOR CPUS
    • Publication number 20230337351
    • Publication date Oct 19, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CPU FOR HEATSINK BASED POWER DELIVERY
    • Publication number 20230337360
    • Publication date Oct 19, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTION STRUCTURE
    • Publication number 20230320014
    • Publication date Oct 5, 2023
    • Mitsubishi Electric Corporation
    • Yasushige MUKUNOKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE AND MEMORY SYSTEM
    • Publication number 20230309234
    • Publication date Sep 28, 2023
    • KIOXIA Corporation
    • Kazuyuki Niitsuma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHIELDED ELECTRONIC COMPONENT PACKAGE
    • Publication number 20230275061
    • Publication date Aug 31, 2023
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF TRANSFERRING HEAT FROM UNGROUNDED ELECTRONIC COMPONENTS
    • Publication number 20230269861
    • Publication date Aug 24, 2023
    • Skyworks Solutions, Inc.
    • Bhuvaneshwaran Vijayakumar
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRUCTURE AND STRUCTURE WITH ELECTRONIC COMPONENT
    • Publication number 20230247756
    • Publication date Aug 3, 2023
    • Murata Manufacturing Co., Ltd.
    • Kazunori TSUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...
    • Publication number 20230247773
    • Publication date Aug 3, 2023
    • HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    • Jianing Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...
    • Publication number 20230240021
    • Publication date Jul 27, 2023
    • HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    • Jianing Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND GROUNDING STRUCTURE THEREOF
    • Publication number 20230232526
    • Publication date Jul 20, 2023
    • Delta Electronics, Inc.
    • Jui-Ching Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20230225043
    • Publication date Jul 13, 2023
    • SAMSUNG DISPLAY CO., LTD.
    • Jaechun PARK
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
    • Publication number 20230171877
    • Publication date Jun 1, 2023
    • HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
    • Hao-Yi WEI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...
    • Publication number 20230067621
    • Publication date Mar 2, 2023
    • HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    • Jianing Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOW PIM COAX TO PCB INTERFACE
    • Publication number 20230058023
    • Publication date Feb 23, 2023
    • Telefonaktiebolaget LM Ericsson (publ)
    • Martin DA SILVEIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SCREW BOSS ASSEMBLY
    • Publication number 20230037468
    • Publication date Feb 9, 2023
    • Dell Products L.P.
    • Spike Tzeng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHTING DEVICE FOR A MOTOR VEHICLE
    • Publication number 20230017620
    • Publication date Jan 19, 2023
    • Valeo Vision
    • Franck DINANT
    • F21 - LIGHTING
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT
    • Publication number 20230019563
    • Publication date Jan 19, 2023
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Koji NITTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20220418089
    • Publication date Dec 29, 2022
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN MULTILAYER SUBSTRATE
    • Publication number 20220418103
    • Publication date Dec 29, 2022
    • Murata Manufacturing Co., Ltd.
    • Atsushi KASUYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR