GTO - Gate Turn-Off thyristor

Industry

CPC
H01L2924/1302

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1302GTO - Gate Turn-Off thyristor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
- Issue date Jan 16, 2024
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,569,178
- Issue date Jan 31, 2023
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,450,623
- Issue date Sep 20, 2022
- Fuji Electric Co., Ltd.
- Hideyo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,270,920
- Issue date Mar 8, 2022
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,201,121
- Issue date Dec 14, 2021
- Fuji Electric Co., Ltd.
- Kohei Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,031,345
- Issue date Jun 8, 2021
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBC structure using a support incorporating a phase change material
- Patent number 10,867,883
- Issue date Dec 15, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ulrich Soupremanien
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medical apparatus and X-ray high voltage apparatus
- Patent number 10,349,507
- Issue date Jul 9, 2019
- Toshiba Medical Systems Corporation
- Fumio Ishiyama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 10,236,244
- Issue date Mar 19, 2019
- Fuji Electric Co., Ltd.
- Keisuke Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with the integration of control circuit
- Patent number 9,887,183
- Issue date Feb 6, 2018
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical insulated gate turn-off thyristor with intermediate p+ lay...
- Patent number 9,806,152
- Issue date Oct 31, 2017
- Pakal Technologies LLC
- Hidenori Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer system for a semiconductor switching device
- Patent number 9,698,067
- Issue date Jul 4, 2017
- ABB Schweiz AG
- Thomas Stiasny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated gate bipolar transistor including emitter short regions
- Patent number 9,111,989
- Issue date Aug 18, 2015
- Infineon Technologies Austria AG
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor switching device with gate connection
- Patent number 8,519,433
- Issue date Aug 27, 2013
- ABB Research Ltd.
- Didier Cottet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,334,593
- Issue date Dec 18, 2012
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device package
- Patent number 8,114,712
- Issue date Feb 14, 2012
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213106
- Publication date Jun 27, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145322
- Publication date May 2, 2024
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055316
- Publication date Feb 15, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method
- Publication number 20230317684
- Publication date Oct 5, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20220157676
- Publication date May 19, 2022
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220051961
- Publication date Feb 17, 2022
- Fuji Electric Co., Ltd.
- Eri OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220020703
- Publication date Jan 20, 2022
- Fuji Electric Co., Ltd.
- Hideyo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210272909
- Publication date Sep 2, 2021
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20200058567
- Publication date Feb 20, 2020
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20200058592
- Publication date Feb 20, 2020
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180301422
- Publication date Oct 18, 2018
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBC STRUCTURE USING A SUPPORT INCORPORATING A PHASE CHANGE MATERIAL
- Publication number 20170103936
- Publication date Apr 13, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Ulrich SOUPREMANIEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacer System For A Semiconductor Switching Device
- Publication number 20160071815
- Publication date Mar 10, 2016
- ABB TECHNOLOGY AG
- Thomas Stiasny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Gate Bipolar Transistor Including Emitter Short Regions
- Publication number 20140291724
- Publication date Oct 2, 2014
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEDICAL APPARATUS AND X-RAY HIGH VOLTAGE APPARATUS
- Publication number 20140233708
- Publication date Aug 21, 2014
- KABUSHIKI KAISHA TOSHIBA
- Fumio ISHIYAMA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20120161325
- Publication date Jun 28, 2012
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Switching Device with Gate Connection
- Publication number 20100270584
- Publication date Oct 28, 2010
- ABB Research Ltd
- Didier Cottet
- H01 - BASIC ELECTRIC ELEMENTS

GTO - Gate Turn-Off thyristor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Method of forming integrated circuit package

Integrated circuit package and method of forming same

Semiconductor device

Integrated circuit package and method of forming same

Semiconductor device

Integrated circuit package and method of forming same

DBC structure using a support incorporating a phase change material

Electronics package having a multi-thickness conductor layer and me...

Integrated circuit package for assembling various dice in a single...

Medical apparatus and X-ray high voltage apparatus

Integrated circuit package for assembling various dice in a single...

Semiconductor device and production method therefor

Power overlay structure and reconstituted semiconductor wafer havin...

Power module with the integration of control circuit

Vertical insulated gate turn-off thyristor with intermediate p+ lay...

Spacer system for a semiconductor switching device

Power overlay structure having wirebonds and method of manufacturin...

Insulated gate bipolar transistor including emitter short regions

Chip package and a method for manufacturing a chip package

Semiconductor switching device with gate connection

Semiconductor device package

Method for fabricating a semiconductor device package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Power Semiconductor Module and Manufacturing Method

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

Integrated Circuit Package For Assembling Various Dice In A Single...

DBC STRUCTURE USING A SUPPORT INCORPORATING A PHASE CHANGE MATERIAL

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

Spacer System For A Semiconductor Switching Device

Insulated Gate Bipolar Transistor Including Emitter Short Regions

MEDICAL APPARATUS AND X-RAY HIGH VOLTAGE APPARATUS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

Semiconductor Switching Device with Gate Connection