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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83141Guiding structures both on and outside the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,990,447
- Issue date May 21, 2024
- Mitsubishi Electric Corporation
- Isao Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,211,355
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Isao Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 10,011,098
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,583,684
- Issue date Feb 28, 2017
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer including a molded wafer and a second wafer
- Patent number 9,354,388
- Issue date May 31, 2016
- Hewlett Packard Enterprise Development LP
- Michael Renne Ty Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making a low-Rdson vertical power MOSFET device
- Patent number 9,318,603
- Issue date Apr 19, 2016
- Alpha and Omega Semiconductor Incorporated
- Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
4D Device, process and structure
- Patent number 9,259,902
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Roy R. Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,209,369
- Issue date Dec 8, 2015
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,202,804
- Issue date Dec 1, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Connecting elements for producing hybrid electronic circuits
- Patent number 9,166,338
- Issue date Oct 20, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 9,087,778
- Issue date Jul 21, 2015
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,841,783
- Issue date Sep 23, 2014
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer including a molded wafer and a second wafer
- Patent number 8,822,275
- Issue date Sep 2, 2014
- Hewlett-Packard Development Company, L.P.
- Michael Renne Ty Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Grown carbon nanotube die attach structures, articles, devices, and...
- Patent number 8,753,924
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 8,746,538
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 8,736,045
- Issue date May 27, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembly of chips on a substrate
- Patent number 8,642,391
- Issue date Feb 4, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for making same
- Patent number 8,614,504
- Issue date Dec 24, 2013
- Hon Hai Precision Industry Co., Ltd.
- Kai-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20220013493
- Publication date Jan 13, 2022
- Mitsubishi Electric Corporation
- Isao OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20210202435
- Publication date Jul 1, 2021
- Mitsubishi Electric Corporation
- Isao OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER
- Publication number 20140334774
- Publication date Nov 13, 2014
- Michael Renne Ty Tan
- G02 - OPTICS
Information Patent Application
METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE
- Publication number 20140225185
- Publication date Aug 14, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140217156
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Aya MUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES
- Publication number 20140175477
- Publication date Jun 26, 2014
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY
- Publication number 20140084454
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER
- Publication number 20130286614
- Publication date Oct 31, 2013
- Michael Renne Ty Tan
- G02 - OPTICS
Information Patent Application
CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS
- Publication number 20130267113
- Publication date Oct 10, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Francois MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
- Publication number 20130234313
- Publication date Sep 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...
- Publication number 20130181339
- Publication date Jul 18, 2013
- Mars Technology
- Wenjun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130134210
- Publication date May 30, 2013
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND METHOD FOR MAKING SAME
- Publication number 20130049233
- Publication date Feb 28, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE
- Publication number 20130049100
- Publication date Feb 28, 2013
- Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120153462
- Publication date Jun 21, 2012
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
4D Process and Structure
- Publication number 20120129276
- Publication date May 24, 2012
- International Business Machines Corporation
- Wilfried Haensch
- B32 - LAYERED PRODUCTS
Information Patent Application
4D DEVICE PROCESS AND STRUCTURE
- Publication number 20110170266
- Publication date Jul 14, 2011
- IBM Corporation
- Wilfried Haensch
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING...
- Publication number 20110041332
- Publication date Feb 24, 2011
- Commissariat A L'Energie Atomique Et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY OF CHIPS ON A SUBSTRATE
- Publication number 20110033976
- Publication date Feb 10, 2011
- COMMISS. A L'ENERGIE ATOM ET AUX ENERG ALTERNA
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS

Guiding structures both on and outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective transfer of micro devices

Semiconductor device and power conversion device

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Four D device process and structure

Semiconductor device, method for manufacturing semiconductor device...

Four D device process and structure

Edge coupling alignment using embedded features

Composite wafer including a molded wafer and a second wafer

Method of making a low-Rdson vertical power MOSFET device

4D Device, process and structure

Edge coupling alignment using embedded features

Semiconductor device and method of manufacturing semiconductor device

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Connecting elements for producing hybrid electronic circuits

Interconnect structures for stacked dies, including penetrating str...

Joining method and semiconductor device manufacturing method

Semiconductor device and method of manufacturing semiconductor device

Composite wafer including a molded wafer and a second wafer

Grown carbon nanotube die attach structures, articles, devices, and...

Joining method and semiconductor device manufacturing method

Integrated bondline spacers for wafer level packaged circuit devices

Interconnect structures for stacked dies, including penetrating str...

Self-assembly of chips on a substrate

Chip package and method for making same

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER

METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY

COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER

CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...

MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

CHIP PACKAGE AND METHOD FOR MAKING SAME

METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

4D Process and Structure

4D DEVICE PROCESS AND STRUCTURE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING...

SELF-ASSEMBLY OF CHIPS ON A SUBSTRATE